公开(公告)号：JPS649855A

公开(公告)日：1989-01-13

申请号：JP16503687

申请日：1987-07-01

Applicant: YAMAHA CORP

Inventor： SADA GAKUO ,  IIJIMA KENZABURO ,  HOSHI TOSHIHARU

IPC: C01G3/00 ,  C01G1/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/00

Abstract: PURPOSE:To obtain inexpensively and easily a superconductor having a critical point higher than the boiling point of liquid nitrogen, which is composed of a sintered product from a specifically composed oxide mixture of Al, Ba and Cu. CONSTITUTION:Oxides or carbonates of Al, Ba, and Cu such as Al2O3, BaCO3, and CuO, are mixed in amounts corresponding to the composition of the target sintered product, calcined, and crushed. The resultant powder is molded by compression and sintered to give a super conductor of a sintered oxide having a composition of the formula (1.0x

公开(公告)号：JPS64792A

公开(公告)日：1989-01-05

申请号：JP15581287

申请日：1987-06-23

Applicant: YAMAHA CORP

Inventor： IIJIMA KENZABURO ,  HOSHI TOSHIHARU

IPC: H05K3/10

Abstract: PURPOSE:To manufacture an electronic circuit by a simple process by a method wherein a sheet made of heat-melting type insulating resin in which magnetic conductive particles are mixed is heated by a laser beam in a magnetic field. CONSTITUTION:A magnet 3 is provided under a heat-melting type insulating sheet 2 and laser beam such as a TAG laser beam is applied to the upper surface of the insulating sheet 2. At that time, the diameter of a spot to which the laser beam is applied is about 0.01-0.5mm. If the heat-melting type insulating sheet 2 is placed in a magnetic field and, at the same time, heated by the laser beam like this, as the resin of the heated part melts, magnetic conductive particles 1 contained in the resin of the heated part is condensed on the magnet 3, i.e. the lower part of the insulating sheet 2. Thus, only the part to which the laser beam is applied becomes conductive while the other part is kept insulating. Then, after the position of the laser beam application is moved and an arbitrary pattern is drawn, the insulating sheet 2 is fixed under those conditions to manufacture an arbitrary electronic circuit.

公开(公告)号：JPS6394221A

公开(公告)日：1988-04-25

申请号：JP24026186

申请日：1986-10-09

Applicant: YAMAHA CORP

Inventor： TAKAHASHI HIDEMI ,  TAKAMURA MASAYUKI ,  IIJIMA KENZABURO ,  KURAHASHI KAZUO

IPC: G02C5/00

Abstract: PURPOSE:To convert a titanium alloy to have the workability equal to the workability of pure titanium and to improve the spring characteristic thereof by adding specific ratios of Al and Sn to said alloy or adding Al, Sn and Si at specific ratios thereto. CONSTITUTION:This titanium alloy is formulated to have the compsn. contg. 0.01-4wt% Al, 0.01-4% Sn, and the balance titanium and the total content of Al and Sn is specified to

公开(公告)号：JPS62299720A

公开(公告)日：1987-12-26

申请号：JP14417386

申请日：1986-06-20

Applicant: YAMAHA CORP

Inventor： IIJIMA KENZABURO ,  HAYASHI YOSHINORI

IPC: G01D5/245

Abstract: PURPOSE:To hold an air gap invariably constant between a recording medium and a sensor which detects position information recorded thereupon by passing external supply air through an air flow passage and jetting it from the surface of a holding member which faces the recording medium. CONSTITUTION:A flexible support plate 11 is fitted to a base part 10 as part of a housing 1. A case is fitted to the tip part of the support plate 11 while having its open surface opposite the magnetic recording medium 3 and an air intake member 13 made of a porous nonmagnetic metallic material is fitted therein. A magneto-resistance element 4 is fitted in the reverse surface of the member 13. Then when air is admitted into the case 12 from an external air supply source through air intake passages 10a and 11a provided to the base part 10 and support plate 11, the air is jetted from the surface of the member 13 which faces the recording medium 3 and a thrust operates on the member 13 in a leaving direction from the recording medium 3. The case 12, on the other hand, is so energized by a spring 16 to come close to the recording medium 3, so the air gap G between the element 4 in the case 12 and the recording medium 3 is held invariably constant.

