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公开(公告)号：US11886122B2
公开(公告)日：2024-01-30
申请号：US17357666
申请日：2021-06-24
Inventor： Jung-Hun Seo , Yixiong Zheng , Matthias Muehle
CPC classification number: G03F7/36 , C23C14/04 , C23C14/06 , C23C14/5873 , B81C2201/0146
Abstract: A method comprising providing a carbonaceous material, the substrate having a first thermal conductivity. The method further comprises depositing a first masking layer having a second thermal conductivity on at least a portion of the substrate, a ratio of the second thermal conductivity to the first thermal conductivity being less than or equal to 1:30. The method further comprises depositing a second masking layer on the first masking layer to form an etch mask, and etching an exposed portion of the substrate.
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公开(公告)号：US11772963B2
公开(公告)日：2023-10-03
申请号：US17524140
申请日：2021-11-11
Inventor： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
CPC classification number: B81C1/00238 , B81C1/00269 , B81C1/00888 , B81C3/005 , B81C2201/013 , B81C2201/0143 , B81C2201/0146 , B81C2203/035
Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first substrate including a first face and a second face opposite the first face. A second substrate is bonded to the first face of the first substrate such that the second face of the first substrate faces away from the second substrate. One or more recesses are arranged in the second face of the first substrate and are configured to compensate for thermal expansion or thermal contraction.
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公开(公告)号：US20170233891A1
公开(公告)日：2017-08-17
申请号：US15519220
申请日：2015-10-15
Applicant: The University of Melbourne
Inventor： Afaq Habib Piracha , Steven Prawer , Kumaravelu Ganesan , Snjezana Tomljenovic-Hanic , Desmond Lau
IPC: C30B25/20 , B23K26/00 , C23C16/27 , C23C16/04 , C23C16/44 , B81C3/00 , C25F3/02 , C30B29/04 , C30B25/04 , C30B33/10 , C30B33/12 , B23K26/362 , C23C16/56
CPC classification number: C30B25/20 , B23K26/0006 , B23K26/362 , B23K2103/50 , B81C3/001 , B81C2201/0143 , B81C2201/0146 , B81C2201/0187 , B81C2201/0198 , C23C16/042 , C23C16/274 , C23C16/279 , C23C16/4408 , C23C16/56 , C25F3/02 , C30B25/04 , C30B25/18 , C30B29/04 , C30B33/10 , C30B33/12
Abstract: The present disclosure provides a method of fabricating a diamond membrane. The method comprises providing a substrate and a support structure. The substrate comprises a diamond material having a first surface and the substrate further comprises a sub-surface layer that is positioned below the first surface and has a crystallographic structure that is different to that of the diamond material. The sub-surface layer is positioned to divide the diamond material into first and second regions wherein the first region is positioned between the first surface and the sub-surface layer. The support structure also comprises a diamond material and is connected to, and covers a portion of, the first surface of the substrate. The method further comprises selectively removing the second region of the diamond material from the substrate by etching away at least a portion of the sub-surface layer of the substrate.
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44.发明申请METHODS OF FABRICATING PHOTOACTIVE SUBSTRATES SUITABLE FOR ELECTROMAGNETIC TRANSMISSION AND FILTERING APPLICATIONS 审中-公开制造适用于电磁传输和滤波应用的光电衬底的方法公开(公告)号：US20150277047A1
公开(公告)日：2015-10-01
申请号：US14437329
申请日：2013-09-11
Applicant: LIFE BIOSCIENCE, INC.
Inventor： Jeb H. Flemming , Leo Kevin Dunn , Carrie F. Schmidt , Drichelle Lynn Pierce , Roger Cook , R. Blake Ridgeway , Colin T. Buckley , James Mathew Gouker
CPC classification number: G02B6/136 , B81B2201/058 , B81B2203/0338 , B81C1/00071 , B81C2201/0146 , C03C3/095 , C03C4/04 , C03C10/00 , C03C15/00 , C03C17/06 , C03C23/0025 , G02B1/12 , G02B6/12 , G02B6/132 , G02B2006/12038 , G02B2006/12061 , G02B2006/12097 , G02B2006/12104 , G02B2006/12109 , G03F7/0043 , H01L2224/16225 , H01L2924/15311
Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.
