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公开(公告)号：JP2006213996A
公开(公告)日：2006-08-17
申请号：JP2005030837
申请日：2005-02-07
Inventor： MIURA SHIGENORI
Abstract: PROBLEM TO BE SOLVED: To provide a method for forming such a thin film of an Sn alloy as to have whisker formation resistance balanced with adequate solderability (low melting point), and have a small and uniform thickness without causing inconvenience such as abrasion due to imperceptible sliding. SOLUTION: The method for forming the thin film of the Sn-Ag-Cu ternary alloy on a substrate comprises immersing the substrate in a plating bath and forming the thin film of the Sn-Ag-Cu ternary alloy on the whole area or a part of the substrate by electroplating, wherein the plating bath includes at least an Sn compound, an Ag compound, a Cu compound, an inorganic chelating agent and an organic chelating agent, wherein the inorganic chelating agent is blended at a ratio of 1 pts.mass to 300 pts.mass with respect to the Ag compound of 1 pts.mass; and the organic chelating agent is blended at a ratio of 1 pts.mass to 200 pts.mass with respect to the Cu compound of 1 pts.mass. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种形成这样的Sn合金薄膜的方法，其具有平衡具有足够可焊性（低熔点）的晶须形成电阻，并且具有小而均匀的厚度，而不会引起诸如 由于不可察觉的滑动造成磨损。 解决方案：在基板上形成Sn-Ag-Cu三元合金薄膜的方法包括将基板浸入镀浴中，并在整个区域上形成Sn-Ag-Cu三元合金薄膜 或一部分电镀，其中，所述电镀浴至少含有Sn化合物，Ag化合物，Cu化合物，无机螯合剂和有机螯合剂，其中所述无机螯合剂以1 相对于1 pts.mass的Ag化合物，pts.mass至300 pts.mass; 相对于1质量份的Cu化合物，有机螯合剂以1质量份〜200质量比的比例共混。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005019513A
公开(公告)日：2005-01-20
申请号：JP2003179343
申请日：2003-06-24
Inventor： MIURA SHIGENORI
CPC classification number: H05K1/0287 , H05K1/0393 , H05K3/426 , H05K2201/09609
Abstract: PROBLEM TO BE SOLVED: To provide a conductive sheet which has reliable electric connectivity, reduced in production cost, and improved in dimensional accuracy simultaneously.
SOLUTION: A conductive layer is formed on both the front and rear surface of the insulating base of the conductive sheet respectively, the conductive layers formed on the surfaces of the insulating base are electrically connected together through a through-hole bored in the insulating base penetrating through it, and the conductive layer of the same composition is formed on the front and rear surface of the insulating base and on the inner wall of the through-hole in the same process.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：提供具有可靠的电连接性，降低生产成本并且同时提高尺寸精度的导电片。 解决方案：在导电片的绝缘基底的前表面和后表面上分别形成导电层，形成在绝缘基底表面上的导电层通过钻孔的通孔电连接在一起 绝缘基底穿透它，并且在相同工艺中，绝缘基底的前后表面和通孔的内壁上形成相同组成的导电层。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2004188654A
公开(公告)日：2004-07-08
申请号：JP2002356696
申请日：2002-12-09
Inventor： MIURA SHIGENORI
IPC: B32B9/00 , B32B7/02 , C23C14/02 , C23C14/14 , C23C14/20 , H01B5/14 , H01L21/3205 , H01L21/768 , H01L23/522
CPC classification number: C23C14/024 , C23C14/20
Abstract: PROBLEM TO BE SOLVED: To provide a conductive sheet of which the dimensional stability is highly ensured and the high frequency characteristics are also made excellent by enhancing the adhesion of a substrate sheet being an insulating film and a conductive layer while enabling the formation of a fine circuit pattern and improving the moisture absorbability of the substrate sheet. SOLUTION: The conductive sheet has a surface not subjected to surface roughening treatment and is characterized in that the insulating film which is reduced to 1 mass % or less in the content of a moisture-containing volatile component is used as the substrate sheet, an Si-containing layer is formed to at least one of both surfaces of the substrate sheet and the conductive layer is formed on the Si-containing layer. COPYRIGHT: (C)2004,JPO&NCIPI
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公开(公告)号：JP2004176107A
公开(公告)日：2004-06-24
申请号：JP2002342157
申请日：2002-11-26
Inventor： MIURA SHIGENORI
CPC classification number: H01L2924/01046 , H01L2924/01078
Abstract: PROBLEM TO BE SOLVED: To provide a terminal in which a surface metal layer is not peeled, and which has high hardness, and has high heat resistance and corrosion resistance as well, and to provide a part having the same.
SOLUTION: The terminal includes a ruthenium layer formed on conductive substrate, and a surface metal layer made of at least one of the metals selected from the group consisting of Au, Ag, Pd and Rh, or made of an alloy containing at least one of the metals selected from the group is formed on the ruthenium layer.
