公开(公告)号：US20040058073A1

公开(公告)日：2004-03-25

申请号：US10251911

申请日：2002-09-20

Inventor： W. Clayton Bunyard ,  Michael R. Lostocco ,  Kelly D. Branham

IPC: B05D003/10

CPC classification number: D21H17/455 ,  A61K8/0208 ,  A61K8/8152 ,  A61K2800/5426 ,  A61Q19/00 ,  D06M15/267

Abstract: The present invention is directed to triggerable, water-dispersible cationic polymers. The present invention is also directed to a method of making triggerable, water-dispersible cationic polymers and their applicability as binder compositions. The present invention is further directed to fiber-containing fabrics and webs comprising triggerable, water-dispersible binder compositions and their applicability in water-dispersible personal care products, such as wet wipes.

公开(公告)号：US20040033312A1

公开(公告)日：2004-02-19

申请号：US10641405

申请日：2003-08-15

Inventor： Alfred I-Tsung Pan

IPC: B05D003/02 ,  B05D003/10

CPC classification number: C04B41/89 ,  B22F7/002 ,  C04B41/009 ,  C04B41/4582 ,  C04B41/52 ,  C04B41/81 ,  C04B2111/00853 ,  H01M4/0471 ,  H01M4/9083 ,  H01M4/926 ,  Y10T428/249924 ,  Y10T428/249953 ,  C04B41/4539 ,  C04B41/51 ,  C04B41/4541 ,  C04B41/5105 ,  C04B41/5122 ,  C04B41/4564 ,  C04B41/522 ,  C04B35/00 ,  C04B35/52 ,  C04B38/00

Abstract: A method for sintering a porous coating on an open-structure substrate, i.e., a substrate with pre-made pores or openings. The open-structure substrate is spread with a coating paste that is prepared with such a viscosity so that the paste will not drip through the pores/openings on the open-structure substrate. The coating paste is then sintered to form a porous layer on the surface of the open-structure substrate. Optionally, the porous coating may be further coated with a catalyst for fuel cell applications.

Abstract translation: 一种用于在开放结构的基底上，即具有预制孔或开口的基底上烧结多孔涂层的方法。 开放结构基材用涂布糊剂扩散，该涂料浆料以这样的粘度制备，使得糊料不会滴在开放结构基材上的孔/孔中。 然后将涂料糊料烧结以在开放结构基材的表面上形成多孔层。 任选地，多孔涂层可以进一步涂覆用于燃料电池应用的催化剂。

公开(公告)号：US20040028817A1

公开(公告)日：2004-02-12

申请号：US10629392

申请日：2003-07-29

Applicant: Eastman Kodak Company

Inventor： Joanne Hunt ,  Julie Baker

IPC: B05D003/10

CPC classification number: B41M5/5254 ,  B41M5/5236 ,  C08J9/04

Abstract: The invention provides a method of making a material. The method comprises the step of coating a support with a solution comprising a hydrophilic polymer and a blowing agent. Either prior to or after the step of coating the support, the solution is interacted with in some way e.g. heated, to cause the blowing agent to generate gas bubbles within the solution, causing foaming of the hydrophilic polymer.

Abstract translation: 本发明提供一种制造材料的方法。 该方法包括用包含亲水性聚合物和发泡剂的溶液涂覆载体的步骤。 在涂覆载体的步骤之前或之后，溶液以某种方式相互作用，例如， 加热，使发泡剂在溶液内产生气泡，引起亲水性聚合物的发泡。

公开(公告)号：US20040009298A1

公开(公告)日：2004-01-15

申请号：US10404858

申请日：2003-04-01

Applicant: Wm. Marsh Rice University

Inventor： Cristin E. Moran ,  Corey J. Radloff ,  Nancy J. Halas

IPC: B05D003/10

CPC classification number: C23C18/1882 ,  C23C18/1879 ,  H05K3/182

Abstract: This process results in directed electroless plating of the metal to form discrete metal structures over the entire surface. Because the surface is pre-patterned with passivated regions inert to metal deposition, the metal is directed only to the unstamped regions. This allows the formation of unconnected metal structures without any chemical etching steps. These metallic arrays are varied in size, separation and shape by using gratings of different periodicities and blaze angles as the stamp templates. A variety of well-defined geometric patterns have been fabricated and imaged using scanning probe, scanning electron, and optical microscopies.

