-
公开(公告)号：JPH1154935A
公开(公告)日：1999-02-26
申请号：JP21192797
申请日：1997-08-06
Applicant: NGK SPARK PLUG CO
Inventor： KODERA EIJI , SHIMOMURA TORU , TAGA SHIGERU
Abstract: PROBLEM TO BE SOLVED: To provide a junction structure of a conductor which can reduce connection failure even if an inner conductor and a surface conductor are different in composition. SOLUTION: A tip part 2a of an inner conductor (Ag) 2 is joined to a surface conductor (Ag-Pd) 31. That is, the tip part 2a of the inner conductor 2 (pattern width of 250 μm) is formed to overlap with a surface conductor 31 by 50 μm or more, for example, from a long side of a pattern width of 600 μm of the surface conductor 31, and the overlapping part is made a junction part 35. Especially, since the inner conductor 2 does not comprise Pd, difference of Pd concentration of the inner conductor 2 and the surface conductor 31 in the junction part 35 is in the range of 15 wt.% or less (5 wt.%, for example).
-
公开(公告)号：JPH1075031A
公开(公告)日：1998-03-17
申请号：JP24862996
申请日：1996-08-30
Applicant: NGK SPARK PLUG CO
Inventor： KASHIMA HISATO , TAGA SHIGERU
Abstract: PROBLEM TO BE SOLVED: To provide a ceramic circuit board which has a conductor film and a minute-area resistor film of precise dimensions formed on a ceramic board and also provide a manufacturing method thereof. SOLUTION: A ceramic circuit board is manufactured by screen-printing conductor paste and resistor paste on a ceramic green sheet 1a and baking them. At that time, a pair of dams 3a made of insulator paste are formed at an interval which is equal to the width of a resistor film to be formed from resistor paste, and then resistor paste is printed between the dams 3a and is baked. The resistor paste is prevented from bleeding in the width direction by a pair of the dams 3a and thereby the resistor film 4 of high dimensional accuracy can be formed. Especially, the thickness of the dams 3a are made smaller than that of the resistor film 4a, but not excessively smaller in the balance between the resistor film 4a and the dams 3a. Therefore, the resistor film 4 of high dimensional accuracy can be efficiently formed with good reproducibility.
-
公开(公告)号：JPH1051088A
公开(公告)日：1998-02-20
申请号：JP7455097
申请日：1997-03-10
Applicant: NGK SPARK PLUG CO
Inventor： KASHIMA HISATO , TAGA SHIGERU
IPC: C04B41/51 , C04B41/88 , H01L23/498 , H05K1/09 , H05K3/12
Abstract: PROBLEM TO BE SOLVED: To lessen the warp and transformation of a wiring board by making the shrinkage actions at baking of wiring material and ceramic material close ones, in a ceramic wiring board which is made by baking at low temperature, using low melting paint metal such as Ag, Pd, Au, or the like for its wiring material. SOLUTION: This ceramic wiring board has a metallized part which contains compounds of W and/or Mo by 3-5 pts.wt. in terms of metal and glass compositions by 1-10wt.pts. to 100 pts.wt. of metal for conductivity consisting of at least one kind out of Ag, Pd, Au, and Pt. In this case, the compounds of W are ones which contain WO3 or WSi2 , and the compounds of Mo are ones which contain MoSi2 .
-
公开(公告)号：JPH0831549A
公开(公告)日：1996-02-02
申请号：JP18885994
申请日：1994-07-19
Applicant: NGK SPARK PLUG CO
Inventor： MORITA NAOTOSHI , TAGA SHIGERU
Abstract: PURPOSE:To obtain a creeping corona discharge element which is small in the quantity of a nitrogen oxide generated and has high mechanical strength. CONSTITUTION:A filamentary discharge electrode 4 is formed on the surface of a laminar substrate 1 formed out of mullite ceramic, and a planar induction electrode 3 is then buried in the substrate 1 so that the filamentary discharge electrode 4 and the planar induction electrode 3 can be faced to each other via the substrate 1. A composition of the mullite ceramic consists of mullite as its main element and an insulator containing 10 to 40wt.% of Al2O3-SiO2-MgO group glass.
-
公开(公告)号：JPH06283846A
公开(公告)日：1994-10-07
申请号：JP9227493
申请日：1993-03-24
Applicant: NGK SPARK PLUG CO
Inventor： TAGA SHIGERU , KIMURA YUKIHIRO
Abstract: PURPOSE:To provide a wiring board having via which is excellent in the connection between a conductive post and a surface wiring and suitable for fine patterning of surface wiring. CONSTITUTION:The inventive method comprises step (a) for preparing a ceramic board internally provided with a conductor post, step (b) for preparing a photosensitive glass paste containing glass frit and photosensitive agent, step (c) for coating the surface of the ceramic substrate with the photosensitive glass paste, step (d) for partially removing the photosensitive glass paste through exposure and development to expose at least one end face of the conductor post, and step (e) for heating the remaining photosensitive glass paste and baking the paste onto the ceramic board thus forming a dielectric film.
