Abstract:
An apparatus for processing a processing surface 100 of a wafer 105 by means of a processing-beam 200 comprises a means for moving the wafer 105 and the processing-beam 200 relative to each other so that the processing-beam 200 scans the processing surface 100 of the wafer 105 in a scanning path 110 having a curved course with continuously or stepwise changing radiuses.
Abstract:
PROBLEM TO BE SOLVED: To provide an acoustic resonator filter which can be designed so as to have an enhanced proximity frequency blocking characteristic and to adjust a filter attenuation characteristic in order to block a desired frequency or a frequency range. SOLUTION: A band pass filter includes input and output terminals 505 and 555, first and second acoustic resonators 510 and 520, and an acoustic coupling layer 530. The first acoustic resonator 510 includes first and second electrodes 512, 514 and a piezoelectric layer 516 formed between these first and second electrodes. A first electrode of the first acoustic resonator is connected to the input terminal. The second acoustic resonator 520 includes first and second electrodes 522, 524 and a piezoelectric layer 526 formed between these first and second electrodes. Acoustic coupling is imparted between the second electrode of the first acoustic resonator and the first electrode of the second acoustic resonator, and the output terminal is connected to the second electrode of the second acoustic resonator. A capacitor 550 is formed to be extended between the input and output terminals, the frequency response of the filter includes at least two transmission zeros. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an acoustic resonator structure for inhibiting lateral mode vibration as unnecessary vibration, and to provide an electric filter using the acoustic resonator structure. SOLUTION: As for a thin-film bulk acoustic resonator(FBAR) as a kind of piezoelectric resonator, the resonator 200 has a lower electrode 207, a piezoelectric element 206, and an upper electrode 201, which are laminated sequentially on a cavity 208 formed on a substrate 205. The lower electrode 207 and the upper electrode 201 have substantially equal profile and dimensions. An action region of the resonator 200 is demarcated by an overlapped area of the lower electrode 207 and the upper electrode 201. In this structure, a frame element 204, which brings mismatching of acoustic impedance between the upper electrode 201 and an upper connection portion 203, is located at an interface between the upper electrode 201 and the upper connection portion 203. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an acoustic resonator of high quality coefficient suppressing dispersion of resonance energy to the outside of the resonator. SOLUTION: In an acoustic resonator that includes a substrate, a first electrode adjacent the substrate and having an outer perimeter, a layer of piezoelectric material adjacent the first electrode, and a second electrode adjacent the layer of piezoelectric material and having an outer perimeter, around either the first electrode or the second electrode, a frame region or frame is formed by alternating regions of different acoustic impedance. For example, a protruding or rushing-in portion is formed in an electrode by lifting-off. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a bulk acoustic resonator including a non-piezoelectric layer.SOLUTION: A first electrode 105 is suspended over a substrate 103 and a cavity 104. A piezoelectric layer 107 is placed on the first electrode 105 and composed of a fine-grained c-axis piezoelectric material, e.g. aluminum nitride (AlN) or zinc oxide (ZnO). A non-piezoelectric layer 108 is typically composed of the same material as that of the piezoelectric layer 107, but it is amorphous or polycrystalline and exhibits little or no piezoelectric effect. A second electrode 101 is placed on the piezoelectric layer 107 or the non-piezoelectric layer 108. Overlap of the cavity 104, the first electrode 105, the piezoelectric layer 107, and the second electrode 101 defines the active region 109 of a resonator.
Abstract:
PROBLEM TO BE SOLVED: To provide an acoustic mirror type of resonator providing good reflectivity with a relatively small number of layers but not introducing capacitive coupling to other resonators formed on the same substrate and using the same acoustic mirror. SOLUTION: The present invention relates to a method for fabricating a multi-resonator bulk acoustic wave (BAW) filter, including the steps of: (a) choosing dielectric materials serving as an acoustic mirror and metallic materials; and (b) providing at least one of the metallic layers via a fabrication procedure in which the metallic layer is patterned into distinct portions by an etching process that removes enough of the metallic layer between where different resonator sections are to be placed so as to provide electrical isolation between the portions of the layer beneath the different resonator sections, thereby providing a multi-resonator BAW filter with reduced capacitive coupling between resonators. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a resonator equipped with a temperature compensation function. SOLUTION: A pair of temperature-compensated resonators (300, 390) include a first resonator (111) which is composed so as to resonate with a first frequency (f01) and has a first frequency-temperature coefficient (TC1), and a second resonator (121) which is composed so as to resonate with a second frequency (f02) and has a second frequency temperature coefficient (TC2). The second frequency (f02) is higher than the first frequency (f01) and the second frequency-temperature coefficient (TC2) is smaller than the first frequency-temperature coefficient (TC1). The first resonator (111) and the second resonator (121) are formed on the same substrate (306). COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a narrow-band bandpass filter network and method for bandpass filtering signals with narrow bandwidth of a desired frequency band (ISM 2.4 band or the like). SOLUTION: The bandpass filter network and method for bandpass filtering signals uses multiple acoustic resonators. The acoustic resonators may be Film Bulk Acoustic Resonators (FBARs) or Surface Acoustic Wave (SAW) resonators. The acoustic resonators are separated by one or more electrical components (for example, multiple transistors of a single amplifier) to provide isolation between the multiple acoustic resonators. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an acoustic resonator structure, in a BAW resonator, by conquering an acoustic loss reducing a Q factor since the Q factor is reduced in the BAW resonator having an active domain because of the case where the loss may be enlarged by a connecting part to the active domain.SOLUTION: A solid-mount bulk acoustic resonator 100 comprises a first electrode 102, a second electrode 104, a piezoelectric layer 103 disposed between the first electrode and the second electrode, and an acoustic reflector 105 disposed below the first electrode, the second electrode and the piezoelectric layer and comprised of a plurality of layers. Portions of the first electrode, the second electrode and the piezoelectric layer overlapped with the acoustic reflector define an active domain 114 of the acoustic resonator, and the piezoelectric layer extends on an end (edge) of the first electrode. Furthermore, the acoustic resonator comprises a bridge 108 adjacent to a terminal of the active domain of the acoustic resonator. The bridge overlaps with a part of the first electrode.
Abstract:
PROBLEM TO BE SOLVED: To provide a transducer structures having multiple piezoelectric layer and annular contacts. SOLUTION: The transducer structure includes a first transducer. The first transducer comprises: a first inner electrode; a first outer electrode; a lower inner electrode; a lower outer electrode; a first piezoelectric element disposed between the first electrodes and the lower electrodes; a first gap between the first inner electrode and the first outer electrode; and a lower gap between the lower inner electrode and the lower outer electrode. The transducer structure also includes a second transducer, which comprises: a second inner electrode; a second outer electrode; the lower inner electrode; the lower outer electrode; a second piezoelectric element disposed between the second electrodes and the lower electrodes; and a second gap between the second inner electrode and the second outer electrode. COPYRIGHT: (C)2009,JPO&INPIT