公开(公告)号：US20200176659A1

公开(公告)日：2020-06-04

申请号：US16206498

申请日：2018-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Henry Litzmann Edwards

IPC: H01L35/30 ,  H01L35/32 ,  H01L27/16 ,  H03K17/567 ,  H03K17/689 ,  H03K17/605

Abstract: A system on an integrated circuit (IC) chip includes an input terminal and a return terminal. A heater coupled between the input terminal and the return terminal. A thermopile is spaced apart from the heater by a galvanic isolation region. A switch device includes a control input coupled to an output of the thermopile. The switch device is coupled to at least one output terminal of the IC chip.

公开(公告)号：US20200043828A1

公开(公告)日：2020-02-06

申请号：US16055395

申请日：2018-08-06

Applicant: Texas Instruments Incorporated

Inventor： Peter Smeys ,  Ting-Ta Yen ,  Barry Jon Male ,  Paul Merle Emerson

IPC: H01L23/433 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

Abstract: Described examples include microelectronic devices and integrated circuits with an active first circuit in a first segment of a first wafer, a second circuit in a second segment of the first wafer, and second and third wafers bonded to different surfaces of the first wafer to provide first and second cavities with surfaces spaced from the first segment. An opening extends through the first wafer between the first and second cavities to separate portions of the first and second segments and to form a sealed cavity that surrounds the first segment. A bridge segment of the first wafer supports the first segment in the sealed cavity and includes one or more conductive structures to electrically connect the first and second circuits.

公开(公告)号：US10424551B2

公开(公告)日：2019-09-24

申请号：US15913497

申请日：2018-03-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  G02B27/09 ,  G02B3/08 ,  G02B19/00

Abstract: In described examples of forming an integrated circuit wave device, a method includes: (a) affixing an integrated circuit die relative to a substrate; (b) creating a form relative to the integrated circuit die and the substrate; and (c) forming a wave shaping member having a shape conforming at least in part to a shape of the form.

公开(公告)号：US10074639B2

公开(公告)日：2018-09-11

申请号：US15395584

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Benjamin Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01F38/14 ,  H01L23/31 ,  H01L23/49 ,  H01L23/495 ,  H01L49/02 ,  H01L31/02 ,  H01L31/103 ,  H01L31/11 ,  H01L31/167 ,  H01L33/62 ,  H04B10/80 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01F38/14 ,  H01L23/315 ,  H01L23/49 ,  H01L23/49575 ,  H01L24/08 ,  H01L24/48 ,  H01L24/85 ,  H01L28/10 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/103 ,  H01L31/1105 ,  H01L31/167 ,  H01L33/00 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/08113 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H04B10/803 ,  H01L2224/45099

Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.

公开(公告)号：US09865537B1

公开(公告)日：2018-01-09

申请号：US15395817

申请日：2016-12-30

Applicant: Texas Instruments Incorporated

Inventor： Barry Jon Male ,  Steve Kummerl ,  Benjamin Stassen Cook

IPC: H01L29/00 ,  H01L23/525 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/5256 ,  H01L21/56 ,  H01L23/315 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/562 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48245

Abstract: In described examples, an apparatus includes: an integrated circuit die having multiple terminals; the integrated circuit die positioned on a die pad portion of a leadframe having leads for external connections, at least some of the leads having an inner portion electrically coupled to at least one terminal of the integrated circuit die; a fuse element coupled between one of the leads of the leadframe and at least one terminal selected from the multiple terminals of the integrated circuit die; and encapsulation material surrounding the integrated circuit die and the leadframe to form a packaged integrated circuit including the integrated circuit die and the fuse element, and having a cavity in the encapsulation material surrounding the fuse element such that the fuse element is spaced from the encapsulation material.

公开(公告)号：US09349933B2

公开(公告)日：2016-05-24

申请号：US14180744

申请日：2014-02-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Philip L. Hower

IPC: H01L35/30 ,  H01L23/38 ,  H01L35/32

CPC classification number: H01L35/30 ,  H01L23/38 ,  H01L27/16 ,  H01L35/22 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A thermoelectric device is disclosed which includes metal thermal terminals protruding from a top surface of an IC, connected to vertical thermally conductive conduits made of interconnect elements of the IC. Lateral thermoelectric elements are connected to the vertical conduits at one end and heatsinked to the IC substrate at the other end. The lateral thermoelectric elements are thermally isolated by interconnect dielectric materials on the top side and field oxide on the bottom side. When operated in a generator mode, the metal thermal terminals are connected to a heat source and the IC substrate is connected to a heat sink. Thermal power flows through the vertical conduits to the lateral thermoelectric elements, which generate an electrical potential. The electrical potential may be applied to a component or circuit in the IC. The thermoelectric device may be integrated into an IC without adding fabrication cost or complexity.

Abstract translation: 公开了一种热电装置，其包括从IC的顶表面突出的金属热端子，其连接到由IC的互连元件制成的垂直导热导管。 侧向热电元件在一端连接到垂直导管，并在另一端与IC基板相互散热。 侧向热电元件通过顶侧的互连电介质材料和底侧的场氧化物热隔离。 当在发电机模式下工作时，金属热端子连接到热源，并且IC基板连接到散热器。 热功率流过垂直管道到横向热电元件，产生电位。 电位可以施加到IC中的元件或电路。 热电装置可以集成到IC中而不增加制造成本或复杂性。

公开(公告)号：US20140216517A1

公开(公告)日：2014-08-07

申请号：US14180744

申请日：2014-02-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Philip L. Hower

IPC: H01L35/30

CPC classification number: H01L35/30 ,  H01L23/38 ,  H01L27/16 ,  H01L35/22 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A thermoelectric device is disclosed which includes metal thermal terminals protruding from a top surface of an IC, connected to vertical thermally conductive conduits made of interconnect elements of the IC. Lateral thermoelectric elements are connected to the vertical conduits at one end and heatsinked to the IC substrate at the other end. The lateral thermoelectric elements are thermally isolated by interconnect dielectric materials on the top side and field oxide on the bottom side. When operated in a generator mode, the metal thermal terminals are connected to a heat source and the IC substrate is connected to a heat sink. Thermal power flows through the vertical conduits to the lateral thermoelectric elements, which generate an electrical potential. The electrical potential may be applied to a component or circuit in the IC. The thermoelectric device may be integrated into an IC without adding fabrication cost or complexity.

Abstract translation: 公开了一种热电装置，其包括从IC的顶表面突出的金属热端子，其连接到由IC的互连元件制成的垂直导热导管。 侧向热电元件在一端连接到垂直导管，并在另一端与IC基板相互散热。 侧向热电元件通过顶侧的互连电介质材料和底侧的场氧化物热隔离。 当在发电机模式下工作时，金属热端子连接到热源，并且IC基板连接到散热器。 热功率流过垂直管道到横向热电元件，产生电位。 电位可以施加到IC中的元件或电路。 热电装置可以集成到IC中而不增加制造成本或复杂性。