Abstract translation: 该过程导致金属的定向化学镀以在整个表面上形成离散的金属结构。 由于表面被预先图案化，具有对金属沉积惰性的钝化区域，所以金属仅被引导到无印迹区域。 这允许在没有任何化学蚀刻步骤的情况下形成未连接的金属结构。 这些金属阵列通过使用不同周期性和闪耀角的光栅作为印模模板而在尺寸，分离和形状上变化。 已经使用扫描探针，扫描电子和光学显微镜制造并成像了各种明确定义的几何图案。

公开(公告)号：US20030194494A1

公开(公告)日：2003-10-16

申请号：US10411257

申请日：2003-04-11

Applicant: RiTek Corporation

Inventor： Chung-I Chiang ,  Ming-Jen Wang ,  Kun-Hsien Cheng ,  Hong-Jueng King ,  Huei-Pin Huang ,  Chwei-Jing Yeh

IPC: C23C014/00 ,  B05D003/10 ,  B05D001/36 ,  B05D001/18

CPC classification number: G02B6/3636 ,  B23K35/0222 ,  C23C18/28 ,  C23C18/32 ,  C23C18/42 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/3861 ,  G02B6/4228

Abstract: ABSTRACT OF THE DISCLOSURE A method for forming the soldering layer of fiber array substrate surface has been disclosed herein. A plurality of fiber array bases having V-shape grooves are formed on a substrate, and a solder layer is formed on the whole substrate via chemical plating method of following steps: forming a layer of nickel/chromium (Ni/Cr) alloy or aluminum (Al) metal on said substrate through evaporation or sputtering; treating said surface of said substrate having V-shape grooves with a sensitizing solution for plating said surface with Sn2null, wherein said sensitizing solution comprises deionized water and SnCl2; treating said sensitized surface of said substrate with an activating solution for precipitating catalytic element Pd0 on said surface, wherein said sensitizing solution comprises 2 to 10 g/l of PdCl2 and 0.01 to 0.1 M HCl; and (E) immersing said treated surface into an electroless nickel plating solution to form a nickel metal layer on said treated surface.

Abstract translation: 发明内容本文已经公开了形成光纤阵列基板表面的焊接层的方法。 在基板上形成多个具有V形槽的光纤阵列基板，通过以下步骤的化学镀方法在整个基板上形成焊料层：形成镍/铬（Ni / Cr）合金或铝 （Al）金属通过蒸发或溅射在所述衬底上; 用所述表面用Sn 2+>的敏化溶液处理具有V形槽的所述基板的所述表面，其中所述敏化溶液包含去离子水和SnCl <下标2。 用所述表面上沉淀催化元素Pd 0>的活化溶液处理所述基材的所述敏化表面，其中所述敏化溶液包含2至10g / l的PdCl 和0.01至0.1 M HCl; 和（E）将所述处理的表面浸入无电镀镍溶液中以在所述处理的表面上形成镍金属层。

公开(公告)号：US20030190426A1

公开(公告)日：2003-10-09

申请号：US10117710

申请日：2002-04-03

Inventor： Deenesh Padhi ,  Joseph Yahalom ,  Sivakami Ramanathan ,  Chris R. McGuirk ,  Srinivas Gandikota ,  Girish Dixit

IPC: B05D003/10 ,  B05D001/36

CPC classification number: H01L28/84 ,  C23C18/1651 ,  C23C18/1694 ,  C23C18/1834 ,  C23C18/1844 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/32 ,  C23C18/50

