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公开(公告)号：KR1020090046658A
公开(公告)日：2009-05-11
申请号：KR1020080013502
申请日：2008-02-14
Applicant: 삼성전자주식회사
CPC classification number: A47L9/1633 , A47L9/1608 , A47L9/1641 , A47L9/1683
Abstract: 본 발명은 청소기 본체에 설치되어 흡입구체로부터 유입된 공기로부터 먼지를 분리한 후 배출하고, 공기와 분리된 먼지를 수거하는 진공청소기용 멀티 사이클론 집진장치에 있어서, 상기 흡입구체로부터 유입된 공기에 포함된 큰 먼지를 분리하기 위한 1차 사이클론부와, 상기 1차 사이클론부 내측에 배치되고 상광하협으로 형성된 2차 사이클론부를 구비한 먼지분리부; 상기 먼지분리부의 하측에 분리 가능하게 결합되며, 상기 1차 사이클론부에서 배출되는 큰 먼지를 수거하기 위한 제1 먼지수거실과, 상기 제1 먼지수거실 내에 배치되며 상기 2차 사이클론부에서 배출되는 미세먼지를 수거하기 위한 제2 먼지수거실을 구비한 먼지수거부;를 포함하며, 상기 제1 먼지수거실은 제2 먼지수거실보다 상대적으로 큰 용적을 갖는 것을 특징으로 한다.
청소기, 사이클론, 멀티, 2차 사이클론, 경사배치, 압력손실-
公开(公告)号：KR1020090019563A
公开(公告)日：2009-02-25
申请号：KR1020070084096
申请日：2007-08-21
Applicant: 삼성전자주식회사
Abstract: A suction brush for a vacuum cleaner is provided to sense a floor with a floor sensor and to adjust distance between the floor and bottom of suction brush with an elevating plate driving part. A suction brush for a vacuum cleaner comprises an upper case(110), a lower case(120) including an inlet(121) inhaling a dirt from a floor to be cleaned and connecting with the upper case, an elevating plate(130) installed between the upper case and the lower case to ascend and descend to top and bottom toward the lower case, a floor sensor sensing the floor to be cleaned, a lever, installed around an axis of rotation which is paralleled with the elevator plate so that rotation be possible and a solenoid rotating lever operating the lever.
Abstract translation: 提供用于真空吸尘器的抽吸刷以感测具有地板传感器的地板，并且利用升降板驱动部分来调节抽吸刷的底部和底部之间的距离。 用于真空吸尘器的抽吸刷包括上壳体（110），下壳体（120），其包括从待清洁的地板吸入污物并与上壳体连接的入口（121），安装有升降板 在上壳体和下壳体之间上下移动到下壳体，感测要清洁的地板的地板传感器，围绕与电梯板并联的旋转轴线安装的杠杆，使得旋转 可以使用操作杆的电磁转动杆。
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公开(公告)号：KR1020080097110A
公开(公告)日：2008-11-04
申请号：KR1020070059504
申请日：2007-06-18
Applicant: 삼성전자주식회사
Abstract: A dust compressing apparatus of a vacuum cleaner is provided to have a simple structure and automatically compress dust collected in a dust collecting unit. The dust compressing apparatus of the vacuum cleaner comprises a compression board(181) which compresses the dust collected in the dust collecting unit; a lifting unit(190) which is connected to the compression board at the upper side of the compression board and raises the compression board; and a drive motor(196) which operates the lifting unit in order to raise the compression board. The lifting unit includes a helical axis which is connected to the compression board and forms a spiral wire around the outer circumference; a cylinder gear which is equipped a helical hole going in gear with the helical axis around the inner circumference and goes in gear with a driving gear of a drive motor around the outer circumference; and a support bracket which supports the cylinder gear for rotation.
