公开(公告)号：US20040047394A1

公开(公告)日：2004-03-11

申请号：US10638062

申请日：2003-08-11

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Satoshi Shibata ,  Yuko Nambu

IPC: G01J005/00 ,  G01K007/00

CPC classification number: G01K11/00

Abstract: A test wafer for use in wafer temperature prediction is prepared. The test wafer includes: first semiconductor layer formed in a crystalline state; second semiconductor layer formed in an amorphous state on the first semiconductor layer; and light absorption film formed over the second semiconductor layer. Next, the test wafer is loaded into a lamp heating system and then irradiating the test wafer with a light emitted from the lamp, thereby heating the second semiconductor layer through the light absorption film. Thereafter, a recovery rate, at which a part of the second semiconductor layer recovers from the amorphous state to the crystalline state at the interface with the first semiconductor layer, is calculated. Then, a temperature of the test wafer that has been irradiated with the light is measured according to a relationship between the recovery rate and a temperature corresponding to the recovery rate.

公开(公告)号：US20040004989A1

公开(公告)日：2004-01-08

申请号：US10399758

申请日：2003-04-22

Inventor： Takashi Shigeoka

IPC: G01J005/00

CPC classification number: G01J5/08 ,  G01J5/0003 ,  G01J5/0007 ,  G01J5/0818 ,  G01J5/0821 ,  G01J5/0846

Abstract: A method of temperature measurement for measuring a temperature of an object to be measured that is heated by a heating source in a multiplex-reflection environment by using two radiation thermometers provided at a measurement part separated from the object to be measured is provided. In the method, two of the radiation thermometers have a rod that is embedded in the measurement part and can receive radiation light from the object to be measured, and an optical fiber connected to the rod; numerical apertures of the radiation thermometers are different; the multiplex-reflection environment is formed between a surface of the measurement part facing the object to be measured and the measurement part; a radiation rate null of the object to be measured based on a result of a measurement of two of the thermometers and the temperature of the object to be measured is calculated by the following equations nullnull1null(1nullNAnullN1)N2/(D1/D2) nulleffnull(1nullnull)nullnullnullnullnullnull/null1nullFnullrnull(1nullnull)nullwherein D1 represents a diameter of the rod of the radiation thermometers, NA represents the numerical aperture, D2 represents a distance between the object to be measured and the surface of the measurement part, r represents a reflectivity of the surface of the measurement part, F represents a view factor, null represents a multiplex reflection coefficient, nulleff represents an effective radiation rate of the object to be measured, and N1 and N2 are parameters.

Abstract translation: 提供一种温度测量方法，用于通过使用设置在与待测量物体分离的测量部分处的两个辐射温度计来测量在多重反射环境中由加热源加热的待测物体的温度。 在该方法中，辐射温度计中的两个具有嵌入测量部分中的杆，并且可以接收来自被测量物体的辐射光和连接到杆的光纤; 辐射温度计的数值孔径不同; 所述多重反射环境形成在所述测量部件的面向被测量物体的表面与所述测量部件之间; 通过以下等式计算基于两个温度计的测量结果和待测量物体的温度的被测量物体的辐射速率ε：α= 1-（1-NA.N1） epsiloneff =（1-α）.epsilon + alpha.epsilon / {1-Fr（1-epsilon）}其中D1表示辐射温度计的棒的直径，NA表示数值孔径， D2表示测量对象与测量部的表面之间的距离，r表示测量部的表面的反射率，F表示视点因子，á表示多重反射系数，å表示有效辐射率 要测量的对象，N1和N2是参数。

公开(公告)号：US20040001525A1

公开(公告)日：2004-01-01

申请号：US10184957

申请日：2002-07-01

Applicant: NORITAKE CO., LIMITED ,  Kuniyuki KITAGAWA

Inventor： Kenji Yano ,  Misao Iwata ,  Miyuki Hashimoto ,  Kuniyuki Kitagawa ,  Norio Arai ,  Satoshi Arai