Abstract: Methods and apparatus are provided for forming a metal or metal silicide layer by an electroless deposition technique. In one aspect, a method is provided for processing a substrate including depositing an initiation layer on a substrate surface, cleaning the substrate surface, and depositing a conductive material on the initiation layer by exposing the initiation layer to an electroless solution. The method may further comprise etching the substrate surface with an acidic solution and cleaning the substrate of the acidic solution prior to depositing the initiation layer. The initiation layer may be formed by exposing the substrate surface to a noble metal electroless solution or a borane-containing solution. The conductive material may be deposited with a borane-containing reducing agent. The conductive material may be used as a passivation layer, a barrier layer, a seed layer, or for use in forming a metal silicide layer.

公开(公告)号：US20030161954A1

公开(公告)日：2003-08-28

申请号：US10327515

申请日：2002-12-20

Inventor： Jason M. Blackburn ,  Albertina Cabanas ,  James J. Watkins

IPC: B05D005/12 ,  B05D003/10

CPC classification number: H01L21/28556 ,  C23C18/08

Abstract: Methods for depositing materials onto a substrate surface or into a porous solid are disclosed. These methods include suppressing contamination of the deposited materials.

Abstract translation: 公开了将材料沉积到基底表面或多孔固体上的方法。 这些方法包括抑制沉积材料的污染。

公开(公告)号：US20030118742A1

公开(公告)日：2003-06-26

申请号：US10341859

申请日：2003-01-14

Applicant: MacDermid, Incorporated

Inventor： Ronald Redline ,  David Sawoska ,  Peter Kukanskis

IPC: B05D001/18 ,  B05D003/10

CPC classification number: B23K35/007 ,  B05D5/12 ,  C23C18/42 ,  C23C18/54 ,  C25D3/46 ,  H05K3/244

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

公开(公告)号：US20030072888A1

公开(公告)日：2003-04-17

申请号：US10298665

申请日：2002-11-19

Inventor： Takeshi Nogami ,  Naoki Komai ,  Koichi Ikeda ,  Takashi Kinoshita ,  Kohei Suzuki ,  Nobuyuki Kawakami ,  Yoshito Fukumoto

IPC: B05D001/18 ,  B05D003/10

CPC classification number: H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02304 ,  H01L21/02343 ,  H01L21/31695 ,  H01L21/76801 ,  H01L21/7682 ,  H01L21/76826 ,  H01L21/76885 ,  H01L2221/1047

Abstract: A method of forming a buried wiring comprising the steps of: (A) forming a wiring and a first insulating layer filled between the wirings on a substratum, (B) immersing the first insulating layer in a fluid which can dissolve the first insulating layer, to dissolve the first insulating layer into the fluid, (C) substituting, for the fluid, a raw material solution containing a raw material for forming a second insulating layer, without bringing the wiring into contact with a gas, and (D) filling a second insulating layer formed by gelation in the raw material solution at least between the wirings, and then, drying off the raw material solution, thereby to form the second insulating layer at least between the wirings.

公开(公告)号：US20030054101A1

公开(公告)日：2003-03-20

申请号：US10150985

申请日：2002-05-17

Inventor： Woo Y. Lee ,  Yi-Feng Su ,  Limin He ,  Justin Daniel Meyer

IPC: C23C016/00 ,  B05D003/10

CPC classification number: C23C16/0218 ,  C23C16/403 ,  Y02T50/67 ,  Y10T428/25 ,  Y10T428/265 ,  Y10T428/31504

Abstract: A method for preparing an null-Al2O3 nanotemplate of fully crystalline null-Al2O3 directly on the surface of a metal alloy is provided. Also provided is a related apparatus.

Abstract translation: 提供了一种在金属合金表面上直接制备完全结晶的α-Al2O3的α-Al2O3纳米模板的方法。 还提供了一种相关装置。