Abstract translation: 一种通过制备至少包含二氧化硅，氧化锂，氧化铝和氧化铈的光敏玻璃基板制造的器件的方法，其掩蔽包含一个或多个孔的设计布局，以在感光玻璃基板上形成一个或多个导电路径 将感光玻璃基板的至少一部分暴露于激活能源，将感光玻璃基板暴露于高于其玻璃化转变温度至少十分钟的加热阶段，冷却感光玻璃基板以将至少部分暴露的 玻璃形成晶体材料以形成玻璃晶体衬底并用蚀刻剂溶液蚀刻玻璃晶体衬底以形成一个或多个成角度的沟道，然后涂覆其上。
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45.发明授权公开(公告)号：US08758590B2
公开(公告)日：2014-06-24
申请号：US12295321
申请日：2007-04-20
Applicant: Hans-Joachim Quenzer , Gerfried Zwicker
Inventor： Hans-Joachim Quenzer , Gerfried Zwicker
CPC classification number: B23H3/00 , B81C1/00634 , B81C2201/0146 , C25F3/14
Abstract: Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface. The tool conducts the metal ions of the substrate and an electric potential is applied so that an electrical potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.
Abstract translation: 公开了一种处理导电衬底表面的方法，其中包括离子导电固体材料的工具至少在一些区域与衬底表面接触。 该工具传导衬底的金属离子并且施加电位，使得电位梯度以这样的方式施加在衬底表面和工具之间，使得金属离子从衬底表面被拉出或沉积到衬底表面上 手段的工具。
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Patent Agency Ranking
公开(公告)号：US20100288729A1
公开(公告)日：2010-11-18
申请号：US12681851
申请日：2008-10-03
Applicant: Ronny Van'T Oever , Marko Theodoor Blom , Johannes Oonk
Inventor： Ronny Van'T Oever , Marko Theodoor Blom , Johannes Oonk
CPC classification number: B81C1/00119 , B81B2203/0376 , B81C1/00103 , B81C2201/0146
Abstract: Methods for manufacturing a microstructure, wherein use is made of a powder blasting and/or etching and a single mask layer with openings and structures of varying dimensions, wherein the mask layer at least at one given point in time has been wholly worn away within at least one region by mask erosion while the microstructure is not yet wholly realized. Use can be made of a combination of ‘vertical’ erosion, i.e. parallel to the thickness direction and ‘horizontal’ erosion, i.e. perpendicularly of the thickness direction, of the mask layer. The horizontal mask erosion occurs at the edges of the mask structure.
Abstract translation: 用于制造微结构的方法，其中使用粉末喷射和/或蚀刻以及具有不同尺寸的开口和结构的单个掩模层，其中至少在一个给定时间点的掩模层已经被完全磨损在内 至少一个区域通过掩模侵蚀，而微结构尚未完全实现。 可以使用“垂直”腐蚀，即平行于厚度方向和“水平”侵蚀，即垂直于掩模层的厚度方向垂直的侵蚀的组合。 在掩模结构的边缘处发生水平掩模腐蚀。
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公开(公告)号：US20050118673A1
公开(公告)日：2005-06-02
申请号：US10978877
申请日：2004-11-01
Applicant: Robert Marks , Levi Gheber , Rodica Ionescu
Inventor： Robert Marks , Levi Gheber , Rodica Ionescu
IPC: B01L3/02 , B81C1/00 , B82B3/00 , C07K1/04 , C07K1/12 , C07K17/14 , C12P20060101 , C12P7/62 , C12P21/06 , C12Q1/34 , C12Q1/37 , C12Q1/527 , H01L21/00
CPC classification number: B81C1/00492 , B01L3/0262 , B01L2300/0896 , B81B2203/0323 , B81C2201/0146 , B82Y30/00 , Y10S977/898 , Y10S977/902
Abstract: The invention provides a process for introducing a three-dimensional configuration of micron to sub-micron size in a polymeric substrate comprising applying a catalyst for the selective removal of sub-unit parts of the polymer to at least one predetermined area of the polymer substrate via a pipette with a nano-sized orifice.
Abstract translation: 本发明提供了一种在聚合物基材中引入微米至亚微米尺寸的三维构型的方法，包括施加催化剂以选择性地将聚合物的亚单元部分除去至聚合物基材的至少一个预定区域 具有纳米尺寸孔的移液管。
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48.发明申请METHODS OF FABRICATING PHOTOACTIVE SUBSTRATES SUITABLE FOR ELECTROMAGNETIC TRANSMISSION AND FILTERING APPLICATIONS 审中-公开制造适用于电磁传输和滤波应用的光电衬底的方法
公开(公告)号：WO2014043267A1
公开(公告)日：2014-03-20
申请号：PCT/US2013/059305
申请日：2013-09-11
Applicant: LIFE BIOSCIENCE, INC.
Inventor： FLEMMING, Jeb, H. , DUNN, Leo, Kevin , SCHMIDT, Carrie, F. , GOUKER, James, Mathew , PIERCE, Drichelle, Lynn , COOK, Roger , RIDGEWAY, R., Blake , BUCKLEY, Colin, T.