IPC: G01J005/00

CPC classification number: G01J5/0003 ,  G01J5/602

Abstract: Method and apparatus for measuring a surface temperature of an object body, by calculating a temperature at each picture element of an image of the object body, on the basis of a radiant intensity ratio at each pair of corresponding picture elements of a first and a second image which are obtained with respective radiations having respective first and second wavelengths which are selected from a light emitted from the surface of the body, by a first filter which permits transmission therethrough a radiation having the first wavelength which is selected according to a radiant-intensity curve corresponding to a wavelength of a black body at a lower limit of a temperature measurement range, and which is within a high radiant-intensity range in which the radiant intensity is higher than a radiant intensity at a normal room temperature, and a second filter which permits transmission therethrough a radiation having the second wavelength which is selected within the high radiant-intensity range, such that the second wavelength is different from the first wavelength by a predetermined difference which is not larger than {fraction (1/12)} of the first wavelength and which is not smaller than a sum of half widths of the first and second wavelengths.

Abstract translation: 基于第一和第二对象的每对相应图像元素的辐射强度比，通过计算物体的图像的每个像素的温度来测量物体的表面温度的方法和装置 图像，其通过具有第一和第二波长的各自的辐射而获得，所述第一和第二波长从从所述主体的表面发射的光中选择，所述第一滤光器允许透射通过所述第一波长的辐射，所述辐射根据辐射强度 对应于在温度测量范围的下限处的黑体的波长的曲线，并且其处于辐射强度高于正常室温下的辐射强度的高辐射强度范围内;以及第二滤波器 其允许通过其中在高辐射强度运行中选择的具有第二波长的辐射 使得第二波长与第一波长不同的预定差异不大于{分数（第一波长的1/12，并且不小于第一和第二波长的半宽度的总和）。

公开(公告)号：US20030231694A1

公开(公告)日：2003-12-18

申请号：US10394206

申请日：2003-03-24

Inventor： Akihiro Ohsawa

IPC: G01J005/00

CPC classification number: G01J5/522 ,  G01J5/0003 ,  G01J5/0096 ,  G01J5/0205 ,  G01J5/08 ,  G01J5/0821 ,  G01J5/0896 ,  G01J5/10

Abstract: At the time when a temperature of a semiconductor wafer or the like is measured by light without contacting to it, its temperature is measured with high precision without suffering from an influence of changes in temperature of a light source, an influence of a bent degree or the like of an optical fiber or an influence of a displacement of an optical system such as a lens or the like. Light output from the light source is irradiated to the semiconductor wafer through an optical fiber for irradiated light. The light reflected from the semiconductor wafer is output as reflected light through an optical fiber for the reflected light. An optical fiber for reference light having substantially the same route as those of the optical fiber for irradiated light and the optical fiber for reflected light is disposed. The light output from the light source is output as the reference light through the optical fiber for reference light without being irradiated to or reflected from the semiconductor wafer. And, a temperature of the semiconductor wafer is measured according to the reflected light output from the optical fiber for reflected light and the reference light output from the optical fiber for reference light.

Abstract translation: 当半导体晶片等的温度通过光而不与其接触时，其温度以高精度测量，而不受光源温度变化的影响，弯曲度的影响或 光纤的类似物或诸如透镜等的光学系统的位移的影响。 从光源输出的光通过用于照射光的光纤照射到半导体晶片。 从半导体晶片反射的光作为反射光通过反射光的光纤输出。 布置具有与用于照射光的光纤基本相同的路径的参考光的光纤和用于反射光的光纤。 从光源输出的光作为参考光通过用于参考光的光纤输出，而不照射或从半导体晶片反射。 并且，根据从用于反射光的光纤的反射光和从用于参考光的光纤输出的参考光来测量半导体晶片的温度。

公开(公告)号：US20030230715A1

公开(公告)日：2003-12-18

申请号：US10064116

申请日：2002-06-12

Applicant: Ford Global Technologies, Inc.

Inventor： Jeffrey Thomas Remillard ,  Timothy Fohl ,  Willes H. Weber

IPC: G01J005/00

CPC classification number: G02B27/1086 ,  G02B23/12

Abstract: A lighting system for night vision applications including a near infrared light source, a visible light source, a beamsplitter and an optical element. The beamsplitter is arranged to reflect light emitting from either the near infrared light source or the visible light source and transmit light emitting from the other of the near infrared light source or visible light source so as to produce a color-corrected light source. The optical element is disposed a predetermined distance from the color-corrected light source. The optical element includes an input surface for receiving light from the color-corrected light source and an output surface for emitting the received light in a desired emission pattern. In one embodiment, each of the near infrared light source and visible light source is associated with respective first and second optical elements. The first and second optical elements are arranged such that the emission patterns of each optical element are substantially identical and overlapping to form a single color-corrected light emission pattern.

