RESIN COMPOSITION FOR VIBRATION WELDING AND MOLDED PRODUCT

    公开(公告)号:JPH11343403A

    公开(公告)日:1999-12-14

    申请号:JP15339298

    申请日:1998-06-02

    Abstract: PROBLEM TO BE SOLVED: To obtain a polyamide resin composition excellent even in characteristics essential to polyamide resins such as moldability, heat resistance, toughness and oil, gasoline and abrasion resistances in equilibrium and suitable for vibration welding. SOLUTION: This resin composition for welding comprises (C) glass fibers having 5-15 μm average fiber diameter in an amount of 10-150 pts.wt. based on 100 pts.wt. of (A) a specific high-melting polyamide resin composed of (a) 75-45 mol.% of hexamethylene terephthalamide units and (b) 25-55 mol.% of aliphatic polyamide units having >=8 number of carbon atoms (amide group concentration) based on 1 amide group and having the melting point within the range of >=290 and

    VIBRATION WELDING RESIN COMPOSITION AND MOLDED PRODUCT THEREFOR

    公开(公告)号:JPH11241015A

    公开(公告)日:1999-09-07

    申请号:JP4410398

    申请日:1998-02-25

    Abstract: PROBLEM TO BE SOLVED: To provide a nylon resin composition suitable for vibration welding which has well balanced properties inherent in a nylon resin such as moldability, heat resistance, toughness, oil/gasoline resistance, wear resistance, etc. SOLUTION: The titled composition comprises, against (A) 100 pts.wt. nylon resin, (B) from 0.02 to 50 pts.wt. releasing agent, (C) from 10 to 150 pts.wt. glass fiber having an average fiber size of from 5 to 15 μm and (D) 0.01 pts.wt. or more copper compound. Here, preferably, (B) the releasing agent is an ethylene bisstearic acid amide, the weight average fiber length of the glass fibers in the composition is within the range of from 100 to 400 μm and the proportion of a glass fiber having a fiber length of 60 μm or shorter is from 10 to 50 wt.% of the total glass fiber.

    FLAME-RETARDANT RESIN COMPOSITION AND MOLDED ARTICLE

    公开(公告)号:JPH10237281A

    公开(公告)日:1998-09-08

    申请号:JP35863197

    申请日:1997-12-25

    Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition which can control bleeding and reduction in mechanical strength when treated in a high-temperature and high- humidity state with a non-halogenated flame retardant and is excellent in flame retardancy and resistance to moist heat by incorporating a polyethylene terephthalate resin and red phosphorus into a polybutylene terephthalate resin. SOLUTION: The polybutylene terephthalate resin (A) comprises a high- molecular-weight thermoplastic polyester made by using terephthalic acid as the acid component and 1,4-butane diol as the glycol component, having ester linkages in the principal chain, and optionally copolymerized with other copolymerizable component. Concrete examples of component a used include compounds of formula I and formula II. The component A preferably comprises the one having an intrinsic viscosity of 0.36 to 1.60. The polyethylene terephthalate resin (B) comprises a compound made by using terephthalic acid as the acid component and ethylene glycol as the glycol component. The red phosphorus (C) is treated for stabilization. The amounts of components B and C are each 0.1-50 pts.wt. based on 100 pts.wt. component A.

    FLAME RETARDANT RESIN COMPOSITION
    44.
    发明专利

    公开(公告)号:JPH09132720A

    公开(公告)日:1997-05-20

    申请号:JP23390396

    申请日:1996-09-04

    Abstract: PROBLEM TO BE SOLVED: To obtain the subject composition useful for electric parts superior in flame retardant property, moldability and mechanical characteristic, and having a low bleeding out property for a flame retardant by blending a specific thermoplastic resin with a specific resin, a flame retardant and a salt of (iso) cyanuric acid. SOLUTION: This resin composition as obtained by blending (A) 100 pts.wt. of a thermoplastic resin whose pyrolysis residue (Z) at 850 deg.C is less than 25wt.% with each 1-100 pts.wt. of (B) a resin other than polyphenylene oxide resins or a resin except polyphenylene sulfide resins and having the L of more than 25wt.%, (C) a compound of formula I (R is H, a 1-5C alkyl; Ar -Ar are each phenyl or the like; (k), (m), and k+m are 0-2), formula II (R -R are R ; Ar -Ar are Ar ), formula III (R -R are R ; Ar -AR is Ar ; X is O, etc.; n13 is 40 - the value corresponding to 500 number-average molecular weight in the average) or formula IV (Ar is a divalent aromatic group; n4 >=40) and (D) a isocyanurate salt of the compound of formula V (R -R are each H, an alkyl, etc.; R is the formula: NR R group, etc.).

