公开(公告)号：EP2395395A2

公开(公告)日：2011-12-14

申请号：EP11169115.0

申请日：2011-06-08

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Kato, Hideto ,  Kanbara, Hiroshi ,  Furihata, Tomoyoshi ,  Hirano, Yoshinori

IPC: G03F7/023

CPC classification number: C09D163/04 ,  B81C1/00619 ,  B81C2201/0108 ,  G03F7/0226 ,  G03F7/0236 ,  G03F7/30 ,  G03F7/40 ,  G03F7/70466

Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

Abstract translation: 通过图案化牺牲膜来制造微结构，在图案上形成无机材料膜，为无机材料膜提供孔，并通过孔蚀刻去除牺牲膜图案以限定具有图案轮廓的空间 。 图案化阶段包括以下步骤：（A）使用包含甲酚酚醛清漆树脂和交联剂的组合物形成牺牲膜，（B）将膜图案化为第一高能辐射，（C）显影，和（D）曝光 牺牲膜图案到第二高能辐射和热处理，从而在甲酚酚醛清漆树脂内形成交联。

公开(公告)号：EP1760746B1

公开(公告)日：2011-01-12

申请号：EP06126734.0

申请日：2002-11-08

Applicant: WiSpry, Inc.

Inventor： Dereus, Dana, R.

IPC: H01H59/00 ,  B81B3/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

公开(公告)号：EP1760036A1

公开(公告)日：2007-03-07

申请号：EP06126731.6

申请日：2002-11-08

Applicant: WiSpry, Inc.

Inventor： Dereus, Dana, R.

IPC: B81B3/00 ,  H01H59/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: According to one embodiment, a movable MEMS component suspended over a substrate is provided. The component can include a structural layer having a movable electrode separated from a substrate by a gap. The component can also include at least one standoff bump attached to the structural layer and extending into the gap for preventing contact of the movable electrode with conductive material when the component moves.

Abstract translation: 根据一个实施例，提供悬挂在衬底上的可移动MEMS组件。 该部件可以包括具有通过间隙从基板分离的可移动电极的结构层。 该部件还可以包括附接到结构层并且延伸到间隙中的至少一个支座凸块，以防止当部件移动时可动电极与导电材料的接触。

公开(公告)号：EP1461816B1

公开(公告)日：2007-01-24

申请号：EP02793903.2

申请日：2002-11-08

Applicant: WiSpry, Inc.

Inventor： DEREUS, Dana, R.

IPC: H01H59/00 ,  H01L29/86 ,  B81B3/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: According to one embodiment, a movable MEMS component (100) suspended over a substrate (102) is provided. The component (100) can include a structural layer (112) having a movable electrode (114) separated from a substrate (102) by a gap. The component (100) can also include at least one standoff bump (118) attached to the structural layer (112) and extending into the gap for preventing contact of the movable electrode (114) with conductive material when the component moves.

公开(公告)号：EP1721866A1

公开(公告)日：2006-11-15

申请号：EP06116530.4

申请日：2002-11-08

Applicant: WiSpry, Inc.

Inventor： Cunningham, Shawn, J. ,  Dereus, Dana R. ,  Sett, Subham ,  Tatic-Lucic, Svetlana

IPC: B81B3/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: MEMS Switch Designs and Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.

Abstract translation: MEMS开关设计及相关方法。 根据一个实施例，提供了悬挂在衬底上的可移动的三层微型组件，并且包括图案化以限定可移动电极的第一导电层。 第一金属层通过间隙与衬底分离。 微组件还包括形成在第一金属层上并具有相对于衬底固定的端部的电介质层。 此外，微组件包括形成在电介质层上的第二导电层，并被图案化以限定用于与可动电极电连通的电极互连。

公开(公告)号：EP1544161A1

公开(公告)日：2005-06-22

申请号：EP03766675.7

申请日：2003-07-31

Applicant: Nikon Corporation

Inventor： ISHIZUYA, Tohru, NIKON CORPORATION

IPC: B81B3/00 ,  B81C1/00 ,  G02B26/08 ,  G02B26/02

CPC classification number: B81B3/0072 ,  B81C2201/0108 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3572 ,  G02B6/3584 ,  G02B6/3596 ,  Y10S438/926

Abstract: A three-dimensional structure element having a plurality of three-dimensional structural bodies and capable of being uniformly formed without producing a dispersion in shape of the three-dimensional structural bodies, comprising a substrate (11) and the three-dimensional structural bodies (1) disposed in predetermined effective area (20) on the substrate (11); the three-dimensional structural bodies (1) further comprising space parts formed in the clearances thereof from the substrate (11) by removing sacrificing layers, the substrate (11) further comprising a dummy area (21) having dummy structural bodies (33) so as to surround the effective area (20), the dummy structural body (33) further comprising space parts formed in the clearances thereof from the substrate (11) by removing the sacrificing layers, whereby since the dummy area (21) is heated merely to approx. the same temperature as the effective area (20) in an ashing process for removing the sacrificing layers to prevent a temperature distribution from occurring in the effective area (20).