COPYRIGHT: (C)2004,JPOAbstract translation: 要解决的问题：为了提供表面金属层未被剥离并且具有高硬度并且具有高耐热性和耐腐蚀性的端子，并且提供具有该端子的部件。 解决方案：端子包括形成在导电基板上的钌层和由选自Au，Ag，Pd和Rh中的至少一种金属制成的表面金属层，或由含有 选自组中的至少一种金属形成在钌层上。 版权所有（C）2004，JPO
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Patent Agency Ranking
公开(公告)号：JP3520285B1
公开(公告)日：2004-04-19
申请号：JP2002311001
申请日：2002-10-25
Applicant: Fcm株式会社
Inventor： 茂紀 三浦
IPC: B32B15/01 , B32B15/08 , C23C14/16 , C23C28/00 , C23C28/02 , C23C30/00 , C25D5/10 , C25D5/30 , C25D5/44 , C25D5/50 , C25D7/00 , H01L21/28 , H01L21/288
CPC classification number: B32B15/08 , B32B7/12 , B32B15/017 , B32B15/20 , B32B2309/105 , B32B2311/24 , C23C14/165 , C23C28/023 , C23C30/00 , C25D5/10 , C25D5/50 , Y10T428/12438 , Y10T428/12569 , Y10T428/12736
Abstract: 【要約】 【課題】 電気電子部品、半導体回路、自動車関連製品等に使用されるアルミニウム系素材において、簡易な方法でアルミニウム表面を安定化させたアルミニウム安定化積層体を提供することを目的とする。 【解決手段】 表面が少なくともアルミニウムで構成される薄膜の全面に、金属で構成される厚み０．００１〜
１μｍの安定化層をスパッタリング法、蒸着法またはイオンプレーティング法のいずれかの方法により積層してなるアルミニウム安定化積層体に関する。-
公开(公告)号：JP2004103504A
公开(公告)日：2004-04-02
申请号：JP2002266961
申请日：2002-09-12
Inventor： MIURA SHIGENORI
Abstract: PROBLEM TO BE SOLVED: To provide a conductive sheet that has a superior adhesion strength to a conductive layer using a liquid crystal polymer film as a base sheet.
SOLUTION: In the conductive sheet, a first conductive layer made of a first metal is formed on either one of the front or rear face or on both faces of the base sheet made of liquid crystal polymer film, and a second conductive layer made of a second metal is formed on the top of it so that it becomes thicker than the first conductive layer.
COPYRIGHT: (C)2004,JPOAbstract translation: 要解决的问题：提供一种使用液晶聚合物膜作为基片对导电层具有优异粘附强度的导电片。 解决方案：在导电片中，由第一金属制成的第一导电层形成在由液晶聚合物膜制成的基片的前表面或背面或两面上的任一个上，第二导电层 由第二金属制成，使其比第一导电层变厚。 版权所有（C）2004，JPO
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公开(公告)号：JP2004014550A
公开(公告)日：2004-01-15
申请号：JP2002161518
申请日：2002-06-03
Inventor： MIURA SHIGENORI
IPC: B32B7/02 , H01L21/48 , H01L21/60 , H01L23/12 , H01L23/498 , H05K1/02 , H05K1/11 , H05K3/06 , H05K3/38 , H05K3/42
CPC classification number: H01L21/486 , H01L23/4985 , H01L2924/0002 , H05K3/423 , H05K2201/0394 , H05K2201/09563 , H05K2203/0733 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a conductive sheet which ensures specific electric resistance in a via hole of any size while enhancing reliability in the electrical connection between conductive layers formed on both sides of an insulating film, respectively, and has good manufacturing efficiency without the breakage problem of voids.
SOLUTION: The conductive sheet is provided with the conductive layers each formed on the surface and the rear of the insulating film. A material which constitutes at least one of the conductive layers is filled in each of the via holes, which physically pass through the insulating film, so that the insides of the holes are each entirely filled with the material. Thus, electrical connection can be established between both the front and the rear conductive layers.
COPYRIGHT: (C)2004,JPO-
公开(公告)号：JP2017176801A
公开(公告)日：2017-10-05
申请号：JP2016131479
申请日：2016-07-01
Applicant: FCM株式会社
Inventor： 森田 陽大
IPC: A61F13/42 , A61F13/534 , A61F5/44
Abstract: 【課題】使用者の快適な利用が可能な液体検知センサを提供する。 【解決手段】本発明は、使用者から排出される液体を検知するための液体検知センサである。液体検知センサは、使用者の肌に接する第1面と、第1面の反対側の第2面とを有する吸収体と、第2面に配置されたICタグと、を備える。吸収体は、第1面側から第2面側に向けて液体を浸透させることが可能な不織布からなり、吸収体の密度は0.25g/cm 3 以下であり、第1面と第2面との距離を吸収体の厚みとした場合、その厚み方向に20g/cm 2 の圧力が負荷されたときの厚みが2mm以上である。 【選択図】図2
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公开(公告)号：JP2010045155A
公开(公告)日：2010-02-25
申请号：JP2008207767
申请日：2008-08-12
Inventor： MIURA SHIGENORI
IPC: H05K3/46
CPC classification number: H05K1/115 , H05K1/0393 , H05K1/113 , H05K3/388 , H05K3/426 , H05K3/4602 , H05K2201/09563 , H05K2201/0979
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer laminated circuit board hardly causing the breaking of a wire of a metal circuit. SOLUTION: The multilayer laminated circuit board 1 is a multilayer laminated circuit board including a lamination structure of alternately laminating a resin film 100 and a circuit layer 200. The board is characterized in that the resin film 100 has one or more multi-conduction parts 110, the multi-conduction part 110 occupies an area with a diameter of ≥10 μm and ≤3000 μm and has two or more conduction vias 120, and the conduction via 120 has an inner diameter of ≥5 μm and ≤300 μm. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供一种几乎不引起金属电路的导线断裂的多层叠层电路板。 解决方案：多层叠电路板1是包括交替层叠树脂膜100和电路层200的叠层结构的多层叠电路板。其特征在于，树脂膜100具有一个或多个多层叠电路板， 导电部110，多导体部110占据直径≥10μm，≤3000μm的区域，具有两个以上的导通通路120，导通通孔120的内径为≥5μm，≤300μm 。 版权所有（C）2010，JPO＆INPIT
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