-
公开(公告)号：KR1020080088112A
公开(公告)日：2008-10-02
申请号：KR1020070030544
申请日：2007-03-28
Applicant: 삼성전기주식회사
Abstract: A manufacturing method for an ink-jet head is provided to prevent foreign substances from entering the ink-jet head by performing an ink inlet formation later than most of the whole processes. A manufacturing method for an ink-jet head includes the steps of: forming a reservoir, a chamber, a restrictor, and a nozzle on a plate(S10); forming a first plate corresponding to the reservoir, the chamber, and the restrictor(S11); forming a second plate corresponding to the nozzle(S12); adhering the first and second plates(S13); forming an anti-wetting layer on a part of the plate adjacent to the nozzle(S20); dividing the plate into several unit sections(S30); and forming an ink inlet on the divided plate(S40).
Abstract translation: 提供一种用于喷墨头的制造方法，用于通过在大多数整个过程之后执行墨水入口形成来防止异物进入喷墨头。 喷墨头的制造方法包括以下步骤：在板上形成储存器，室，限制器和喷嘴（S10）; 形成对应于储存器，室和限流器的第一板（S11）; 形成对应于喷嘴的第二板（S12）; 粘贴第一和第二板（S13）; 在与喷嘴相邻的板的一部分上形成防湿层（S20）; 将板分成几个单元区（S30）; 并在分割板上形成墨入口（S40）。
-
公开(公告)号：KR1020080083776A
公开(公告)日：2008-09-19
申请号：KR1020070024368
申请日：2007-03-13
Applicant: 삼성전기주식회사
CPC classification number: H01L33/508 , H01L2224/48091 , H01L2924/00014
Abstract: A method for manufacturing a light emitting diode package is provided to form a phosphor having a grating structure on a phosphor layer by using an ink-jet process. An LED chip(21) is prepared. A phosphor layer(22) is formed on an upper surface of the LED chip. A phosphor(23) having a grating structure is formed on the phosphor layer by performing an ink-jet process using ink including phosphor powders. The phosphor layer is attached on the upper surface of the LED chip. The LED chip including the phosphor layer is mounted in an inside of a package housing(24). The inside of the package housing is molded with a transparent resin(25). The phosphor having the grating structure is made of a dot array including a plurality of dots.
Abstract translation: 提供一种制造发光二极管封装的方法，以通过使用喷墨工艺在荧光体层上形成具有光栅结构的荧光体。 制备LED芯片（21）。 荧光体层（22）形成在LED芯片的上表面上。 通过使用包括荧光体粉末的油墨进行喷墨处理，在荧光体层上形成具有光栅结构的荧光体（23）。 荧光体层附着在LED芯片的上表面上。 包括荧光体层的LED芯片安装在封装壳体（24）的内部。 包装壳体的内部用透明树脂（25）模制。 具有光栅结构的荧光体由包括多个点的点阵列构成。
-
公开(公告)号：KR1020080050133A
公开(公告)日：2008-06-05
申请号：KR1020060120979
申请日：2006-12-01
Applicant: 삼성전기주식회사
IPC: B41J2/045
CPC classification number: B41J2/14233 , B41J2/1433 , B41J2002/14475
Abstract: A piezoelectric inkjet print head is provided to improve reliability of ink discharge performance by preventing damage to a hydrophobic layer around a nozzle. A piezoelectric inkjet print head includes an upper substrate, a reservoir, a restrictor, a middle substrate, a lower substrate(400), and a piezoelectric actuator. A pressure chamber containing ink is formed on the upper substrate. The lower substrate includes a nozzle(410) and a hydrophobic layer(500). The nozzle is formed through on a position corresponding to a damper of the middle substrate by depressing the lower surface(401) of the lower substrate. The hydrophobic layer is formed on the lower side of the lower substrate. The piezoelectric actuator is formed on the upper substrate and supplies driving force to the pressure chamber for discharging ink.
Abstract translation: 提供压电喷墨打印头以通过防止对喷嘴周围的疏水层的损坏来提高喷墨性能的可靠性。 压电喷墨打印头包括上基板，储存器，限流器，中间基板，下基板（400）和压电致动器。 在上基板上形成容纳油墨的压力室。 下基板包括喷嘴（410）和疏水层（500）。 通过按压下基板的下表面（401），喷嘴形成在与中间基板的阻尼器相对应的位置上。 疏水层形成在下基板的下侧。 压电致动器形成在上基板上，并向压力室提供驱动力以排出油墨。
-
公开(公告)号：KR100830871B1
公开(公告)日：2008-05-21
申请号：KR1020060098805
申请日：2006-10-11
Applicant: 삼성전기주식회사
CPC classification number: C09D11/322 , B22F2998/00 , C09D11/52 , Y10T428/2991 , B22F1/02
Abstract: 본 발명은 비분산성 금속 나노입자의 표면개질방법 및 이에 의해 표면개질된 잉크젯용 금속 나노입자에 관한 것으로, 보다 상세하게는 (a) 입자 표면에 비정질 탄소층을 포함하는 금속 나노입자와 알코올 또는 티올계 용매를 혼합하는 단계; (b) 카르복시기의 헤드부를 포함하는 캐핑분자를 (a)단계의 혼합물에 가하고 혼합하는 단계; 및 (c) 상기 금속 나노입자를 (b)단계의 혼합물로부터 분리하는 단계;를 포함하는 비분산성 금속 나노입자의 표면개질방법 및 이에 의하여 표면개질된 잉크젯용 금속 나노입자에 관한 것이다. 본 발명에 의하면, 기존의 톤 스케일로 양산되어 있는 비분산성 나노입자를 잉크젯용 나노입자로 변환시킬 수 있어 대량생산이 가능하다.
