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    MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS, METHOD OF MANUFACTURE AND DESIGN STRUCTURES
    44.
    发明申请
    MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS, METHOD OF MANUFACTURE AND DESIGN STRUCTURES 审中-公开
    微电子机械系统（MEMS）及相关执行机构的制造，制造和设计结构的方法

    公开(公告)号：WO2012177304A3

    公开(公告)日：2014-03-13

    申请号：PCT/US2012029005

    申请日：2012-03-14

    Applicant: IBM ,  JAHNES CHRISTOPHER V ,  STAMPER ANTHONY K

    Inventor： JAHNES CHRISTOPHER V ,  STAMPER ANTHONY K

    IPC: B81B3/00

    CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B7/0006 ,  B81B2201/016 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00293 ,  B81C2203/0145 ,  G06F17/5045 ,  G06F17/5068 ,  H01H1/0036 ,  H01H2001/0057 ,  Y10T29/49121

    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes (115) and a contact point on a substrate. The method further includes forming a MEMS beam (100) over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes (105') in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

    Abstract translation: 提供微机电系统（MEMS）结构，制造方法和设计结构。 形成MEMS结构的方法包括在基板上形成固定的致动器电极（115）和接触点。 该方法还包括在固定的致动器电极和接触点上形成MEMS光束（100）。 该方法还包括形成与固定致动器电极的部分对准的致动器电极阵列（105'），其尺寸和尺寸被设计成防止MEMS梁在重复循环之后塌陷在固定的致动器电极上。 致动器电极的阵列形成为与MEMS光束的下侧和固定的致动器电极的表面中的至少一个直接接触。

    MEMS SWITCH WITH SET AND LATCH ELECTRODES
    46.
    发明申请
    MEMS SWITCH WITH SET AND LATCH ELECTRODES 审中-公开
    MEMS开关与套和电极

    公开(公告)号：WO2007061406A1

    公开(公告)日：2007-05-31

    申请号：PCT/US2005/041365

    申请日：2005-11-16

    Applicant: IDC, LLC

    Inventor： CHUI, Clarence

    IPC: G02B26/00 ,  B81B3/00 ,  H01H59/00

    CPC classification number: G02B26/001 ,  B81B3/0086 ,  B81B2201/016 ,  B81B2201/042 ,  H01H59/0009

    Abstract: A MEMS device is electrically actuated with a voltage placed across a first electrode (702) and a moveable material (714). The device may be maintained in an actuated state by latch electrodes (730a, 730b) that are separate from the first electrode

    Abstract translation: MEMS器件通过放置在第一电极（702）和可移动材料（714）上的电压而被电致动。 可以通过与第一电极分离的闩锁电极（730a，730b）将装置保持在致动状态

    MICROSYSTEM WITH ELEMENT DEFORMABLE BY THE ACTION OF A HEAT-ACTUATED DEVICE
    47.
    发明申请
    MICROSYSTEM WITH ELEMENT DEFORMABLE BY THE ACTION OF A HEAT-ACTUATED DEVICE 审中-公开
    具有元件的微结构可以通过加热装置的作用而变形

    公开(公告)号：WO99031689A1

    公开(公告)日：1999-06-24

    申请号：PCT/FR1998/002719

    申请日：1998-12-14

    IPC: H01H1/00

    CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/016 ,  B81B2201/032 ,  H01G5/16 ,  H01H2001/0042 ,  H01H2037/008 ,  Y10T29/42 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155

    Abstract: The invention concerns a microsystem, in particular for producing microswitches or microvalves, constituted on a substrate (50) and used for producing a shift between a first operating state and a second operating state by means of a heat actuated device with bi-metal switch effect. The heat-actuated device comprises a deformable element (51) connected, by opposite ends, to the substrate (50) so as to present naturally a deflection without stress relative to the substrate surface which faces it, said natural deflection determining the first operating state, the second operating state being produced by the heat-actuated device which induces, by the effect of temperature variation, a deformation of the deformable element (51) tending to reduce its deflection and submitting it to a compressive stress by buckling effect in a direction opposite to its natural deflection.