    FLAME-RETARDED CURABLE RESIN COMPOSITION AND ITS MOLDING

    公开(公告)号:JPH0741680A

    公开(公告)日:1995-02-10

    申请号:JP18402593

    申请日:1993-07-26

    Abstract: PURPOSE:To obtain the subject composition composed of a specified ratio of a curable resin and a specified polyphosphonic acid amide, free from generation of a harmful gas such as a hydrogen halide, excellent in mechanical properties, molding flow and visual appearance of the surface and useful for an electronic component, etc. CONSTITUTION:This composition is obtained by blending (A) 100 pts.wt. curable resin such as an epoxy resin, a phenolic resin or a polyurethane resin and (B) 0.5 to 100 pts.wt. polyphosphonic acid amide having a repeating unit of the formula (R is an aryl, an alkyl, an aralkyl or a cycloalkyl; R and R are each H, an aryl or an alkyl; R is an arylene, an aralkylene or an alkylene; A cyclic structure may be formed from R and R ).

    FLAME-RETARDANT POLYAMIDE RESIN COMPOSITION AND ITS INJECTION MOLDING

    公开(公告)号:JPH0741667A

    公开(公告)日:1995-02-10

    申请号:JP18402293

    申请日:1993-07-26

    Abstract: PURPOSE:To obtain the subject composition excellent in mechanical characteristics, melt fluidity and surface appearance without generating harmful gas such as hydrogen halide and useful for injection moldings, etc., of electrical parts, etc., by blending a thermoplastic polyamide with a specific polyphosphonic amide in a specific ratio. CONSTITUTION:This composition is obtained by blending (A) 100 pts.wt. of a thermoplastic polyamide such as nylon 6 with (B) 0.5-100 pts.wt. of a polyphosphonic amide having a recurring unit of the formula (R is aryl, alkyl, aralkyl or cycloalkyl; R and R are H, aryl or alkyl; R is arylene, aralkylene or alkylene; R and R together form cyclic structure).

    FLAME RESISTANT POLYPHENYLENEOXIDE RESIN COMPOSITION AND ITS INJECTION MOLDED PRODUCT

    公开(公告)号:JPH0741656A

    公开(公告)日:1995-02-10

    申请号:JP18402493

    申请日:1993-07-26

    Abstract: PURPOSE:To obtain the subject resin composition by combining a thermoplastic polyphenyleneoxide resin with a specific polyphosphonic acid amide, not producing any harmful gases like hydrogen halides, having excellent characteristics of machinability, heat resistance, and surface appearance, useful as the injection molded product such as mechanical parts. CONSTITUTION:The objective resin composition is obtained by combining (A) 100 (wt.) parts of a thermoplastic polyphenylene oxide resin such as poly(2,6- dimethyl-1,4-phenylene) oxide etc., or a mixture of a thermoplastic polyphenylene oxide with vinyl aromatic polymer such as PS, with (B) 0.5-100 parts of polyphosphonic acid amide having a repeating unit of the formula (where, R is aryl, alkyl, aralkyl, cycloalkyl; R , R are H, aryl, alkyl; R is arylene, aralkylene, alkylene; R and R are coupled to form a ring structure).

    POLYPHENYLENE SULFIDE RESIN COMPOSITION FOR SEALING ELECTRONIC PART

    公开(公告)号:JPH01101366A

    公开(公告)日:1989-04-19

    申请号:JP25857687

    申请日:1987-10-14

    Abstract: PURPOSE:To obtain the title composition having excellent mechanical characteristics and moisture resistance and suitable as a sealing material for electronic parts such as IC or transistor, by compounding specific amounts of siliceous filler and a specific ureidosilane compound. CONSTITUTION:The objective composition is produced by compounding (A) 30-90wt.%, preferably 35-60wt.% of polyphenylene sulfide with (B) 70-10wt.%, preferably 65-40wt.% of a siliceous filler (e.g. quartz or talc) and (C) 0.01-10wt.% of an ureidosilane compound of formula (R1 is 1-15C alkylene, etc.; R2 is 1-14C alkylene, etc.; R3 is H or 1-10C alkyl; X is 1-10C alkoxy, etc.) (e.g. gamma-ureidopropyltriethoxysilane).

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