비분산성, 금속 나노입자, 비정질 탄소층, 표면개질, 잉크젯용, 페이스트용, 분산성-
公开(公告)号：KR1020080032455A
公开(公告)日：2008-04-15
申请号：KR1020060098311
申请日：2006-10-10
Applicant: 삼성전기주식회사
CPC classification number: C09D11/52 , C09D11/322 , C09D11/36 , C09D11/38 , H01B1/00
Abstract: An anti-migration ink composition is provided to realize excellent conductivity and to inhibit an ion migration phenomenon of conductive interconnections. An anti-migration ink composition comprises: 10-60 wt% of metal nanoparticles formed of silver nanoparticles and copper nanoparticles; and 40-90 wt% of an organic solvent selected from the group consisting of alcohols, polyols and mixtures thereof. The silver nanoparticles and the copper nanoparticles are used in a mixing ratio of 0.001:99.999-50:50. The silver nanoparticles and the copper nanoparticles have a uniform particle size distribution, and each particle size ranges from 3 to 100 nm.
Abstract translation: 提供了抗迁移油墨组合物以实现优异的导电性并且抑制导电互连的离子迁移现象。 抗迁移油墨组合物包括：由银纳米颗粒和铜纳米颗粒形成的金属纳米颗粒的10-60重量％ 和40-90重量％的选自醇，多元醇及其混合物的有机溶剂。 银纳米颗粒和铜纳米颗粒以0.001：99.999-50：50的混合比使用。 银纳米颗粒和铜纳米颗粒具有均匀的粒度分布，并且每个粒度范围为3至100nm。
-
Patent Agency Ranking
公开(公告)号：KR1020080030882A
公开(公告)日：2008-04-07
申请号：KR1020060097436
申请日：2006-10-02
Applicant: 삼성전기주식회사
CPC classification number: H05K3/28 , H05K3/0091 , H05K2203/013
Abstract: A method for manufacturing cover lay of PCB(Printed Circuit Board) is provided easily to realize a cover lay having complex forms by coating polymer ink with an inkjet. A method for manufacturing cover lay of PCB(Printed Circuit Board) includes the steps of: providing a substrate with circuit patterns(S1); selectively coating protective ink on the substrate through the inkjet method(S2); and filtering the protective ink(S3). The protective ink is made of a material selected from a group consisting of polyimide, epoxy resin, poly-acrylate resin, poly-urethane resin or the like. The method further includes a step of solidifying the protection ink.
Abstract translation: PCB（印刷电路板）的盖板的制造方法容易地通过用喷墨打印聚合物油墨来实现具有复杂形式的盖板。 一种用于制造PCB（印刷电路板）盖板的方法包括以下步骤：为基板提供电路图案（S1）; 通过喷墨方法在基板上选择性地涂覆保护油墨（S2）; 并过滤保护油墨（S3）。 保护油墨由选自聚酰亚胺，环氧树脂，聚丙烯酸酯树脂，聚氨酯树脂等的材料制成。 该方法还包括固化保护油墨的步骤。
-
公开(公告)号：KR1020080025917A
公开(公告)日：2008-03-24
申请号：KR1020060090719
申请日：2006-09-19
Applicant: 삼성전기주식회사
IPC: H05K3/10
CPC classification number: H05K1/097 , B22F3/008 , B22F2998/10 , H05K3/125 , H05K3/245 , H05K2203/013 , H05K2203/1131 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49139 , Y10T29/4914 , B22F3/10
Abstract: An alloy circuit board and a manufacturing method thereof are provided to form an alloy wiring with a predetermined thickness without a mask at a low cost through the printing of ink containing metal particles without alloy ink by an inkjet printing method. A manufacturing method of an alloy circuit board includes the steps of: forming a first wiring layer by printing ink containing first metal particles on a substrate by corresponding to a circuit pattern(S10); stacking a second wiring layer on the first wiring layer by printing ink containing second metal particles on the substrate(S20); and sintering the first wiring layer and the second wiring layer(S40). The steps of S10 and S20 are performed by an inkjet method, include a step of drying the ink, and are repeated sequentially before the step of S40 to form the circuit pattern with a predetermined thickness.