-
Patent Agency Ranking
公开(公告)号：JP2012085234A
公开(公告)日：2012-04-26
申请号：JP2010231957
申请日：2010-10-14
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： TAKAGI KEIJI , ICHIKAWA JUNICHI , TAGA SHIGERU
Abstract: PROBLEM TO BE SOLVED: To provide a transmission system capable of performing efficient transmission between a pair or resonance elements that are arranged proximally.SOLUTION: In a transmission system, a resonance element 10 included in each transmission device has: a resonance electrode 12 formed on one side of a dielectric substrate 11; a ground electrode 13 formed on the other side of the dielectric substrate 11; and a via conductor 14 and an input and output electrode 16 that serve as a feeding part. When a high-frequency signal is transmitted between a transmission device including a transmission circuit and a transmission device including a reception circuit, the resonance electrodes 12 of the respective resonance elements 10 are arranged so as to be directly opposed to each other at a predetermined distance, and a high frequency signal can be transmitted between the two transmission devices by electric field coupling at the time.
Abstract translation: 要解决的问题：提供能够在近端布置的一对或谐振元件之间执行有效传输的传输系统。 解决方案：在传输系统中，每个传输装置中包括的谐振元件10具有形成在电介质基板11的一侧上的谐振电极12; 形成在电介质基板11的另一侧的接地电极13; 通孔导体14和用作馈电部分的输入和输出电极16。 当在包括发送电路的发送装置和包括接收电路的发送装置之间发送高频信号时，各个谐振元件10的谐振电极12被布置成以预定距离彼此直接相对 并且可以通过当时的电场耦合在两个传输设备之间传输高频信号。 版权所有（C）2012，JPO＆INPIT
-
公开(公告)号：JP2011165945A
公开(公告)日：2011-08-25
申请号：JP2010027683
申请日：2010-02-10
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： TAKAHASHI HIROYUKI , KATO TATSUYA , YAMADA TOMOHIDE , TAGA SHIGERU
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate, capable of suppressing the occurrence of cracks near an interlayer connecting conductor section, preventing the destruction of a substrate, and enhancing the bonding strength of a protruding member, and to provide a method for producing the substrate.
SOLUTION: The distance Z between the circumscribed circle of a brazing material layer 59, in the circumference of the bottom surface of a stud 23 and the area center of a via 55 disposed around a surface metal layer 57 on the top-surface low-temperature baking ceramic layer, is not less than 2.5 mm. Centered about the area center of the bottom surface of the stud 23, the difference (ML-RL) between the radial length ML of the surface metal layer 57 and the same radial length RL of the bottom surface of the brazing material layer 59 is not less than 0.65 mm, all around the circumference of the stud 23. Centered about the area center of the bottom surface of the stud 23, the ratio (VL/SL) between a radial length VL up to the area center of a via 55 closest to the stud 23 and the same radial length SL of the bottom surface of the stud 23 is from 1.6 to 2.0.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 解决的问题：为了提供能够抑制层间连接导体部附近的裂纹的发生的多层陶瓷基板，防止基板的破坏，提高突出部件的接合强度， 制造基板的方法。 解决方案：钎焊材料层59的外接圆之间的距离Z，在螺柱23的底表面的圆周和通孔55的位于顶表面的表面金属层57周围的区域中心 低温烘烤陶瓷层，不小于2.5毫米。 以螺柱23的底面的区域中心为中心，表面金属层57的径向长度ML与钎料层59的底面的径向长度RL之间的差（ML-RL）不是 小于0.65mm，全部在螺柱23的圆周周围。以螺柱23的底面的区域中心为中心，径向长度VL与通孔55的最接近的区域中心之间的比（VL / SL） 螺柱23的底面的相同径向长度SL为1.6〜2.0。 版权所有（C）2011，JPO＆INPIT
-
公开(公告)号：JP2011147090A
公开(公告)日：2011-07-28
申请号：JP2010008583
申请日：2010-01-18
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： ICHIKAWA JUNICHI , TAKAGI KEIJI , TAGA SHIGERU
Abstract: PROBLEM TO BE SOLVED: To provide a stacked multiplexer which attains compatibility between miniaturization and performance by configuring an output-side circuit of a predetermined filter circuit while including an inductor formed from a terminal electrode of a stack.
