公开(公告)号：EP2981507B1

公开(公告)日：2018-06-20

申请号：EP14778389.8

申请日：2014-04-02

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  MAO, Bifeng ,  MIAO, Weifeng

IPC: C09D11/02 ,  H01B5/14 ,  B01J37/04 ,  C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  C23C18/18 ,  C01G37/00 ,  C01G39/00 ,  C01G49/00 ,  C01G15/00 ,  C09D11/10 ,  C09D11/322 ,  B01J37/08 ,  B01J23/00 ,  B01J23/887 ,  B01J35/02 ,  B01J23/825 ,  B01J37/34 ,  B01J31/06 ,  B01J23/86

CPC classification number: C09D11/322 ,  B01J23/002 ,  B01J23/825 ,  B01J23/868 ,  B01J23/8874 ,  B01J23/8878 ,  B01J31/06 ,  B01J35/023 ,  B01J37/0036 ,  B01J37/04 ,  B01J37/08 ,  B01J37/349 ,  B01J2523/00 ,  C01G15/006 ,  C01G37/006 ,  C01G39/006 ,  C01G49/009 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/60 ,  C01P2006/80 ,  C09D11/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0709 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/125 ,  B01J2523/17 ,  B01J2523/31 ,  B01J2523/67 ,  B01J2523/32 ,  B01J2523/842 ,  B01J2523/33 ,  B01J2523/68

Abstract: The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0

公开(公告)号：EP2951134B1

公开(公告)日：2018-01-24

申请号：EP14746818.5

申请日：2014-01-24

Applicant: BYD Company Limited

Inventor： ZHAO, Yanshuai ,  ZHOU, Wei

IPC: C04B35/468 ,  C04B35/622 ,  C01G23/00 ,  C04B35/626 ,  C04B35/462 ,  C04B35/64 ,  C04B35/634 ,  H01C7/00 ,  H01C7/02 ,  H01C17/065 ,  C04B35/653

CPC classification number: H01C7/023 ,  C01G23/006 ,  C04B35/462 ,  C04B35/4682 ,  C04B35/6261 ,  C04B35/62685 ,  C04B35/62695 ,  C04B35/63416 ,  C04B35/64 ,  C04B35/653 ,  C04B2235/32 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3232 ,  C04B2235/3236 ,  C04B2235/34 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/449 ,  C04B2235/5427 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/785 ,  H01C7/008 ,  H01C7/025 ,  H01C17/06533

Abstract: A thermistor material and a method for preparing a thermistor material are provided. The thermistor material is prepared by mixing and heating a mixture containing BaTiO3, B2O3, SiO2, Li2O, P2O5, Cs2O, Nd2O3, Al2O3 and TiO2.

公开(公告)号：EP3188908A1

公开(公告)日：2017-07-12

申请号：EP15838426.3

申请日：2015-06-05

Applicant: BYD Company Limited

Inventor： ZHOU, Wei ,  MAO, Bifeng

IPC: B32B27/06 ,  B32B27/16 ,  B32B15/08 ,  C23C18/20

CPC classification number: C23C18/1612 ,  B01J23/20 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/0072 ,  B01J37/08 ,  C08K3/22 ,  C08K9/02 ,  C08K2003/2231 ,  C08L77/06 ,  C09D11/03 ,  C09D11/10 ,  C09D11/102 ,  C09D11/322 ,  C09D11/38 ,  C09D11/52 ,  C09D167/02 ,  C09D169/00 ,  C09D177/10 ,  C23C18/1608 ,  C23C18/1633 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1655 ,  C23C18/1893 ,  C23C18/20 ,  C23C18/204 ,  C23C18/2066 ,  C23C18/40 ,  C25D3/12 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0709 ,  H05K2203/107

Abstract: Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.

Abstract translation: 提供一种掺杂的氧化锡，其可以在用于选择性地金属化绝缘基板的表面的方法中用作化学镀敷促进剂。 还提供了一种聚合物组合物，其包含掺杂的氧化锡，聚合物成型体，油墨组合物以及用于选择性地金属化绝缘基板表面的方法。 掺杂的氧化锡具有浅色，并且在其预设时不干扰衬底的颜色。 掺杂的氧化锡具有很强的促进化学镀的能力。 使用所公开的掺杂氧化锡作为化学镀促进剂，可以以高镀速形成连续金属层，同时增强金属层和绝缘基板之间的粘合性。

