公开(公告)号：US20190220066A1

公开(公告)日：2019-07-18

申请号：US16367684

申请日：2019-03-28

Applicant: Intel Corporation

Inventor： Arvind Sundaram ,  Samarth Alva ,  Yogesh Channaiah

IPC: G06F1/16 ,  G01R33/07 ,  G01D5/14

CPC classification number: G06F1/1681 ,  G01D5/145 ,  G01R33/072 ,  G06F1/1677

Abstract: Particular embodiments described herein provide for an electronic device that includes a first housing, a second housing, and a hinge. The hinge rotatably couples the first housing to the second housing and includes an off-center lobe that generates a field. The second housing includes a detection engine to detect a strength of the field generated by the off-center lobe and determines a hinge angle (or a position of the first housing relative to the second housing) based on the detected strength of the field generated by the off-center lobe.

公开(公告)号：US20190190237A1

公开(公告)日：2019-06-20

申请号：US16328121

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Arvind Sundaram ,  Ajay V. Bhatt

IPC: H01S5/40 ,  G02B6/293 ,  H01S5/00

CPC classification number: H01S5/4087 ,  G02B6/293 ,  H01S5/005

Abstract: An apparatus comprises a plurality of laser emitters each having a different center frequency; a plurality of photodiodes arranged to receive laser energy from the laser emitters via an air space; and a plurality of laser bandpass filters arranged between the plurality of laser emitters and the plurality of photodiodes, wherein each one of the photodiodes is arranged to receive laser energy respectively via one of the laser bandpass filters, and wherein each laser bandpass filter has one of the different center frequencies included in a passband of the laser bandpass filter and has the other of the different center frequencies excluded from the passband.

公开(公告)号：US20180287239A1

公开(公告)日：2018-10-04

申请号：US15473330

申请日：2017-03-29

Applicant: Intel Corporation

Inventor： Arvind Sundaram ,  Ramaswamy Parthasarathy ,  Vikas Mishra

IPC: H01P3/10 ,  H01P5/08 ,  G06F13/42 ,  G06F13/40

CPC classification number: G06F13/4068 ,  G06F13/4282 ,  H01P5/026 ,  H01P5/08 ,  Y02D10/14 ,  Y02D10/151

Abstract: A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.

公开(公告)号：US20180261545A1

公开(公告)日：2018-09-13

申请号：US15457102

申请日：2017-03-13

Applicant: Intel Corporation

Inventor： Arvind Sundaram

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/5389 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5385 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L29/2003 ,  H01L29/7786 ,  H01L2224/16153 ,  H01L2224/16235 ,  H01L2924/1306

Abstract: The present disclosure relates to devices and techniques for an interconnect bridge to communicatively couple two or more dies. In an example, the interconnect bridge can include a base element having a first material. A first layer, including a second material, can be attached to the base element. A second layer, including a third material, can be disposed on the first layer. A two-dimensional electron gas (2DEG) can be located between the first layer and the second layer. A first contact, adapted to electrically couple to the first die, can be disposed in a first side of the 2DEG. A second contact, adapted to electrically couple to the second die, can be disposed in a second side of the 2DEG. Accordingly, the first die can be electrically coupled to the second die through the 2DEG.

公开(公告)号：US20180241110A1

公开(公告)日：2018-08-23

申请号：US15440993

申请日：2017-02-23

Applicant: Intel Corporation

Inventor： Arvind Sundaram ,  Ramaswamy Parthasarathy ,  Vikas Mishra

IPC: H01P1/24 ,  H01R4/18 ,  H01R13/24 ,  H01F7/06 ,  H01P3/10 ,  H01P5/08

CPC classification number: H01P5/08 ,  H01P3/10 ,  H01R13/6461 ,  H01R13/6477

Abstract: Embodiments of the present disclosure provide an arrangement for single wire communications (SWC) for an electronic device. In one instance, the arrangement may comprise a cable assembly to connect with the electronic device, wherein the cable assembly may include a wire to conduct SWC and a cover portion to cover a portion of the wire. The cover portion may comprise a ferro-dielectric material. The arrangement may further include a control logic coupled with the cable assembly, to adjust characteristics associated with the ferro-dielectric material, to tune a signal termination impedance value associated with the cable assembly. Other embodiments may be described and/or claimed.

公开(公告)号：US20180191449A1

公开(公告)日：2018-07-05

申请号：US15476651

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Arvind Sundaram

IPC: H04B10/80 ,  H04B10/11

CPC classification number: H04B10/801 ,  H04B10/11 ,  H04B10/40

Abstract: A communication interface apparatus can include a free-air optical transceiver for communicating signals at a first speed and an electrical contact for communicating at least one of: signals at a second speed or power. The communication interface can include a substrate having a plurality of electrical circuits. The optical transceiver can be electrically coupled to the substrate and configured to transceive an optical signal in free air. In an example, the optical transceiver can convert the optical signal to the signal at the first speed, such as an electrical signal. In an example, the electrical contact can be communicatively coupled to the substrate. The electrical contact and the free-air optical transceiver can be attached to the substrate in fixed relation with respect to one another.