Abstract translation: 提供一种合金电路板及其制造方法，通过喷墨印刷方法通过印刷不含合金油墨的金属颗粒的油墨，以低成本形成具有预定厚度的合金布线。 合金电路板的制造方法包括以下步骤：通过对应于电路图案在基板上印刷含有第一金属颗粒的油墨来形成第一布线层（S10）; 通过在基板上印刷含有第二金属颗粒的油墨，在第一布线层上堆叠第二布线层（S20）; 并烧结第一布线层和第二布线层（S40）。 S10和S20的步骤通过喷墨方法进行，包括干燥墨水的步骤，并且在步骤S40之前依次重复以形成具有预定厚度的电路图案。
-
公开(公告)号：KR100812647B1
公开(公告)日：2008-03-13
申请号：KR1020060097419
申请日：2006-10-02
Applicant: 삼성전기주식회사
IPC: H05K13/02
CPC classification number: H05K13/0069 , H05K3/125 , H05K2203/013
Abstract: An apparatus for fixing a board is provided to rapidly dry ink by being provided with a temperature controller at the time of manufacturing the board by an ink-jet printing method. An apparatus(10) for fixing a board includes a plate(11), a clamp(19), and a clamp bar(23). The plate having a plurality of vacuum holes(13) is formed on a base(17). The plate is made of a plastic or metallic material. The plate directly contacts with the board. The vacuum holes are connected to a vacuum pump for providing vacuum force through a vacuum supply line. The plate is divided into two sectors(11a,11b). A clamp(19) is provided between the two sectors. A clamp bar(23) and a magnet(21) are provided on one surface of each sector.
Abstract translation: 提供一种用于固定板的装置，通过在喷墨打印方法制造板时设置温度控制器来快速干燥油墨。 用于固定板的装置（10）包括板（11），夹具（19）和夹杆（23）。 具有多个真空孔（13）的板形成在基座（17）上。 该板由塑料或金属材料制成。 板直接与板接触。 真空孔连接到真空泵，以通过真空供应管线提供真空力。 板被分成两个扇区（11a，11b）。 夹具（19）设置在两个扇区之间。 在每个扇区的一个表面上设置有夹杆（23）和磁体（21）。
-
公开(公告)号：KR100796520B1
公开(公告)日：2008-01-21
申请号：KR1020060100462
申请日：2006-10-16
Applicant: 삼성전기주식회사
CPC classification number: G09F3/0292 , B42D15/0006 , B42D15/0093 , B42P2221/02 , G01J1/50 , G09F3/0294 , G09F3/10
Abstract: A sticker and a manufacturing method thereof are provided to sense the strength or the exposure time of the ultraviolet rays by using an ultraviolet ray photosensitive material whose color changes according to the strength or the exposure time of the ultraviolet rays. A sticker includes a plate material(10), an adhesive layer(14), an ultraviolet ray photosensitive resin layer(12) and a coating film(16). The adhesive layer is formed on the surface of the plate material. The ultraviolet ray photosensitive resin layer is formed on the other surface of the plate material. The coating film is detachably laminated on one surface of the plate material on which the ultraviolet ray photosensitive resin layer is formed, and intercepts ultraviolet rays. The plate material contains at least any one of a paper, non-woven fabric, polyester resin, polyvinyl chloride resin, polyethylene resin and polypropylene resin.
Abstract translation: 提供了一种贴纸及其制造方法，通过使用根据紫外线的强度或曝光时间而变化的紫外线感光材料来感测紫外线的强度或曝光时间。 贴纸包括板材（10），粘合剂层（14），紫外线感光树脂层（12）和涂膜（16）。 粘合剂层形成在板材的表面上。 紫外线感光性树脂层形成在板材的另一面上。 该涂膜可分离地层压在其上形成有紫外线感光性树脂层的板材的一个表面上，并截获紫外线。 板材含有纸，无纺布，聚酯树脂，聚氯乙烯树脂，聚乙烯树脂和聚丙烯树脂中的至少任一种。
-
公开(公告)号：KR100795987B1
公开(公告)日：2008-01-21
申请号：KR1020060078618
申请日：2006-08-21
Applicant: 삼성전기주식회사
Abstract: 역 마이크로에멀젼 중에서 니켈-히드라진 착물을 형성한 후 환원하는 방법에 의하여 균일한 크기의 우수한 분산 안정성을 가지는 평활한 표면의 니켈 나노입자를 제조하는 방법 및 이에 의하여 제조된 니켈 나노입자를 제공한다. 또한, 100nm 이하, 바람직하게는 10 내지 50nm의 좁은 입도분포를 가지는 니켈 나노입자의 제조방법 및 이에 의하여 제조된 니켈 나노입자를 제공한다. 본 발명의 일 측면에 따르면, (a) 니켈 전구체, 계면활성제 및 소수성 용매를 포함하는 수용액의 형성하는 단계, (b) 상기 혼합액에 히드라진을 포함하는 화합물을 첨가하여 니켈-히드라진 착물을 형성하는 단계 및 (c) 상기 니켈-히드라진 착물을 포함하는 혼합액에 환원제를 첨가하여 니켈 나노입자를 형성하는 단계를 포함하는 니켈 나노입자의 제조방법을 제시할 수 있다.
니켈, 나노입자, 역 마이크로에멀젼, 환원제, 착물
-
-
-
-
-
-
-
-
-
Search Results
375
records
(took 0.027 seconds)