    Abstract translation: 本发明涉及一种微系统，特别是用于生产微型开关或微型阀，微型开关或微型阀构成在基板（50）上并用于通过具有双金属开关效应的热致动装置在第一操作状态和第二操作状态之间产生换档 。 热致动装置包括通过相对端连接到基板（50）的可变形元件（51），以便相对于面向其的基板表面自然地呈现不受应力的偏转，所述自然偏转确定第一操作状态 所述第二操作状态由所述热驱动装置产生，所述热致动装置通过温度变化而引起所述可变形元件（51）的变形，所述变形元件倾向于减小其偏转，并且通过在方向上的屈曲效应使其变形为压缩应力 与其自然偏转相反。

    마이크로 스위칭 소자 제조 방법 및 마이크로 스위칭 소자
    49.
    发明公开
    마이크로 스위칭 소자 제조 방법 및 마이크로 스위칭 소자 有权
    制造微波器件和微波器件的方法

    公开(公告)号：KR1020050087703A

    公开(公告)日：2005-08-31

    申请号：KR1020040053844

    申请日：2004-07-12

    Applicant: 후지쯔 가부시끼가이샤

    Inventor： 나카타니다다시 ,  미야시타츠토무

    IPC: H01L21/00 ,  H01H59/00

    CPC classification number: H01H59/0009 ,  B81B2201/016 ,  B81B2203/0127 ,  B81C1/00142 ,  B81C2201/0109

    Abstract: 본 발명은 마이크로 스위칭 소자를 양호한 제조 수율로 제조하는 것을 과제로 한다.
    본 발명은 기판(S1)과, 서로 격리되어 기판(S1)에 고정된 한 쌍의 지지부(20)와, 한 쌍의 지지부(20)를 가교하는 막체(31), 상기 막체(31) 위에 배치된 가동 콘택트 전극(32) 및 가동 구동 전극(33)을 갖는 가동 빔부(30)와, 가동 콘택트 전극(32)에 대향하는 한 쌍의 고정 콘택트 전극(11)과, 가동 구동 전극(33)과 협동하여 정전기력을 발생시키기 위한 고정 구동 전극(12)을 구비하는 마이크로 스위칭 소자를 제조하기 위한 방법이며, 기판(S1) 위에 희생층을 형성하기 위한 공정과, 희생층 위에 막체(31)를 형성하기 위한 공정과, 서로 격리되어 기판(S1) 및 막체(31) 사이에 개재되는 한 쌍의 지지부(20)가 잔존 형성되도록 희생층에 대하여 막체(31)를 통하여 에칭 처리를 실시하기 위한 공정을 포함한다.

    MEMS bridge devices and methods of manufacture thereof
    50.
    发明授权
    MEMS bridge devices and methods of manufacture thereof 有权

    公开(公告)号：US11834327B2

    公开(公告)日：2023-12-05

    申请号：US16585242

    申请日：2019-09-27

    Applicant: SOFANT TECHNOLOGIES LTD.

    Inventor： Nakul Haridas ,  Victor Steel

    IPC: B81B7/00 ,  H01H59/00 ,  H01Q1/50 ,  H01P1/18 ,  H01P3/08 ,  H01P11/00

    CPC classification number: B81B7/0006 ,  H01H59/0009 ,  H01P1/18 ,  H01P3/08 ,  H01P11/00 ,  H01Q1/50 ,  B81B2201/014 ,  B81B2201/016 ,  B81B2201/018 ,  B81B2203/0109 ,  B81B2203/019 ,  B81B2203/0181 ,  B81B2203/0307 ,  H01H2239/006 ,  H01H2239/018

    Abstract: A microelectromechanical systems (MEMS) device comprising: a substrate; a signal conductor supported on the substrate; ground conductors supported on the substrate on either side of the signal conductor; and a MEMS bridge at least one end of which is mechanically connected to the substrate by way of at least one anchor, the MEMS bridge comprising an electrically conductive switching portion, the electrically conductive switching portion comprising a switching signal conductor region and a switching ground conductor region, the switching signal conductor region being provided over the signal conductor and the switching ground conductor region being provided over a said ground conductor, the electrically conductive switching region being movable relative to the said signal and ground conductors respectively to thereby change the inductances between the switching signal conductor region and the signal conductor and between the switching ground conductor region and the respective ground conductor, wherein there is no continuous electrically conductive path extending from the switching conductor region to the at least one anchor. Capacative and ohmic switches, a varactor, a phase shifter, a tuneable power splitter/combiner, tuneable attenuator, SPDT switch and antenna apparatus comprising said devices.

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