公开(公告)号：EP2981507A1

公开(公告)日：2016-02-10

申请号：EP14778389.8

申请日：2014-04-02

Applicant: BYD Company Limited

Inventor： GONG, Qing ,  ZHOU, Wei ,  MAO, Bifeng ,  MIAO, Weifeng

IPC: C01G3/02 ,  C23C18/00 ,  C09D11/02 ,  H01B5/14

CPC classification number: C09D11/322 ,  B01J23/002 ,  B01J23/825 ,  B01J23/868 ,  B01J23/8874 ,  B01J23/8878 ,  B01J31/06 ,  B01J35/023 ,  B01J37/0036 ,  B01J37/04 ,  B01J37/08 ,  B01J37/349 ,  B01J2523/00 ,  C01G15/006 ,  C01G37/006 ,  C01G39/006 ,  C01G49/009 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/60 ,  C01P2006/80 ,  C09D11/10 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1879 ,  C23C18/204 ,  C23C18/206 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0709 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/125 ,  B01J2523/17 ,  B01J2523/31 ,  B01J2523/67 ,  B01J2523/32 ,  B01J2523/842 ,  B01J2523/33 ,  B01J2523/68

Abstract: The present disclosure provides a metal compound. The metal compound is represented by a formula(I): Cu
2 A
α B
2-α O
4-β . A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group13 of the periodic table, 0

公开(公告)号：EP2951134A1

公开(公告)日：2015-12-09

申请号：EP14746818.5

申请日：2014-01-24

Applicant: BYD Company Limited

Inventor： ZHAO, Yanshuai ,  ZHOU, Wei

IPC: C04B35/468 ,  C04B35/622

CPC classification number: H01C7/023 ,  C01G23/006 ,  C04B35/462 ,  C04B35/4682 ,  C04B35/6261 ,  C04B35/62685 ,  C04B35/62695 ,  C04B35/63416 ,  C04B35/64 ,  C04B35/653 ,  C04B2235/32 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3232 ,  C04B2235/3236 ,  C04B2235/34 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/449 ,  C04B2235/5427 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/785 ,  H01C7/008 ,  H01C7/025 ,  H01C17/06533

Abstract: A thermistor material and a method for preparing a thermistor material are provided. The thermistor material is prepared by mixing and heating a mixture containing BaTiO
3 , B
2 O
3 , SiO
2 , Li
2 O, P
2 O
5 , Cs
2 O, Nd
2 O
3 , Al
2 O
3 and TiO
2 .

公开(公告)号：EP2935644A1

公开(公告)日：2015-10-28

申请号：EP13866340.6

申请日：2013-12-11

Applicant: BYD Company Limited

Inventor： ZHOU, Wei ,  SUN, Yongliang

IPC: C23C14/35 ,  C23C14/06

CPC classification number: C23C14/35 ,  C03C17/009 ,  C03C23/0075 ,  C03C2217/43 ,  C03C2217/76 ,  C03C2218/156 ,  C03C2218/31 ,  C23C14/0057 ,  C23C14/022 ,  C23C14/06 ,  C23C14/0694 ,  C23C14/12 ,  C23C14/3414 ,  G02B1/111 ,  G02B1/14 ,  G02B1/18

Abstract: A film and a method for preparing the film are provided. A substrate is provided, and a film is formed on at least a part of a surface of the substrate by magnetron sputtering a target under a protective gas and a reactive gas. The target includes polytetrafluoroethylene and magnesium fluoride, and the reactive gas includes at least one selected from a group consisting of CF
4 and SiF
4 .

公开(公告)号：EP3189097B1

公开(公告)日：2020-03-11

申请号：EP15837858.8

申请日：2015-06-05

Applicant: BYD Company Limited

Inventor： ZHOU, Wei ,  MAO, Bifeng

IPC: C08K3/22 ,  C23C18/06 ,  C23C18/20 ,  C08L77/06 ,  C08L69/00 ,  C08L67/02

公开(公告)号：EP3189097A1

公开(公告)日：2017-07-12

申请号：EP15837858.8

申请日：2015-06-05

Applicant: BYD Company Limited

Inventor： ZHOU, Wei ,  MAO, Bifeng

IPC: C08K3/22 ,  C23C18/06 ,  C23C18/20 ,  C08L77/06 ,  C08L69/00 ,  C08L67/02

Abstract: A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about −5 to about 5, and a coordinate b value of about −5 to about 5 in a CIELab color space.

Abstract translation: 提供一种掺杂的氧化锡，其可以在用于选择性地金属化绝缘基板的表面的方法中用作化学镀敷促进剂。 还提供了一种聚合物组合物，其包含掺杂的氧化锡，聚合物成型体，油墨组合物以及用于选择性地金属化绝缘基板表面的方法。 掺杂的氧化锡具有浅色，并且在其预设时不干扰衬底的颜色。 掺杂的氧化锡具有很强的促进化学镀的能力。 使用所公开的掺杂氧化锡作为化学镀促进剂，可以以高镀速形成连续金属层，同时增强金属层和绝缘基板之间的粘合性。