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    6.
    发明专利
    未知

    公开(公告)号：DE69919806T2

    公开(公告)日：2005-09-15

    申请号：DE69919806

    申请日：1999-10-28

    Applicant: NGK SPARK PLUG CO

    Inventor： KODERA EIJI ,  NAGURA HITOSHI ,  SATO HIRONORI ,  TAGA SHIGERU

    IPC: H01L23/498 ,  H05K1/09 ,  H05K3/40

    Abstract: A ceramic printed circuit substrate includes a glass ceramic substrate (14a, 14b, 20a, 20b, 20c, 22) and a surface circuit pattern (14a, 14b, 20a, 20b, 20c, 22), which is formed on the substrate by use of a conductive paste. The conductive paste contains conductive components of silver and platinum and filler components of molybdenum, tungsten, manganese dioxide, silicon dioxide, and copper oxide. A ceramic green sheet (30) and a surface circuit pattern (32) formed thereon by use of the conductive paste are simultaneously fired at a temperature not higher than 1000 DEG C, thereby yielding the ceramic printed circuit substrate.

    8.
    发明专利
    未知

    公开(公告)号：DE69919806D1

    公开(公告)日：2004-10-07

    申请号：DE69919806

    申请日：1999-10-28

    Applicant: NGK SPARK PLUG CO

    Inventor： KODERA EIJI ,  NAGURA HITOSHI ,  SATO HIRONORI ,  TAGA SHIGERU

    IPC: H01L23/498 ,  H05K1/09 ,  H05K3/40

    Abstract: A ceramic printed circuit substrate includes a glass ceramic substrate (14a, 14b, 20a, 20b, 20c, 22) and a surface circuit pattern (14a, 14b, 20a, 20b, 20c, 22), which is formed on the substrate by use of a conductive paste. The conductive paste contains conductive components of silver and platinum and filler components of molybdenum, tungsten, manganese dioxide, silicon dioxide, and copper oxide. A ceramic green sheet (30) and a surface circuit pattern (32) formed thereon by use of the conductive paste are simultaneously fired at a temperature not higher than 1000 DEG C, thereby yielding the ceramic printed circuit substrate.

    Multilayer ceramic substrate and method for manufacturing the same
    9.
    发明专利
    Multilayer ceramic substrate and method for manufacturing the same 有权
    多层陶瓷基板及其制造方法

    公开(公告)号：JP2010098049A

    公开(公告)日：2010-04-30

    申请号：JP2008266318

    申请日：2008-10-15

    Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

    Inventor： NISHIWAKI HIDEKI ,  KATO TATSUYA ,  TAKAHASHI HIROYUKI ,  TAGA SHIGERU

    IPC: H05K3/46 ,  C04B35/18 ,  H01L21/66

    Abstract: PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate and a method for manufacturing the substrate which has sufficient dimensional accuracy, regarding a pad on a wafer, and which also can prevent fusion with a burning setter at burning. SOLUTION: In the multilayer ceramic substrate 1 having ceramics with mullite being a main crystal thereof, mullite content is 93-99 mass% of the ceramic component, at least one type of Mg and Y is contained as a component other than the mullite; and also at least one type of W and Mo is contained inside the multilayer ceramic substrate as a component of a conductive layer. Furthermore, an average thermal expansion coefficient at -50 to 150°C is 3.0-4.0 ppm/°C, and the thermal expansion coefficient α1 of each temperature between -50°C and 150°C and the thermal expansion coefficient α2 of Si, at the same temperature, have the relation: 0 ppm COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：关于晶片上的焊盘，提供一种具有足够的尺寸精度的多层陶瓷基板和用于制造基板的方法，并且还可以防止燃烧时与燃烧装置的熔合。 解决方案：在具有以莫来石为主体的陶瓷的多层陶瓷基板1中，莫来石含量为陶瓷成分的93〜99质量％，作为除了所述陶瓷成分以外的成分，含有至少一种Mg和Y 莫来石; 并且至少一种类型的W和Mo被包含在作为导电层的组分的多层陶瓷衬底内。 此外，-50〜150℃的平均热膨胀系数为3.0〜4.0ppm /℃，各温度在-50℃〜150℃的热膨胀系数α1和Si的热膨胀系数α2， 在相同的温度下，具有以下关系：0ppm <（α1-α2）≤2.5ppm。 版权所有（C）2010，JPO＆INPIT

    Ceramic wiring board and manufacturing method of the ceramic wiring board
    10.
    发明专利
    Ceramic wiring board and manufacturing method of the ceramic wiring board 有权
    陶瓷接线板和陶瓷接线板的制造方法

    公开(公告)号：JP2009004516A

    公开(公告)日：2009-01-08

    申请号：JP2007163083

    申请日：2007-06-20

    Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

    Inventor： FUJII KAZUYUKI ,  TOSA AKIBUMI ,  TAGA SHIGERU

    IPC: H05K3/46 ,  H05K1/09

    Abstract: PROBLEM TO BE SOLVED: To provide a ceramic wiring board which has wirings for electric circuit of low resistance and wirings for mounting with ample mounting strength, and to provide a manufacturing method of such a ceramic wiring board. SOLUTION: The ceramic wiring board 1 has: a ceramic insulator 11 (made of an alumina insulator etc.); the wiring 121 for electric circuit ( wiring for signal transmission etc.) which contains copper, tungsten particles etc., and metal compound particles (alumina particles etc.), the wiring containing 25 to 65 parts by mass of copper and 35 to 75 parts by mass of tungsten particles for 100 parts by mass of the total of the copper and tungsten particles etc.; and the wiring 122 for mounting which contains copper, tungsten particles etc., and particles of ceramic (particles of alumina etc.) of the same kind with the ceramic constituting the ceramic insulator, the average particle size of the ceramic particles being larger than the average particle size of the metal compound particles. Further, the manufacturing method of the ceramic wiring board is provided which is a manufacturing method of the above wiring board and which includes specified steps. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种陶瓷布线板，其具有用于具有低电阻的电路的布线和用于安装的布线，具有足够的安装强度，并且提供这种陶瓷布线板的制造方法。 ＆lt; P＆gt;解决方案：陶瓷布线板1具有：陶瓷绝缘体11（由氧化铝绝缘体等构成）。 包含铜，钨颗粒等的电路布线（信号传输线等）和金属化合物颗粒（氧化铝颗粒等），布线包含25至65质量份的铜和35至75份 的钨粒子为100质量份的铜和钨粒子等的总量; 以及与构成陶瓷绝缘子的陶瓷相同种类的陶瓷（氧化铝等）的陶瓷（氧化铝等）的颗粒，陶瓷粒子的平均粒径大于 金属化合物颗粒的平均粒径。 此外，提供了陶瓷布线板的制造方法，其是上述布线板的制造方法，其包括特定步骤。 版权所有（C）2009，JPO＆INPIT

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