Abstract translation: 一种用于夜视应用的照明系统，包括近红外光源，可见光源，分束器和光学元件。 分束器被配置为反射从近红外光源或可见光源发射的光，并且发射从近红外光源或可见光源中的另一个发射的光，以便产生色彩校正的光源。 光学元件设置在距色彩校正光源预定距离处。 光学元件包括用于接收来自颜色校正的光源的光的输入表面和用于以期望的发射图案发射接收的光的输出表面。 在一个实施例中，近红外光源和可见光源中的每一个与相应的第一和第二光学元件相关联。 第一和第二光学元件布置成使得每个光学元件的发射图案基本上相同并重叠以形成单个颜色校正的发光图案。

公开(公告)号：US20030222218A1

公开(公告)日：2003-12-04

申请号：US10448047

申请日：2003-05-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinya Nozu

IPC: G01J005/00

CPC classification number: G01J5/06 ,  G01J5/16 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An infrared sensor includes a stem, a thermopile element disposed on a component-mounting surface of the stem, a case for covering the thermopile element, an inner cap that covers the thermopile element in order to shield infrared rays generated by secondary emission from an inside surface of the case, and a thermo-sensing element disposed inside the inner cap. In the infrared sensor, the case includes an infrared ray transmitting window for transmitting infrared rays radiating from an object. The inner cap is thermally coupled to the stem by being disposed on the component-mounting surface of the stem, and includes an opening for passing the infrared rays from the infrared ray transmitting window of the case towards the thermopile element. The thermopile element is disposed inside a recess in the component-mounting surface or so as to be substantially surrounded by a highly thermally conductive substrate disposed on the component-mounting surface.

Abstract translation: 一种红外线传感器，包括：杆，设置在杆的部件安装表面上的热电堆元件，用于覆盖热电堆元件的壳体;覆盖热电堆元件的内盖，以便屏蔽来自内部的二次发射产生的红外线 壳体的表面和设置在内盖内部的热敏元件。 在红外传感器中，壳体包括用于发射从物体辐射的红外线的红外线传输窗口。 内盖通过设置在杆的部件安装表面上而热连接到杆上，并且包括用于将来自壳体的红外线传输窗口的红外线传递到热电堆元件的开口。 热电堆元件设置在部件安装表面中的凹部内，或者被设置在部件安装表面上的高导热性基板基本包围。

公开(公告)号：US20030206573A1

公开(公告)日：2003-11-06

申请号：US10452551

申请日：2003-05-30

Inventor： John P. Gotthold ,  Anh N. Hoang ,  Surinder S. Sandhu ,  John Leonard Shaver ,  Terry M. Stapleton

IPC: G01J005/00

CPC classification number: G01J5/02 ,  G01J1/28 ,  G01J1/58 ,  G01J5/0003 ,  G01J5/0007 ,  G01J5/0205 ,  G01J5/025 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0821 ,  G01J5/084 ,  G01J5/0887 ,  G01K1/14 ,  G01K11/3213

Abstract: A temperature sensor utilizing optical temperature measuring techniques is constructed to make firm contact with a surface whose temperature is being measured, an example application being the monitoring of semiconductor wafers or flat panel displays while being processed. A cap is mounted near but spaced apart from an end of a lightwave guide, with a resilient element that applies force of the cap against a surface whose temperature is being measured as the cap is urged toward the optical fiber end. An optical temperature sensing element, such as luminescent material or a surface of known emissivity, is carried within the cap. A bellows with a closed end conveniently serves as both the cap and the resilient element. An alternative temperature measuring device installs an optical temperature sensing material within a test substrate behind an optical window, and then views the sensing material through the window.

公开(公告)号：US20030173518A1

公开(公告)日：2003-09-18

申请号：US10366458

申请日：2003-02-14

Applicant: Fuji Photo Optical Co., Ltd.