Abstract translation: 提供一种真空吸尘器的灰尘压缩装置以具有简单的结构并且自动地压缩收集在集尘装置中的灰尘。 真空吸尘器的灰尘压缩装置包括：压缩板（181），其压缩收集在集尘单元中的灰尘; 提升单元（190），其连接到所述压缩板的上侧的所述压缩板并且升高所述压缩板; 以及驱动马达（196），其操作提升单元以升高压缩板。 提升单元包括螺旋轴线，该螺旋轴线连接到压缩板并围绕外圆周形成螺旋线; 一个圆柱齿轮，其具有螺旋孔，螺旋孔与螺旋轴线围绕内圆周啮合，并与驱动马达的驱动齿轮围绕外圆周传动; 以及支撑圆柱齿轮旋转的支撑托架。
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公开(公告)号：KR1020080097108A
公开(公告)日：2008-11-04
申请号：KR1020070059500
申请日：2007-06-18
Applicant: 삼성전자주식회사
Abstract: A vacuum cleaner is provided to attach/detach a dust collection unit to/from a cyclone unit while the dust in the dust collection unit is compressed with the same manipulation. The vacuum cleaner comprises a main body of the vacuum cleaner; the cyclone unit; the cyclone unit(20) which separates the dust from suction air and is mounted on the main body of vacuum cleaner; the dust collection unit(30) including a compression board(33) for compressing the dust; and a drive unit which operates the compression board with raising the dust collection unit in order to be detached/attached from/to the cyclone unit. The dust collection unit is in the lower part of the cyclone unit for detachment/attachment, and includes a dust and dirt collecting case in which cylinder typed dust collection space is formed and a axis member which is erected and installed according to a central axis of the dust collecting space.
Abstract translation: 提供真空吸尘器，用于将灰尘收集单元与旋风单元相连/分离，同时灰尘收集单元中的灰尘以相同的操作被压缩。 真空吸尘器包括真空吸尘器的主体; 旋风单元; 所述旋风单元（20）将灰尘与吸入空气分离并安装在吸尘器主体上; 所述集尘单元（30）包括用于压缩灰尘的压缩板（33） 以及驱动单元，其通过升高灰尘收集单元来操作压缩板，以便从旋转单元拆卸/附接。 集尘单元位于用于拆卸/安装的旋风单元的下部，并且包括形成有气瓶式集尘空间的灰尘和污物收集箱，以及根据中心轴线竖立并安装的轴构件 集尘空间。
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公开(公告)号：KR1020030096461A
公开(公告)日：2003-12-31
申请号：KR1020020032972
申请日：2002-06-12
Applicant: 삼성전자주식회사
IPC: H01L23/36
CPC classification number: H01L23/3128 , H01L23/24 , H01L23/36 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , Y10T29/49156 , H01L2924/00014 , H01L2924/00015 , H01L2924/00 , H01L2924/00012
Abstract: PURPOSE: A high voltage BGA(Ball Grid Array) package, a heat spreader used for the same, and a manufacturing method thereof are provided to be capable of preventing the damage of a semiconductor chip due to static electricity by reducing the capacitance between the heat spreader and the semiconductor chip. CONSTITUTION: A high voltage BGA package is provided with a PCB(Printed Circuit Board)(200) having a predetermined through hole(200a) at the center portion, a connecting pad(201) formed at the lower portion of the PCB, a plurality of solder balls(210) shaped into a matrix type structure for enclosing the through hole at the lower portion of the PCB, and a heat spreader(110) formed at the upper portion of the PCB. At this time, the heat spreader includes an electrical insulating layer having a high thermal conductivity. The high voltage BGA package further includes a semiconductor chip(101) located at the lower portion of the heat spreader and a passive layer(230) formed at the lower portion of the semiconductor chip.
