公开(公告)号：GB2448571B

公开(公告)日：2009-09-16

申请号：GB0805417

申请日：2008-03-25

Applicant: AVAGO TECHNOLOGIES WIRELESS IP

Inventor： FAZZIO SHANE R ,  DAUKSHER WALTER J ,  GOEL ATUL

IPC: B06B1/06 ,  H04R17/02

Abstract: Transducer structures having multiple piezoelectric layer and annular contacts are described.

公开(公告)号：DE60232824D1

公开(公告)日：2009-08-13

申请号：DE60232824

申请日：2002-02-04

Applicant: AVAGO TECHNOLOGIES WIRELESS IP

Inventor： KWON YOUNGWOO ,  KIM JUNGHYUN ,  BAE SUNG-JUN

IPC: H03F3/68 ,  H04B1/04 ,  H03F1/02 ,  H03F1/07

Abstract: The present invention relates to a power amplification circuit of a mobile device for improving the efficiency and the linearity properties of the power amplifier. In one embodiment, the power amplifier improves these properties by controlling the input voltage of the supplemental amplifier so that the power amplifier operates as the Doherty mode in the low output power mode depending on the magnitude of the output power from the output unit and so that the input voltage of the supplemental amplifier may be increased up to satisfy the non-linear operational requirements of a power amplifier in the high output power mode. Moreover, because only the input voltage of the supplemental amplifier is controlled, the power amplifier can be implemented in a simple manner. Thus, the size of the power amplifier becomes small, which in turn reduces the cost of the power amplifier, among other things.

公开(公告)号：GB2420035B

公开(公告)日：2009-06-03

申请号：GB0522393

申请日：2005-11-02

Applicant: AGILENT TECHNOLOGIES INC ,  AVAGO TECHNOLOGIES GENERAL IP ,  AVAGO TECHNOLOGIES WIRELESS IP

Inventor： FENG HONGJUN ,  WANG KUN ,  BRADLEY PAUL D ,  RUBY RICHARD C

IPC: H03H9/02 ,  H03H9/17 ,  H03H9/205 ,  H03H9/56 ,  H03H9/58 ,  H03H9/60 ,  H03H9/70

Abstract: Acoustically coupled resonators include a first and a second acoustic resonator. Both the first and second acoustic resonators include a first electrode, a layer of piezoelectric material, and a second electrode. The first electrode is adjacent a first surface of the layer of piezoelectric material. The second electrode is adjacent a second surface of the layer of piezoelectric material. At least the second electrode has an edge that is tapered.

公开(公告)号：DE10207330B4

公开(公告)日：2009-05-20

申请号：DE10207330

申请日：2002-02-21

Applicant: AVAGO TECHNOLOGIES WIRELESS IP

Inventor： BRADLEY PAUL D ,  RUBY RICHARD C ,  LARSON JOHN D

IPC: H01L41/22 ,  H03H3/02 ,  B81C1/00 ,  H03H3/04 ,  H03H3/08 ,  H03H9/17 ,  H03H9/56 ,  H04R17/10

Abstract: A method for fabricating a resonator, and in particular, a thin film bulk acoustic resonator (FBAR), and a resonator embodying the method are disclosed. The resonator is fabricated on a substrate by fabricating a bottom electrode layer and a piezoelectric (PZ) layer over the bottom electrode layer. A selected portion of the PZ layer is partially etched. Then, a top electrode is fabricated over the selected portion of the PZ layer.

公开(公告)号：DE102008051243A1

公开(公告)日：2009-04-16

申请号：DE102008051243

申请日：2008-10-10

Applicant: AVAGO TECHNOLOGIES WIRELESS IP

Inventor： HANDTMANN MARTIN ,  KAITILA JYRKI ,  THALHAMMER ROBERT ,  GEBAUER BERNHARD

IPC: H03H9/205 ,  H03H9/50

公开(公告)号：GB0903443D0

公开(公告)日：2009-04-08

申请号：GB0903443

申请日：2009-02-27

Applicant: AVAGO TECHNOLOGIES WIRELESS IP

Abstract: A method for manufacturing a coupled resonator device includes forming a first BAW-device on a first substrate, forming a second BAW-device on a second substrate, and bonding the first and the second BAW-device such that the bonded first and second BAW-device are sandwiched between the first and second substrate.

