公开(公告)号：EP1864310A2

公开(公告)日：2007-12-12

申请号：EP05858635.5

申请日：2005-11-23

Applicant: GEORGIA TECH RESEARCH CORPORATION ,  Kingsley, Nickolas

Inventor： KINGSLEY, Nickolas ,  THOMPSON, Dane ,  WANG, Guoan ,  TENTZERIS, Emmanouil, M. ,  PAPAPOLYMEROU, Loannis

IPC: H01J33/00

CPC classification number: B81B7/0041 ,  B81B2201/016 ,  B81C2203/0136 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first elecctronic component.

公开(公告)号：WO2007050101A3

公开(公告)日：2007-11-22

申请号：PCT/US2005042737

申请日：2005-11-23

Applicant: GEORGIA TECH RES INST ,  KINGSLEY NICKOLAS ,  THOMPSON DANE ,  WANG GUOAN ,  TENTZERIS EMMANOUIL M ,  PAPAPOLYMEROU LOANNIS

Inventor： KINGSLEY NICKOLAS ,  THOMPSON DANE ,  WANG GUOAN ,  TENTZERIS EMMANOUIL M ,  PAPAPOLYMEROU LOANNIS

IPC: H01L23/12

CPC classification number: B81B7/0041 ,  B81B2201/016 ,  B81C2203/0136 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first elecctronic component.

Abstract translation: 提供包装系统和制造方法。 就这一点而言，代表性系统包括液晶聚合物（LCP）的第一层，由第一层支撑的第一电子部件和第二层LCP。 第一层和第二层包裹第一电子部件。

公开(公告)号：WO2008030208A2

公开(公告)日：2008-03-13

申请号：PCT/US2005/042749

申请日：2005-11-23

Applicant: GEORGIA TECH RESEARCH CORPORATION ,  THOMPSON, Dane ,  WANG, Guoan ,  KINGSLEY, Nickolas, D. ,  PAPAPOLUMEROU, Ioannis ,  TENTZERIS, Emmanouil, M. ,  BAIRAVASUBRAMANIAN, Ramanan ,  DEJEAN, Gerald ,  LI, RongLin

Inventor： THOMPSON, Dane ,  WANG, Guoan ,  KINGSLEY, Nickolas, D. ,  PAPAPOLUMEROU, Ioannis ,  TENTZERIS, Emmanouil, M. ,  BAIRAVASUBRAMANIAN, Ramanan ,  DEJEAN, Gerald ,  LI, RongLin

IPC: H01Q1/38

CPC classification number: H01Q1/40 ,  H01Q5/42 ,  H01Q21/065 ,  H01Q21/24 ,  H05K1/16 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2203/065 ,  Y10T29/49016

Abstract: Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Abstract translation: 提供多层电子元件系统和制造方法。 在这方面，示例性系统包括第一层液晶聚合物（LCP），由第一层支撑的第一电子部件和第二层LCP。 第一层通过热键连接到第二层。 此外，第一电子部件的至少一部分位于第一层和第二层之间。

公开(公告)号：WO2007050101A8

公开(公告)日：2007-05-03

申请号：PCT/US2005/042737

申请日：2005-11-23

Applicant: GEORGIA TECH RESEARCH CORPORATION ,  THOMPSON, Dane ,  WANG, Guoan ,  KINGSLEY, Nickolas Dana ,  TENTZERIS, Emmanouil, M. ,  PAPAPOLYMEROU, Loannis

Inventor： THOMPSON, Dane ,  WANG, Guoan ,  KINGSLEY, Nickolas Dana ,  TENTZERIS, Emmanouil, M. ,  PAPAPOLYMEROU, Loannis

IPC: H01L23/12

Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first elecctronic component.

公开(公告)号：WO2007050101A2

公开(公告)日：2007-05-03

申请号：PCT/US2005042737

申请日：2005-11-23

Applicant: GEORGIA TECH RES INST ,  KINGSLEY NICKOLAS ,  THOMPSON DANE ,  WANG GUOAN ,  TENTZERIS EMMANOUIL M ,  PAPAPOLYMEROU LOANNIS

Inventor： KINGSLEY NICKOLAS ,  THOMPSON DANE ,  WANG GUOAN ,  TENTZERIS EMMANOUIL M ,  PAPAPOLYMEROU LOANNIS

IPC: H01J33/00

CPC classification number: B81B7/0041 ,  B81B2201/016 ,  B81C2203/0136 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first elecctronic component.

Abstract translation: 提供包装系统和制造方法。 在这方面，代表性系统包括第一层液晶聚合物（LCP），由第一层支撑的第一电子部件和第二层LCP。 第一层和第二层封装第一电极组件。

公开(公告)号：WO2008030208A3

公开(公告)日：2008-10-09

申请号：PCT/US2005042749

申请日：2005-11-23

Applicant: GEORGIA TECH RES INST ,  THOMPSON DANE ,  WANG GUOAN ,  KINGSLEY NICKOLAS D ,  PAPAPOLUMEROU IOANNIS ,  TENTZERIS EMMANOUIL M ,  BAIRAVASUBRAMANIAN RAMANAN ,  DEJEAN GERALD ,  LI RONGLIN

Inventor： THOMPSON DANE ,  WANG GUOAN ,  KINGSLEY NICKOLAS D ,  PAPAPOLUMEROU IOANNIS ,  TENTZERIS EMMANOUIL M ,  BAIRAVASUBRAMANIAN RAMANAN ,  DEJEAN GERALD ,  LI RONGLIN

IPC: H01Q1/40

CPC classification number: H01Q1/40 ,  H01Q5/42 ,  H01Q21/065 ,  H01Q21/24 ,  H05K1/16 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2203/065 ,  Y10T29/49016

Abstract: Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Abstract translation: 提供了多层电子组件系统和制造方法。 就此而言，示例性系统包括第一层液晶聚合物（LCP），由第一层支撑的第一电子部件以及第二层LCP。 第一层通过热粘合附着到第二层。 另外，第一电子部件的至少一部分位于第一层和第二层之间。