Abstract translation: 目的：提供一种高电压BGA（球栅阵列）封装，用于其的散热器及其制造方法，其能够通过降低热量之间的电容来防止由于静电导致的半导体芯片的损坏 吊具和半导体芯片。 构成：高压BGA封装设置有在中心部分具有预定通孔（200a）的PCB（印刷电路板）（200），形成在PCB的下部的连接焊盘（201），多个 形成为用于封装PCB下部的通孔的矩阵型结构的焊球（210）和形成在PCB的上部的散热器（110）。 此时，散热器包括具有高导热性的电绝缘层。 高压BGA封装还包括位于散热器下部的半导体芯片（101）和形成在半导体芯片的下部的钝化层（230）。
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Patent Agency Ranking
公开(公告)号：KR1020030028980A
公开(公告)日：2003-04-11
申请号：KR1020010061437
申请日：2001-10-05
Applicant: 삼성전자주식회사
IPC: H01L23/34
CPC classification number: H01L23/433 , H01L23/36 , H01L23/4334 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15312 , H01L2924/16152 , H01L2924/16251 , H01L2924/00
Abstract: PURPOSE: A semiconductor package is provided to disperse the heat generated by hot spot uniformly over the whole CPU chip and alleviate the thermal stress between a lid and thermal interface material. CONSTITUTION: A CPU chip(120) is bonded onto a wiring substrate(110). A lid is attached onto the upper surface(112) of the substrate, including a CPU chip inside it. Thermal interface material(156) lies between the lid and the chip. External connection pins(130) protrudes under the bottom surface of the substrate, electrically connected to the chip. The outside surface of the chip except the active surface is covered by a thermal dispersion case(160) made up of diamond or graphite or synthetic silicon with thermal conductivity of 1000mW/mK and thermal expansion coefficient of below 4.0.
Abstract translation: 目的：提供半导体封装，将热点产生的热量均匀分散在整个CPU芯片上，减轻盖子与热界面材料之间的热应力。 构成：将CPU芯片（120）接合到布线基板（110）上。 在基板的上表面（112）上附着盖子，其中包括一个CPU芯片。 热界面材料（156）位于盖和芯片之间。 外部连接引脚（130）突出在基板的底表面下方，与芯片电连接。 除了有源表面之外的芯片的外表面被由金刚石或石墨或热导率为1000mW / mK且热膨胀系数低于4.0的合成硅组成的散热壳（160）覆盖。
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公开(公告)号：KR1020010038316A
公开(公告)日：2001-05-15
申请号：KR1019990046256
申请日：1999-10-25
Applicant: 삼성전자주식회사
IPC: H01L23/28
Abstract: PURPOSE: A semiconductor package is to improve the accuracy of a heat resistance value in evaluating the heat characteristic by providing a lead frame with a thermal test chip for an edge pad. CONSTITUTION: A rear side of an edge pad-typed thermal test chip(100) is attached on a lower surface of a lead on chip-typed lead frame(120), and an electrode pad(112) formed on an active surface opposite to the rear side is connected to the lead frame through a metal wire(140). A periphery of the thermal test chip is sealed with a molding resin such as epoxy to form a package body(150). A lead(124) of the lead frame consists of an inner lead(123) positioned in the package body and an outer lead(125) outwardly protruded from the package body. The electrode pad is connected to a bottom surface of the inner lead through the metal wire, and the bottom surface is formed with a plated layer(127) to improve a conjunction of the inner lead and the metal wire.
Abstract translation: 目的：半导体封装通过为引线框架提供边缘焊盘的热测试芯片来提高评估热特性时的耐热值的精度。 构成：边缘焊盘型热测试芯片（100）的背面安装在芯片型引线框架（120）的下表面上，电极焊盘（112）形成在与 后侧通过金属线（140）连接到引线框架。 热测试芯片的周围用诸如环氧树脂的模制树脂密封以形成封装主体（150）。 引线框架的引线（124）由定位在封装主体中的内引线（123）和从封装体向外突出的外引线（125）组成。 电极焊盘通过金属线连接到内引线的底表面，并且底表面形成有镀层（127），以改善内引线和金属线的连接。
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公开(公告)号：KR101704747B1
公开(公告)日：2017-02-09
申请号：KR1020090111791
申请日：2009-11-19
Applicant: 삼성전자주식회사
CPC classification number: B01D47/024 , A47L9/18 , A47L9/181 , A47L9/182 , A47L9/187 , A47L11/4016 , A47L11/4025 , B01D46/2411 , B01D2247/08
Abstract: 수위조절유닛을구비한물 필터장치가개시된다. 개시된물 필터장치는먼지가포함된공기가유입되는외기유입구; 상기외기유입구와연통하며, 유입된상기공기중의먼지를분리시키는먼지분리부; 상기먼지분리부와연통되며, 먼지가분리된청정공기가배출되는배기구; 상기먼지분리부와연통하며물이채워진먼지통부; 및상기먼지통부에설치되며, 상기먼지통부에채워지는상기물의수위를적정으로유지할수 있도록상기물 수위를조절하는수위조절유닛;을포함하며, 상기수위조절유닛은, 상기먼지통부바닥에설치된과급수배수관과, 상기과급수배수관을통해물의수위를선택적으로조절할수 있는수동개폐수단을포함한다. 따라서, 손쉽게적정수위로물 필터장치내부에물을조절할수 있고높은집진효율을얻을수 있다.
