公开(公告)号：EP2054896B1

公开(公告)日：2012-06-13

申请号：EP07813508.4

申请日：2007-07-29

Applicant: Shocking Technologies, Inc.

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H01B1/24

CPC classification number: H01B1/24 ,  H01L51/0037 ,  H01L51/0081

Abstract: One or more embodiments provide for a composition that includes (i) organic material that is conductive or semi-conductive, and (ii) conductor and/or semiconductor particles other than the organic material. The organic material and the conductor and/or semiconductor particles are combined to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

公开(公告)号：EP2412212A1

公开(公告)日：2012-02-01

申请号：EP10713274.8

申请日：2010-03-25

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  GRAYDON, Bhret

IPC: H05K1/02 ,  H01C7/12 ,  H05K1/16

CPC classification number: H05K1/0257 ,  H01C1/142 ,  H01C1/148 ,  H01C7/1006 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0738

Abstract: Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event (e.g,. shunting current to ground). Some aspects include gaps having a gap width that is greater than 50% of a spacing between electrical leads connected to the pads. Some devices include single layers of VSDM. Some devices include multiple layers of VSDM. Various devices may be designed to increase a ratio of active volume (of VSDM) to inactive volume.

公开(公告)号：EP2389410A1

公开(公告)日：2011-11-30

申请号：EP10702373.1

申请日：2010-01-22

Applicant: Shocking Technologies Inc

Inventor： FLEMING, Robert ,  SHI, Ning ,  SARAF, Pragnya

IPC: C08K3/00

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0738

Abstract: A binder for VSD composition is selected to have enhanced electron mobility in presence of high electric fields.

公开(公告)号：EP2351053A1

公开(公告)日：2011-08-03

申请号：EP09752036.5

申请日：2009-10-30

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  SHI, Ning

IPC: H01C7/12

CPC classification number: H01C7/12 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/115 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/09736 ,  H05K2201/09781

Abstract: A substrate device includes a layer of non-linear resistive transient protective material and a plurality of conductive elements that form part of a conductive layer. The conductive elements include a pair of electrodes that are spaced by a gap, but which electrically interconnect when the transient protective material is conductive. The substrate includes features to linearize a transient electrical path that is formed across the gap.

公开(公告)号：EP2329693A1

公开(公告)日：2011-06-08

申请号：EP09791586.2

申请日：2009-08-17

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H05K1/02

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/4688 ,  H05K2201/0738 ,  H05K2201/09318 ,  Y10T428/24802 ,  Y10T428/31504

Abstract: A core layer structure is provided for substrate and packed devices. The core layer structure includes a first layer, a second layer combined with the first layer. A layer of voltage switchable dielectric (VSD) material provided in between the first layer and second layer.