Abstract:
Provided are a scanning module and an image reading apparatus having the same. An alignment unit that can align positions of an image sensor and its tilt angles with regard to five degrees of freedom when a coupling position of an alignment member to a frame and a coupling position of a base plate to the alignment member are controlled, is provided, the image sensor can be aligned regardless of whether or not the production of the scanning module is completed, an alignment process is facilitated, and a manufacturing cost is reduce.
Abstract:
In a line head, a plurality of light emitters are arrayed on a substrate in a first direction. Each of the light emitters is operable to emit a light beam. In a rod lens array, a plurality of rod lenses are arrayed in the first direction, and each of the rod lenses is adapted to focus the light beam emitted from an associated one of the light emitters onto a target surface. The substrate and the rod lens array are attached to a holder elongated in the first direction. Positioning members are provided at both end portions of the holder in the first direction. A relative position between the substrate and at least one of the positioning members is variable in a second direction perpendicular to the first direction.
Abstract:
A scanning apparatus having an adjusting means is provided to allow the optical scanning module against the platen. The adjusting means is assembled with the carriage that carries the optical scanning module. The adjusting means at least comprises a roller and a rotated portion, wherein the roller tightly contacts the rotated portion. When the carriage is moving (during a scanning operation), the roller is rotating and friction (between the roller and the rotating assembly) causes the rotated portion to turn until contacting with the bottom surface of the optical scanning module, thereby allowing the optical scanning module against the platen.
Abstract:
Disclosed herein is an improved imaging system of the type having a photosensor package and at least one optical component, e.g, a lens, mounted within an optical assembly housing. The photosensor package may be mounted to a substrate, such as a printed circuit board, in a conventional manner. The substrate, however, may be formed having a shorter length than the photosensor package. This shorter length causes the ends of the photosensor package to extend beyond the substrate and, thus, be exposed. The exposed ends of the photosensor package, in turn, allow the photosensor package to be directly referenced to reference surfaces formed on the optical assembly housing.
Abstract:
An imaging system (60) comprises a housing (200) with reference surfaces (274,276), a lens (570) in contact with the reference surfaces (274,276), a member (600) retained to the housing in contact with the lens, and a spring (720) located between and in contact with a portion (282,332,342) of the housing and the lens. In a first operating condition, the member (600) is retained to the housing at a first location (350,360,370,380) and the lens is translatable with respect to the housing (200) and in a second operating condition, the member (600) is retained to the housing at a second location (420,424) and the lens is not translatable with respect to the housing.
Abstract:
An imaging system (60) comprises a housing (200) with reference surfaces (274,276), a lens (570) in contact with the reference surfaces (274,276), a member (600) retained to the housing in contact with the lens, and a spring (720) located between and in contact with a portion (282,332,342) of the housing and the lens. In a first operating condition, the member (600) is retained to the housing at a first location (350,360,370,380) and the lens is translatable with respect to the housing (200) and in a second operating condition, the member (600) is retained to the housing at a second location (420,424) and the lens is not translatable with respect to the housing.
Abstract:
In an imaging system (60) of the type having a photosensor package (510) and at least one optical component (570), e.g., a lens, mounted within an optical assembly housing (200), the photosensor package (510) is mounted to a substrate (540), such as a printed circuit board, which has a shorter length than the photosensor package (510). This shorter length causes the ends of the photosensor package (510) to extend beyond the substrate (540) and, thus, be exposed. The exposed ends (524, 526) of the photosensor package (510), in turn, allow the photosensor package (510) to be directly referenced to reference surfaces (442, 446, 450, 452) formed on the optical assembly housing (200).
Abstract:
In a lens focusing and holding arrangement for an imaging system (60) including a photosensor array (510), the lens (570) is in contact with a reference surface or surfaces (274, 276) formed within the imaging system housing (200) and is translatable along the surface (274, 276) in directions toward and away from the photosensor array (510) in order to adjust the focus of the imaging system (60). A lens retention clip (600) is provided to secure the lens (570) within the imaging system housing (200) and to cause translational movement of the lens (570) along the imaging system reference surface (274, 276). When focusing the imaging system (60), the lens retention clip (600) is in a first operating condition in which the lens retention clip (600) applies a relatively small force tending to hold the lens (570) in contact with the housing reference surface (274, 276). After the desired focus has been set, the lens retention clip (600) is placed in a second operating condition in which the lens retention clip (600) applies a relatively high force tending to hold the lens (570) in contact with the housing reference surface (274, 276), thus locking the lens (570) in place.
Abstract:
PROBLEM TO BE SOLVED: To provide an image scanner capable of suppressing image deterioration caused by temperature variation, without impeding productivity. SOLUTION: A substrate 22 having an image sensor 21 mounted thereon includes a round hole 22A and an oblong hole 22B. A bracket 23 includes a support section 23A having a screw hole 23C, and a support section 23B. When mounting the bracket 23 onto the substrate 22, first a screw 24 is screwed through the round hole 22A to the screw hole 23C, thereby fixes the substrate 22 onto the support section 23A. Next, a screw 25 is screwed through the oblong hole 22B to the screw hole 23C disposed on the support section 23B, and the substrate 22 is supported by the screw 25. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an image reader which adopts an off-axial optical system and in which an imaging mirror and a CCD-mounting-position adjusting means are fixed by a highly rigid structure and since the relative position between reflecting mirrors and imaging mirrors can be set highly accurately, adjusting only the CCD-mounting position allows a required specification of the read image to be met and the imaging mirror can easily be adjusted without distorting the reflecting surface when necessary. SOLUTION: The reflecting mirrors, the imaging mirrors, and the CCD-mounting-position adjusting means are positioned directly to reflecting-mirror supporting sections, imaging-mirror supporting sections, and CCD supporting sections, which are integrated with a carriage casing, and fixed to them. The CCD is fixed to the carriage casing with the CCD-mounting-position adjusting means. An imaging mirror close to a diaphragm and adjacent to the image is supported by a mirror adjusting plate. The position of the imaging mirror is adjusted by displacing the mirror adjusting plate. COPYRIGHT: (C)2005,JPO&NCIPI