Inventor： Takao Ozaki

IPC: G01J005/00

CPC classification number: H04N5/2226 ,  H04N5/23212 ,  H04N5/33 ,  H04N5/332

Abstract: In a visible/infrared imaging camera comprising lightwave separating means for separating light into visible and infrared light components, and visible and infrared light camera units for capturing visible and infrared light images formed by the visible and infrared light components, respectively, the infrared light camera unit is supported so as to be movable axially of the infrared light component emitted from the lightwave separating means, thereby adjusting the focusing of the infrared light image.

Abstract translation: 在包括用于将光分离为可见光和红外光分量的光波分离装置的可见/红外成像相机和用于捕获由可见光和红外光分量形成的可见光和红外光图像的可见光和红外光相机单元中，红外光照相机 单元被支撑为能够从从光波分离装置发射的红外线分量轴向移动，从而调节红外光图像的聚焦。

公开(公告)号：US20030168598A1

公开(公告)日：2003-09-11

申请号：US10301418

申请日：2002-11-21

Inventor： Naoki Oda

IPC: G01J005/00

CPC classification number: G01J5/02 ,  G01J5/023 ,  G01J5/20

Abstract: A thermal infrared detector has a substrate having a readout circuit and a plurality of pixels patterned on the substrate at a pitch p in the range of 15nullpnull50 (nullm). Each of the pixels has a photo-sensitive area including a thin film of bolometer and spaced from the substrate, two beams by which the photo-sensitive area is supported on the substrate, and interconnections formed respectively on the beams and connecting the readout circuit and the thin film of bolometer to each other. The length of each of the beams is determined in view of the patterning accuracy of a stepper used to produce the thermal infrared detector, based on the beam length index which is calculated by dividing the length of each of the beams by one-quarter of the peripheral length of the pixel. The beam length index is given by an approximate expression using the pixel pitch as a parameter, determined depending on the thermal conductivity of the interconnection material, etc. based on an equation representing temperature resolution.

Abstract translation: 热红外检测器具有衬底，其具有读出电路和在衬底上以15≤p≤50（mum）的间距p图案化的多个像素。 每个像素具有包括测辐射热计薄膜和与衬底间隔开的光敏区域，光敏区域被支撑在衬底上的两个光束和分别形成在光束上并连接读出电路和 辐射热计的薄膜彼此。 考虑到用于产生热红外探测器的步进器的图形精度，基于通过将每个光束的长度除以四分之一而计算的光束长度指数来确定每个光束的长度 像素的周长。 基于表示温度分辨率的方程，通过使用像素间距作为参数，根据互连材料的热导率确定的参数的近似表达式给出光束长度指数。

公开(公告)号：US20030160171A1

公开(公告)日：2003-08-28

申请号：US10085226

申请日：2002-02-27

Inventor： William J. Parrish ,  Jeffrey L, Heath ,  Naseem Y. Aziz ,  Joseph Kostrzewa ,  George H. Poe

IPC: G01J005/00

CPC classification number: H04N5/365 ,  G01J5/22 ,  G01J5/522 ,  H04N5/33 ,  H04N5/361 ,  H04N5/3651 ,  H04N5/3655

Abstract: Microbolometer circuitry and methods are disclosed to allow an individual microbolometer or groups of microbolometers, such as a microbolometer focal plane array, to operate over a wide temperature range. Temperature compensation is provided, such as through circuitry and/or calibration methods, to reduce non-uniform behavior over the desired operating temperatures. For example, the relative mismatch in the temperature coefficient of resistance of an active microbolometer and a reference microbolometer is compensated by employing a variable resistor in series with the active microbolometer. The variable resistor can be calibrated over the desired temperature range to minimize the affect of the relative mismatch. Various other circuit implementations, calibration methods, and processing of the microbolometer circuit output can be employed to provide further compensation.

Abstract translation: 公开了微测辐射热量计电路和方法，以允许各自的微测辐射热计或微量热计的组，例如微测热计焦平面阵列在宽的温度范围内运行。 提供温度补偿，例如通过电路和/或校准方法，以减少在所需操作温度下的不均匀性。 例如，通过采用与活性微测热计串联的可变电阻来补偿有源微测热计和参考微测热计的电阻温度系数的相对不匹配。 可变电阻器可以在所需的温度范围内校准，以最小化相对不匹配的影响。 可以采用各种其他电路实施方案，校准方法和微测热计电路输出的处理来提供进一步的补偿。