公开(公告)号：DE112004002875B4

公开(公告)日：2009-01-08

申请号：DE112004002875

申请日：2004-12-02

Applicant: AVAGO TECHNOLOGIES WIRELESS IP

Inventor： JEON MOON SEOK ,  JUNG SANG HWA ,  KIM JUNG HYUN

IPC: H03F1/30 ,  H03F3/19

Abstract: Provided is a temperature-compensated bias circuit for a power amplifier, in which a first resistor (Rref) connected to a reference voltage is connected to a base terminal of a third transistor (Q 3 ) and an emitter terminal of the third transistor is connected to a first diode (D 1 ). The temperature-compensated bias circuit includes a second resistor (R 1 ) connected to the reference voltage, a third resistor (R 2 ) connected to the second resistor in series, a fourth resistor (Rc) having one terminal connected to the reference voltage, a fifth resistor (Re) having one terminal connected to ground, a bias transistor (Q 4 ) having a base terminal connected to a contact point (VS) between the second resistor and the third resistor, a collector terminal connected to the other terminal of the fourth resistor, and an emitter terminal connected to the other terminal of the fifth resistor, and a sixth resistor (Rf) connected between a collector terminal of the third transistor and a collector terminal of the bias transistor.

公开(公告)号：DE60039816D1

公开(公告)日：2008-09-25

申请号：DE60039816

申请日：2000-05-26

Applicant: AVAGO TECHNOLOGIES WIRELESS IP

Inventor： BRADLEY PAUL D ,  LARSON JOHN D III ,  RUBY RICHARD C

IPC: H03H9/25 ,  H03H9/58 ,  H03H9/17 ,  H03H9/56 ,  H03H9/70 ,  H04B1/50

Abstract: A band-pass filter comprising shunt elements and series elements in which the series elements and the shunt elements are connected to form a ladder circuit, and each of the elements includes a film bulk acoustic resonator (FBAR). An FBAR-based duplexer comprises a first port, a second port, a third port, a first FBAR-based band-pass filter as just described connected between the first port and the third port and a series circuit connected between the second port and the third port. The series circuit includes a 90 DEG phase shifter in series with a second FBAR-based band-pass filter as just described.

公开(公告)号：GB2445383A

公开(公告)日：2008-07-09

申请号：GB0620152

申请日：2006-10-11

Applicant: AVAGO TECHNOLOGIES GENERAL IP ,  AVAGO TECHNOLOGIES WIRELESS IP

Inventor： LARSON JOHN D III

IPC: H03H9/17 ,  H03H9/02

Abstract: The acoustic galvanic isolator or electrically-isolating acoustic coupler comprises a single decoupled stacked bulk acoustic resonator (DSBAR) (100, fig 2). An electrically-isolating acoustic coupler (16) based on a single DSBAR is physically small and is inexpensive to fabricate yet is capable of passing information signals having data rates in excess of 100 Mbit/s and has a substantial breakdown voltage between its inputs and its outputs. The embodiment comprises a carrier signal source 51, a modulator 14 connected to receive an information signal and the carrier signal, a demodulator 18, and an electrically-isolating acoustic coupler 16 connected between the modulator 14 and the demodulator 18.

公开(公告)号：DE10242657B4

公开(公告)日：2008-07-03

申请号：DE10242657

申请日：2002-09-13

Applicant: AVAGO TECHNOLOGIES WIRELESS IP

Inventor： FRANK MICHAEL LOUIS

IPC: H03H9/46 ,  H03H9/64 ,  H03H9/00 ,  H03H9/54

Abstract: A differential filter includes a first input, a second input, a first output, a second output, and a plurality of acoustic resonator elements. The plurality of acoustic resonator elements is connected to the first input, the second input, the first output and the second output. The acoustic resonator elements are arranged to form at least two of a lattice structure, a full ladder structure and a paired half ladder structure.