CPC classification number: G02B6/136 , B81B2201/058 , B81B2203/0338 , B81C1/00071 , B81C2201/0146 , C03C3/095 , C03C4/04 , C03C10/00 , C03C15/00 , C03C17/06 , C03C23/0025 , G02B1/12 , G02B6/12 , G02B6/132 , G02B2006/12038 , G02B2006/12061 , G02B2006/12097 , G02B2006/12104 , G02B2006/12109 , G03F7/0043 , H01L2224/16225 , H01L2924/15311
Abstract: A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.
Abstract translation: 一种通过制备至少包含二氧化硅，氧化锂，氧化铝和氧化铈的光敏玻璃基板制造和制造的器件的方法，掩蔽包括一个或多个孔的设计布局，以在感光玻璃基板上形成一个或多个导电路径 将感光玻璃基板的至少一部分暴露于激活能源，将感光玻璃基板暴露于高于其玻璃化转变温度至少十分钟的加热阶段，冷却感光玻璃基板以将至少部分暴露的 玻璃到结晶材料以形成玻璃晶体衬底并用蚀刻剂溶液蚀刻玻璃晶体衬底以形成一个或多个成角度的沟道，然后涂覆其上。
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公开(公告)号：WO2009048321A3
公开(公告)日：2009-06-04
申请号：PCT/NL2008000217
申请日：2008-10-03
Applicant: MICRONIT MICROFLUIDICS BV , VAN T OEVER RONNY , BLOM MARKO THEODOOR , OONK JOHANNES
Inventor： VAN T OEVER RONNY , BLOM MARKO THEODOOR , OONK JOHANNES
IPC: B81C1/00
CPC classification number: B81C1/00119 , B81B2203/0376 , B81C1/00103 , B81C2201/0146
Abstract: Methods for manufacturing a microstructure, wherein use is made of powder blasting and/or etching and a single mask layer with openings and structures of varying dimensions, characterized in that the mask layer at least at one given point in time has been wholly worn away within at least one region by mask erosion while the microstructure is not yet wholly realized. Use can be made of a combination of 'vertical' erosion, i.e. parallel to the thickness direction, and 'horizontal' erosion, i.e. perpendicularly of the thickness direction, of the mask layer. The horizontal mask erosion occurs at the edges of the mask structure. By selecting the size of the mask openings and the mask structures in a correct manner the mask layer in a region with smaller mask structures will be fully worn away at a given point in time, while in another region with larger structures the mask layer still has sufficient thickness to serve as protection against the powder blasting or etching.
Abstract translation: 用于制造微结构的方法，其中使用粉末喷射和/或蚀刻以及具有不同尺寸的开口和结构的单个掩模层，其特征在于，至少在一个给定时间点的掩模层已经完全磨损在内部 至少一个区域通过掩模侵蚀而微结构尚未完全实现。 使用可以由掩模层的“垂直”侵蚀，即平行于厚度方向和“水平”侵蚀，即垂直于厚度方向的侵蚀的组合。 在掩模结构的边缘处发生水平掩模腐蚀。 通过以正确的方式选择掩模开口和掩模结构的尺寸，具有较小掩模结构的区域中的掩模层将在给定时间点被完全磨损，而在具有较大结构的另一区域中，掩模层仍具有 足够的厚度以作为防止粉末爆破或蚀刻的保护。
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公开(公告)号：WO2007121948A3
公开(公告)日：2008-06-26
申请号：PCT/EP2007003497
申请日：2007-04-20
Applicant: FRAUNHOFER GES FORSCHUNG , QUENZER HANS-JOACHIM , ZWICKER GERFRIED
Inventor： QUENZER HANS-JOACHIM , ZWICKER GERFRIED
CPC classification number: B23H3/00 , B81C1/00634 , B81C2201/0146 , C25F3/14
Abstract: The invention relates to a method for treating the surfaces of an electrically conducting substrate surface (2). According to said method, a tool (1) comprising an ion-conducting solid material is contacted with the substrate surface at least in some areas thereof, said tool being adapted to conduct the metal ions of the substrate surface and an electric potential (U) being applied thereto so that an electric potential gradient is applied between the substrate surface and the tool in such a manner that the tool removes metal ions from the substrate surface or deposits them onto the substrate surface.
Abstract translation: 公开了一种用于在导电基底表面（2），其特征在于，固体离子传导材料表现出工具（1）在与基板表面接触使至少部分的表面处理的方法，进行基板表面的金属离子能够与所述 电位（U）被施加，以使得承载在衬底表面和工具之间的这样一种方式产生电势梯度，该金属离子通过从该衬底表面上的工具中提取，或沉积在基板表面上。
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