SOLUTION: A stacked multiplexer is formed into a stack, and filter circuits 11, 12, 13 with a plurality of frequency bands as pass bands, respectively, include a common terminal Ta and a plurality of individual terminals T1, T2, T3. Among these filter circuits, the filter circuit 13 includes a distributed constant circuit including resonators Lc, Ld and a centralized constant circuit including a capacitor C32 and a series resonant circuit 13a. An inductor L32 included in the series resonant circuit 13a is formed from a terminal electrode formed in the stack by drawing in a stacking direction, one end of the terminal electrode is connected to a ground potential and the other end thereof is connected to a capacitor C35.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：提供一种层叠多路复用器，通过配置预定滤波器电路的输出侧电路，同时包括由堆叠的端子电极形成的电感器，从而实现小型化和性能之间的兼容性。 解决方案：堆叠多路复用器形成为堆叠，并且具有作为通带的多个频带的滤波器电路11,12,13分别包括公共端子Ta和多个单独端子T1，T2，T3 。 在这些滤波器电路中，滤波电路13包括包含谐振器Lc，Ld的分布常数电路和包括电容器C32和串联谐振电路13a的集中恒定电路。 包括在串联谐振电路13a中的电感器L32由层叠方向上形成的端子电极形成，端子电极的一端与接地电位连接，另一端与电容器C35连接 。 版权所有（C）2011，JPO＆INPIT
-
公开(公告)号：JP2010141859A
公开(公告)日：2010-06-24
申请号：JP2008319021
申请日：2008-12-15
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： TAKAGI KEIJI , ICHIKAWA JUNICHI , TAGA SHIGERU
Abstract: PROBLEM TO BE SOLVED: To provide a diplexer and the like provided with a band pass filter having an excellent attenuation characteristic at a low-frequency side of a passband.
SOLUTION: The diplexer 10 includes: a band pass filter 11 connected between a common terminal T0 and a first terminal T1 with a first frequency band as a passband; and a band pass filter 12 composed of a high-pass filter 12a and a low-pass filter 12b connected in series between the common terminal T0 and a second terminal T2 with a second frequency band as a passband. The high-pass filter 12a includes: capacitors C20, C21 connected in series between the common terminal T0 and an output node Na, an inductor L20 connected between a connecting point of these capacitors C20 and C21 and a ground; and a notch circuit (inductor L21 and capacitor C22) connected between the output node Na and the ground. The high-pass filter 12a is effective for enhancing an attenuation characteristic at a low-frequency side of the passband, in particular.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供一种在通带的低频侧具有优异的衰减特性的带通滤波器的双工器等。 解决方案：双工器10包括：带通滤波器11，其连接在公共端子T0和第一端子T1之间，第一频带作为通带; 以及由公共端子T0和第二端子T2串联连接的第二频带作为通带的高通滤波器12a和低通滤波器12b构成的带通滤波器12。 高通滤波器12a包括串联连接在公共端子T0和输出节点Na之间的电容器C20，C21，连接在这些电容器C20和C21的连接点与地之间的电感器L20; 以及连接在输出节点Na和地之间的陷波电路（电感器L21和电容器C22）。 高通滤波器12a尤其对于提高通带低频侧的衰减特性是有效的。 版权所有（C）2010，JPO＆INPIT
-
50.发明专利
公开(公告)号：JP2009004515A
公开(公告)日：2009-01-08
申请号：JP2007163082
申请日：2007-06-20
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： FUJII KAZUYUKI , TOSA AKIBUMI , TAGA SHIGERU
Abstract: PROBLEM TO BE SOLVED: To provide a ceramic wiring board in which flotation, and the like, of lead in a ball shape on a surface of wiring is suppressed, and to provide a manufacturing method of such a ceramic wiring board. SOLUTION: The ceramic wiring board 1 has a ceramic insulator 11 (made of alumina etc.) and the wiring 12 provided on the surface thereof and/or in it, and the wiring contains copper, tungsten particles etc., and metal compound particles (alumina particles etc.), wherein the metal compound particle has an average particle size of ≤500 nm and the wiring contains 25 to 65 parts by mass of copper and 35 to 75 parts by mass of tungsten particles. The manufacturing method of the ceramic wiring board is characterized in that each of a plurality of unbaked ceramic sheets (alumina sheets etc.) has at least one surface coated with conductive paste containing copper powder, tungsten powder etc., and metal compound powder (alumina powder etc.) of ≤150 nm in average particle size, and are layered and then baked. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种陶瓷布线板，其中抑制了布线表面上的球形铅的浮选等，并提供了这种陶瓷布线板的制造方法。 ＆lt; P＆gt;解决方案：陶瓷布线板1具有陶瓷绝缘体11（由氧化铝等制成）和布置在其表面和/或其上的布线12，布线包含铜，钨颗粒等，金属 复合粒子（氧化铝粒子等），其中金属化合物粒子的平均粒径≤500nm，配线中含有25〜65质量份的铜和35〜75质量份的钨粒子。 陶瓷布线板的制造方法的特征在于，多个未烘烤陶瓷片（氧化铝片等）中的至少一个表面涂覆有包含铜粉末，钨粉末等的导电膏和金属化合物粉末（氧化铝 粉末等），平均粒径≤150nm，层叠后烘烤。 版权所有（C）2009，JPO＆INPIT
-
-
-
-
-
-
-
-
-
Search Results
59
records
(took 0.033 seconds)
