Abstract:
An improved BiCMOS logic circuit (70) utilizes an emitter-coupled pair of bipolar transistors (21, 22) for differentially comparing an input signal (Vin) with a logic reference level (VBIAS). Each of the bipolar transistors are resistively loaded by a network of p-channel metal-oxide-semiconductor (PMOS) transistors (26, 27) coupled in parallel. At least one of the parallel combination of transistors has its gate coupled to a control signal (VREF2) providing a variable load resistance. The control signal is preferably provided by a feedback network (52, 53) which maintains a constant voltage swing across the network over temperature.
Abstract:
A microscopic laminar-flow heat exchanger, well-suited for cooling a heat generating device such as a semiconductor integrated circuit, includes a plurality of thin plates (10), laminated together to form a block (18). Each plate has a pair of holes (14, 15) cut through the plate such that when the block is formed, the holes align to form a pair of coolant distribution manifolds. The manifolds are connected via the plurality of microscopic channels formed from the recessed portions during the lamination process. Coolant flow through these channels effectuates heat removal.
Abstract:
A method for forming a BICMOS integrated circuit having MOS field effect transistors and bipolar junction transistors is disclosed. The process comprises first defining separate active areas, forming a gate dielectric layer and a first layer of polysilicon. This polysilicon is then selectively etched to form a plurality of equally-spaced first polysilicon members comprising the gates (33, 34) of the MOS transistors and the extrinsic base contacts (35) of the NPN transistors. After insulating the first polysilicon members, an additional layer of polysilicon is deposited over the substrate to replanarize the entire wafer surface. The additional layer of polysilicon is then etched to form a plurality of second polysilicon members (65, 66, 67, 68, 69). Impurities are diffused from the polysilicon members to form source/drain regions (73, 74, 75, 76) of the MOS transistors and the extrinsic base (81) and emitter (77) regions of the NPN transistors. The final processing steps include providing the interconnection of the MOS and NPN transistors.
Abstract:
Expandably wide operations are disclosed in which operands wider than the data path between a processor and memory are used in executing instructions. The expandably wide operands reduce the influence of the characteristics of the associated processor in the design of functional units performing calculations, including the width of the register file, the processor clock rate, the exception subsystem of the processor, and the sequence of operations in loading and use of the operand in a wide cache memory.
Abstract:
There is disclosed a photolithography mask and method of making the same that utilizes serifs to increase to correspondence between an actual circuit design and the final circuit pattern on a semiconductor wafer. The mask uses a plurality of serifs having a size determined by a resolution limit of the optical exposure tool used during the fabrication process. The serifs are positioned on the corner regions of the mask such that a portion of surface area for each of the serifs overlaps the corner regions of the mask. The size of the serifs is about one-third the resolution limit of said optical exposure tool. About 33 to about 40 percent of the total surface area of the serifs overlap the corner regions of the mask.
Abstract:
A virtual memory system including a local-to-global virtual address translator for translating local virtual addresses having associated task specific address spaces into global virtual addresses corresponding to an address space associated with multiple tasks, and a global virtual-to-physical address translator for translating global virtual addresses to physical addresses. Local-to-global virtual translation is performed by either mapping local virtual addresses to a single global virtual address space or to multiple global virtual address spaces. The local-to-global virtual translator includes a cell which corresponds to each local address space for performing the translations. Separate cache and tag structures are employed for handling data and instruction memory accesses. The cache can be configured into a buffer portion or a cache portion for faster cache accesses. Protection information is provided by each of the local virtual-to-global virtual address translator, the global virtual-to-physical address translator, the cache tag storage, or a protection information buffer depending on whether a cache hit, cache miss, or buffer access occurs during a given data or instruction access. Memory area privilege protection is also achieved by employing a gateway instruction which generates an address to access a gateway storage area.
Abstract:
An output buffer that controls the slew rate of its output signal is disclosed. The buffer includes a pull-up and a pull-down bipolar transistor (Q1, Q2) coupled at a common output node in series between VDD and VSS. The buffer also includes a first set of parallel MOS devices (N5-N8) coupled between the common output node and the base of the pull-down bipolar transistor (Q2). A second set of parallel MOS devices (P1-P4) are coupled between the base of the pull-up output stage bipolar transistor (Q1) and VDD. The gates of each set of MOS devices are coupled to a digital select signal. The amount of current driving the base of each of the pull-up and pull-down transistors (when they are enabled) is determined by the number of MOS devices enabled by the digital select signal. Thus, the buffer of the present invention is able to adjust the slew rate of its output signal to accommodate different loads coupled to the common output node.
Abstract:
A current mode access BiCMOS memory cell is disclosed. The memory cell includes a CMOS storage cell for storing first and second CMOS voltage potentials, VDD and VSS, corresponding to first and second logic levels. The storage cell comprises two CMOS inverters coupled between VDD and VSS. The storage cell is coupled to a conversion circuit. The conversion circuit is coupled between third and fourth ECL working potentials. It functions to convert the first and second CMOS voltage potentials into the third and fourth working potentials. The third and fourth voltage potentials are coupled to the bases of two bipolar signal converters. The emitters of the bipolar signal converters are coupled to a selectable current source and the collectors of the bipolar signal converters are coupled to complementary bit lines. The selectable current source is responsive to a read word signal. A differential current signal representing the data stored in the memory cell is established in the complementary bit lines when the current source is selected and current is allowed to flow through one of the bipolar signal converters. The third and fourth ECL voltage potentials are chosen such that they ensure that the bipolar signal converters are not driven into saturation. In this way, read times are optimized. In addition, read times are reduced since peak-to-peak voltages of the current mode differential signal established across the complementary bit lines are reduced.
Abstract:
A large burst mode memory (10) accessing system (15) includes N discrete sub-memories (11, 12) and three main I/O ports (17, 18, 19). Data is stored in the sub-memories so that the sub-memories (11, 12) are accessed depending on their proximity to the main I/O ports (17, 18, 19). Three parallel pipelines (1, 2, 3) provide a data path to/from the main I/O ports (17, 18, 19) and the sub-memories (11, 12). The first pipeline (1) functions to couple address/control signals to the memories such that adjacent sub-memories are accessed in half cycle intervals. The second pipeline (2) functions to propagate accessed data from the sub-memories to the main I/O ports such that data is outputted from the main output port every successive clock cycle. The third pipeline (3) propagates write data to the memories such that data presented at the input of the third pipeline on successive clock cycles is written into successive sub-memories. Redundancy circuits preserve data integrity without memory access interruption.
Abstract:
A bipolar junction transistor (BJT) which exhibits a suppressed Kirk Effect comprises a lightly-doped n-type collector region (11) formed above a more heavily-doped n+ layer (12). Directly above the collector is a p-type base which has an extrinsic region (17) disposed laterally about an intrinsic region (18). An n+ emitter (20) is positioned directly above the intrinsic base region. The BJT also includes a localized n+ region (15) disposed directly beneath the intrinsic base region which significantly increases the current handling capabilities of the transistor.
Abstract translation:显示抑制Kirk效应的双极结型晶体管(BJT)包括形成在更重掺杂的n +层(12)上方的轻掺杂的n型集电极区域(11)。 集电极的正上方是p型基体,其具有围绕本征区域横向设置的非本征区域(17)。 n +发射极(20)位于本征基极区的正上方。 BJT还包括直接位于本征基极区下方的局部n +区(15),这显着增加了晶体管的电流处理能力。