公开(公告)号：JPS62289722A

公开(公告)日：1987-12-16

申请号：JP13446286

申请日：1986-06-10

Applicant: YAMAHA CORP

Inventor： IIJIMA KENZABURO ,  NISHIMURA KIYOYA ,  HAYASHI YOSHINORI

IPC: G01B7/00 ,  G01D5/18 ,  G01D5/245

Abstract: PURPOSE:To detect magnetic information from the same parts of tracks of a magnetic recording medium and to reduce errors in detection due to physical strain by arranging a magneto-resistance element for sine wave detection and a magneto-resistance element for cosine wave detection one over the other with an insulating layer between. CONSTITUTION:The magneto-resistance element A for sine wave detection which consists of detection parts S1-S8 and connection parts C1-C8 is vapor-deposited on a substrate 10 which has high insulation and smoothness. At this time, the detection parts S1-S4 and S5-S8 are arranged at intervals lambda and the detection parts S4 and S5 are arranged at an interval #/2. Then, the insulating film 12 is formed on the substrate 10 where the element A is vapor-deposited and then the magneto-resistance element B for cosine wave detection consisting of detection parts S9-S18 and connection parts C9-C18 is vapor-deposited on the insulating film 12 so that the detection parts S1-S8, and S18-S9 of the elements A and B are isolated by lambda/4 each. Then, while the magneto-resistance element A for the sine wave detection and magneto- resistance element B for consine detection are insulated in insulating film 12, they are arranged one over the other so that 90 deg. out-of-phase relation to the wavelength lambdaof a sine wave recorded on a magnetic recording medium.

公开(公告)号：JPS62274817A

公开(公告)日：1987-11-28

申请号：JP11793986

申请日：1986-05-22

Applicant: YAMAHA CORP

Inventor： IIJIMA KENZABURO ,  HAYASHI YOSHINORI

IPC: H03M1/24

Abstract: PURPOSE:To facilitate the adjustment of an origin at the mounting by providing an origin mark representing , 6 for theta=1/3 , 9 for theta=2/9 12 for theta=1/6 , 18 for theta=1/9 and 36 for 1/18 . Thus, when the input shaft 2 is driven within a range of detection angle theta, the origin marks 1b1-1b6 are always detected and the adjustment of origin alignment at the mount is facilitated.

公开(公告)号：JP2005161397A

公开(公告)日：2005-06-23

申请号：JP2004193356

申请日：2004-06-30

Applicant: Kiyohito Ishida ,  Yamaha Corp ,  ヤマハ株式会社 ,  清仁 石田

Inventor： HORIO YUUMA ,  HAYASHI TAKAHIRO ,  IIJIMA KENZABURO ,  SUZUKI JUNYA ,  SEKINE MASAYOSHI ,  ISHIDA KIYOHITO ,  KAINUMA RYOSUKE ,  ONUMA IKUO ,  TAKAKU YOSHIKAZU ,  O SUIHEI

IPC: B23K35/26 ,  B23K35/28 ,  C22C12/00 ,  C22C18/00 ,  H01L35/08

Abstract: PROBLEM TO BE SOLVED: To provide a solder suitable for welding a electrothermal transmutation module and to provide its manufacturing method.
SOLUTION: The solder has a structure in which one or more kinds of dispersed phases are dispersed in a matrix phase, and the dispersed phases has a solidus temperature higher than that of the matrix phase. The solidus temperature of the matrix phase of the solder is desirably ≥240°C, while the dispersed phases are desirably fine phases with the average grain size ≤5 μm. It is preferable that the solder is an alloy having a composition in which the volume fraction of the dispersed phase is ≤40%, that this alloy is particularly Bi-Cu-X radicals alloy or Bi-Zn-X radicals alloy, and that the solder is in the form of powder with the grain size ≤100 μm prepared by a liquid quenching method or a thin strip with the film thickness ≤500 μm.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供适合于焊接电热转换模块的焊料并提供其制造方法。 解决方案：焊料具有其中一种或多种分散相分散在基质相中的结构，并且分散相的固相线温度高于基质相的固相线温度。 焊料的基质相的固相线温度优选为≥240℃，分散相优选为平均粒径≤5μm的微细相。 优选的是，焊料是具有分散相的体积分率≤40％的组成的合金，该合金特别是Bi-Cu-X自由基合金或Bi-Zn-X自由基合金， 焊料为液态淬火法制成的粒径≤100μm的粉末，薄膜厚度≤500μm的薄带状。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005072612A

