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    Probe head and probe card having same
    42.
    发明授权
    Probe head and probe card having same 有权

    公开(公告)号：US11543432B2

    公开(公告)日：2023-01-03

    申请号：US17211812

    申请日：2021-03-24

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: G01R1/067 ,  G01R1/073

    Abstract: Proposed are a probe head and a probe card having the same. The probe head includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; an intermediate guide plate having an intermediate guide hole, and provided between the upper guide plate and the lower guide plate; and a guide member provided at a side of the intermediate guide plate, wherein the intermediate guide plate is limited in movement by the guide member.

    Micro LED transfer head
    44.
    发明授权
    Micro LED transfer head 有权

    公开(公告)号：US11342207B2

    公开(公告)日：2022-05-24

    申请号：US16989431

    申请日：2020-08-10

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01L21/67 ,  B65G47/91 ,  H01L21/683 ,  H01L25/16

    Abstract: A micro LED transfer head is proposed. The micro LED transfer head includes: a holding member including a holding region that holds a micro LED by means of vacuum holding force and a non-holding region that does not hold the micro LED; and a porous member provided on top of the holding member and having arbitrary pores, wherein the holding region includes: a first holding region; and a second holding region provided above the first holding region, formed to have a larger opening area than the first holding region, and communicating with the first holding region and the porous member, whereby the micro LED transfer head selectively transfers the micro LED.

    Transfer head
    48.
    发明授权
    Transfer head 有权

    公开(公告)号：US10889009B2

    公开(公告)日：2021-01-12

    申请号：US16551566

    申请日：2019-08-26

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: B25J15/06 ,  B25J7/00 ,  H01L33/00

    Abstract: The present invention relates to a transfer head gripping and transferring micro LEDs from a first substrate to a second substrate. More particularly, the present invention relates to a transfer head gripping and transferring micro LEDs in a batch manner without any error even when there is a height difference of the micro LEDs.

    Micro LED structure and method of manufacturing same
    49.
    发明授权
    Micro LED structure and method of manufacturing same 有权

    公开(公告)号：US10707394B2

    公开(公告)日：2020-07-07

    申请号：US16235706

    申请日：2018-12-28

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

    Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

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