Abstract translation: 公开了一种装有水位调节单元的水过滤装置。 所公开的水过滤装置包括：外部空气入口，含有灰尘的空气通过该入口进入; 尘埃分离单元，其连接到外部空气入口并分离入口空气中的灰尘; 与灰尘分离单元连接的排出口和从其分离有灰尘的空气排出; 与粉尘分离单元连接且充满水的除尘容纳部; 以及水位调节单元，其安装在灰尘收纳部中并调节水位。 水位调节单元包括安装在集尘器底部的增压排水管和手动打开/关闭装置，其能够通过使用增压排水管来选择性地调节水位。 因此，可以容易地调节水过滤装置内的水位，并且可以实现高的集尘效率。
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公开(公告)号：KR101619842B1
公开(公告)日：2016-05-13
申请号：KR1020090079417
申请日：2009-08-26
Applicant: 삼성전자주식회사
CPC classification number: A47L9/182 , A47L9/00 , A47L9/1691 , A47L9/185 , A47L9/327
Abstract: 핸들유닛을구비한진공청소기의집진장치가개시된다. 개시된집진장치는, 1차유입구를통해유입된공기에포함된먼지를분리하는 1차원심분리영역을형성하는 1차원심분리관; 상기 1차원심분리영역에서분리된먼지를수집하는 1차먼지통; 및상기 1차원심분리영역에서먼지가분리된외부유입공기를상기 1차원심분리관과상기 1차먼지통의외부로배출하는 1차배기관유닛;을구비한 1차분리부; 및, 상기 1차원심분리관이상기 1차먼지통과결합하는경우상기 1차원심분리관이상기 1차먼지통에결합된상태를유지하거나결합을해제하는핸들유닛;을포함하여구성되는것을특징으로한다.
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公开(公告)号：KR101487787B1
公开(公告)日：2015-02-06
申请号：KR1020070084091
申请日：2007-08-21
Applicant: 삼성전자주식회사
CPC classification number: A47L9/066
Abstract: 진공청소기용 흡입브러시가 개시된다. 본 발명의 진공청소기용 흡입브러시는 상부케이싱; 상부케이싱에 고정결합되며 피청소면으로부터 오물이 흡입되는 흡입구 형성된 하부케이싱; 하부케이싱에 대해 상하로 승강 가능하도록 상부케이싱과 하부케이싱 사이에 설치된 승강판; 승강판을 상하로 구동하는 승강판 구동부; 및 피청소면이 하드 플로어에서 카펫으로 전환되면 승강판 구동부가 승강판을 상승시키도록 제어하며, 피청소면이 카펫에서 하드 플로어로 전환되면 승강판 구동부가 승강판을 하강시키도록 제어하는 승강 제어 시스템;을 포함하며, 하부케이싱은, 승강판이 상승함에 따라 피청소면에 밀착되고 승강판이 하강함에 따라 피청소면에 대해 이격되는 것을 특징으로 한다.
흡입브러시, 조작저항, 흡입율, 하드 플로어, 카펫, 모터, 승강, 바닥, 감지
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