公开(公告)日：2005-03-17

申请号：JP2004302516

申请日：2004-10-18

Applicant: Yamaha Corp ,  ヤマハ株式会社

Inventor： IIJIMA KENZABURO ,  MIURA MICHIO

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To decrease a connection area between the leading electrode of a semiconductor chip and the wiring layer of a packaging substrate in the packaging structure of the semiconductor chip.
SOLUTION: A solder bump 26 is prepared at the concave portion Q' of nickel layer 14c of the leading 14 electrode prepared at the semiconductor chip 10. In such a state that the solder bump 26 is touched to the Cu layer 22b of a wiring layer 22 prepared at the packaging substrate 20 made of glass, the leading electrode 14 is connected to the wiring layer 22 by irradiating a laser beam L to the solder bump 26 from the rear side of the substrate 20. Since the laser beam L is minimized in size to the diameter of 1-25 μm, the connection area can be decreased, and as a result, the leading electrode and the chip can be decreased in size. Laser bonding may be performed by breaking coating state in such a way that the solder bump 26 is omitted and a connecting hole is not prepared at an insulating layer 24 simultaneously.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：在半导体芯片的封装结构中，减小半导体芯片的引出电极与封装衬底的布线层之间的连接区域。 解决方案：在半导体芯片10上制备的引线14电极的镍层14c的凹部Q'处制备焊料凸点26。在焊料凸块26与Cu层22b接触的状态下 在由玻璃制成的封装基板20上准备的布线层22，通过从基板20的后侧向焊料凸点26照射激光束L，引出电极14与布线层22连接。由于激光束L 尺寸减小到1-25μm的直径，可以减小连接面积，结果导致电极和芯片的尺寸减小。 可以通过以下方式进行激光焊接来进行激光焊接，即，省略焊料凸块26并且不在绝缘层24上同时制备连接孔。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2004012928A

公开(公告)日：2004-01-15

申请号：JP2002167705

申请日：2002-06-07

Applicant: YAMAHA CORP

Inventor： TAKABAYASHI YOJIRO ,  SAWADA SHUICHI ,  SUZUKI HIDEO ,  IIJIMA KENZABURO

IPC: G10H3/18

Abstract: PROBLEM TO BE SOLVED: To provide an oscillation detection device and an electriophonic musical instrument capable of detecting richer playing expressions. SOLUTION: A bridge 7 is provided with a bridge body 70 and pendulum pieces 20. Each pendulum piece 20 can be oscillated in the extended direction (longitudinal direction) of a string 4 and a direction orthogonal to the extended direction and an oscillation detection device 40 for independently detecting the oscillation of the pendulum piece 20 in the two directions is arranged in the pendulum piece 20. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2002124611A

公开(公告)日：2002-04-26

申请号：JP2000314981

申请日：2000-10-16

Applicant: YAMAHA CORP

Inventor： SUZUKI KATSUNORI ,  IIJIMA KENZABURO ,  HOSHI TOSHIHARU

IPC: H05K7/20 ,  B22F7/06 ,  F28F13/00 ,  H01L21/48 ,  H01L23/373 ,  H01L23/38 ,  H01L35/00 ,  H01S5/024

Abstract: PROBLEM TO BE SOLVED: To provide a heat sink, having a certain heat dissipation direction (heat conducting direction) and a thermal expansion coefficient which closely resembles that of an electronic device, a board for mounting an electronic device or a container for housing an electronic device, and to provide a method for manufacturing the same. SOLUTION: The heat sink 10 is constructed with through-holes 12 formed on a substrate 11 being made of a material with a low thermal expansion coefficient, which comprises a copper-tungsten alloy or a copper-molybdenum alloy having the small content of copper and the large content of tungsten or molybdenum. The through-holes 12 are filled with a high heat conducting material 13, comprising a copper-tungsten alloy or a copper-molybdenum alloy which has the large content of copper and the small content of tungsten or molybdenum. Thus, the heat can be conducted in the axial direction of the through-holes 12.