Abstract translation: 具有三维结构体的多个A的三维结构元件和能够被均匀地形成，而不在所述三维结构体的形状生产的分散体，其包含一个基板（11）和所述三维结构体（1 ）设置在衬底（11）上的预定有效区域（20）; 所述三维结构体（1）还包括从所述衬底（11）其在间隙形成的空间部分通过除去牺牲层，所述衬底（11）还包括具有虚设结构体的虚设区域（21）（33），以便 以包围该有效区域（20），所述虚设结构体（33）还包括从所述衬底（11）通过去除所述牺牲层上在所述间隙形成的空间部分，由此由于虚拟区域（21）仅仅是为了加热 约。 相同的温度下的有效区域（20）到灰化用于去除牺牲层，以防止在有效区域（20）中发生的温度分布的过程。

公开(公告)号：EP1461816A4

公开(公告)日：2005-03-30

申请号：EP02793903

申请日：2002-11-08

Applicant: COVENTOR INC ,  TURNSTONE SYSTEMS INC

Inventor： DEREUS DANA R

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: According to one embodiment, a movable MEMS component (100) suspended over a substrate (102) is provided. The component (100) can include a structural layer (112) having a movable electrode (114) separated from a substrate (102) by a gap. The component (100) can also include at least one standoff bump (118) attached to the structural layer (112) and extending into the gap for preventing contact of the movable electrode (114) with conductive material when the component moves.

公开(公告)号：EP1454349A4

公开(公告)日：2005-03-16

申请号：EP02793902

申请日：2002-11-08

Applicant: COVENTOR INC ,  TURNSTONE SYSTEMS INC

Inventor： CUNNINGHAM SHAWN J ,  TATIC-LUCIC SVETLANA

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01H57/00 ,  H01L21/4763 ,  H01P1/10 ,  H02B1/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method for fabricating a trilayered beam MEMS device includes depositing a sacrificial layer (310) on a substrate and depositing and removing a portion of a first conductive layer on the sacrificial layer (310) to form a first conductive microstructure (312); depositing a structural layer (322) on the first conductive microstructure (312); the sacrificial layer (310), and the substrate (300) and forming a via through the structural layer (322) to the first conductive microstructure (312); depositing a second conductive layer (336) on the structural layer (322) and in the via; forming a second conductive microstructure (324) by removing a portion of the second conductive layer (336), wherein the second conductive microstructure (324) electrically communicates with the first conductive microstructure (312) through the via; and removing a sufficient amount of the sacrificial layer (310) so as to separate the first conductive microstructure (312) from the substrate, wherein the structural layer (322) is supported by the substrate at a first end is freely suspended above the substrate at an opposing second end.

公开(公告)号：EP1485328A1

公开(公告)日：2004-12-15

申请号：EP03716653.5

申请日：2003-03-18

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： TAI, Yu-Chong ,  HE, Qing

IPC: C03C1/00

CPC classification number: B81C1/00333 ,  B01L3/502707 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0896 ,  B81C1/00182 ,  B81C1/00476 ,  B81C2201/0108 ,  B82Y30/00 ,  G01N30/6095 ,  G01N2030/562 ,  G01N2030/6056

Abstract: A method for integrally fabricated MEMs devices with include micro or nanoparticles by providing a mixture (16) of sacrificial material (12) and a multiplicity of particles (10), disposing the mixture (16) on a substrate (14), fabricating a MEMs structure on the substrate (14) including at least part of the mixture (16), so that at least some of the mixture (16) is enclosed in the MEMs structure, removing the sacrificial material (12), and leaving at least some of the multiplicity of particles (10) substantially free and enclosed in the MEMs structure. The step of fabricating a MEMs structure is quite general and is contemplated as including one or a multiplicity of additional steps for creating some type of structure in which the particles (10), which may be microbeads or nanobeads, are included.

公开(公告)号：JP2016531246A

公开(公告)日：2016-10-06

申请号：JP2016524249

申请日：2014-06-27

Applicant: ミニパンプス, エルエルシー ,  ミニパンプス, エルエルシー

Inventor： チャンリン パン， ,  チャンリン パン， ,  ジェイソン シー， ,  ジェイソン シー， ,  フカン ジアン， ,  フカン ジアン， ,  チャンゲン リウ， ,  チャンゲン リウ， ,  ショーン カフィー， ,  ショーン カフィー， ,  アンドリュー ウラザキ， ,  アンドリュー ウラザキ，

IPC: F16J3/02 ,  A61M5/142 ,  A61M37/00 ,  F04B43/04 ,  F16J15/52

CPC classification number: A61M5/14586 ,  A61M5/14276 ,  A61M2005/14204 ,  B29C59/14 ,  B29C2791/004 ,  B29K2023/00 ,  B81B2203/0127 ,  B81C99/008 ,  B81C2201/0108 ,  F04B43/0054 ,  F04B45/04 ,  F16K2099/008

Abstract: 様々な実施形態において、本発明は、概して、ポンプデバイスの製造に関連し、より具体的には、電解質ポンプ用の波形膜の製作に関連する。除去可能材料が、膜(例えば、たわみダイヤフラム)における所望の波形に対応するパターンで平坦基板表面に堆積されるかまたは他の態様で塗布される。塗布された材料は、ポリマー材料のための仮構えとして役立ち、ポリマー材料は、仮構えの上に塗布され、キュアまたは硬化の後に、ポリマー材料は除去され、それにより、出来上がった波形膜を形成する。

Abstract translation: 在各种实施方案中，本发明总体上涉及泵装置的制造，并且更具体地涉及一种用于电解质泵的波形薄膜的制造。 可移除材料，膜（例如，弯曲的隔膜）在任一被施加或其它实施例在对应于所希望的波形的图案沉积在平的衬底表面上。 施加的材料用作临时蓄势聚合材料，聚合材料施加在临时蓄势，固化或硬化后，该聚合物材料被去除，从而形成成品波膜 。