公开(公告)号：KR100699876B1

公开(公告)日：2007-03-28

申请号：KR1020050107011

申请日：2005-11-09

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: G11B5/02

Abstract: A read current optimization method and a device thereof are provided to determine a range of a read current used to an optimization test on the basis of an MR(Magneto-Resistive) value generated when a minimum read current is applied, and to apply an average of read currents obtained by selecting a random zone of a disk as an optimized current of entire zones, thereby increasing efficiency of drive production and test processes. A read current set to a minimum value is applied to a head to measure an MR value of the head(300). A range of a read current for an optimization test is determined on the basis of the measured MR value(310). The optimization test of the read current is conducted in every selected zone as the read current is varied in the determined range of the read current, to obtain read currents for each zone(320,330). The read currents for each zone are averaged to determine an averaged value as an optimized read current(340).

Abstract translation: 提供读取电流优化方法及其装置，用于基于在施加最小读取电流时产生的MR（磁电阻）值来确定用于优化测试的读取电流的范围，并且应用平均值 通过选择盘的随机区域作为整个区域的优化电流而获得的读取电流，从而提高驱动器生产和测试过程的效率。 将设置为最小值的读取电流施加到头部以测量头部（300）的MR值。 基于测量的MR值（310）确定用于优化测试的读取电流的范围。 读取电流的优化测试是在读取电流在读取电流的确定范围内变化的情况下在每个选定区域进行的，以获得每个区域的读取电流（320,330）。 对每个区域的读取电流进行平均，以将平均值确定为优化的读取电流（340）。

公开(公告)号：KR1020070013882A

公开(公告)日：2007-01-31

申请号：KR1020050068540

申请日：2005-07-27

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: H01L21/68

CPC classification number: H01L21/68742 ,  H01J37/32082

Abstract: A semiconductor manufacturing apparatus having a hoop for lifting a wafer is provided to prevent the wafer from being slid on a plate by forming a coupling groove on a lift pin. A semiconductor manufacturing apparatus includes a process chamber(100), a susceptor(110), at least one pin(115), and a hoop(120). The susceptor is arranged inside the process chamber and supports the wafer. The pin penetrates a predetermined portion of the susceptor and lifts up the wafer. The hoop is installed at a lower portion of the susceptor, substantially lifts the pin, and includes a groove for fixing the pin. The susceptor includes a plate and a cylinder. The wafer is mounted on the plate. The cylinder supports the plate. The hoop is a hook shape. The cylinder is inserted into the hoop.

Abstract translation: 提供具有用于提升晶片的环的半导体制造装置，以通过在升降销上形成连接槽来防止晶片在板上滑动。 半导体制造装置包括处理室（100），基座（110），至少一个销（115）和箍（120）。 基座设置在处理室的内部并支撑晶片。 销穿过基座的预定部分并提升晶片。 箍环安装在基座的下部，大致提升销，并且包括用于固定销的槽。 基座包括板和圆筒。 晶片安装在板上。 气缸支撑板。 箍是钩形。 气缸插入环箍。

公开(公告)号：KR1020070006442A

公开(公告)日：2007-01-11

申请号：KR1020050061776

申请日：2005-07-08

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: H01L21/205 ,  H01L21/68

CPC classification number: H01L21/6773 ,  H01L21/67778

Abstract: An indexer for a wafer cassette is provided to avoid movement and noise of an encoder connector caused by vibration of a motor by forming the encoder connector connected to a motor used in an indexer for a wafer cassette while using a circular plug and a terminal. A cassette in which wafers are stacked is placed on a support table. An elevation apparatus vertically moves the support table in combination with the support table. Driving force is applied to the elevation apparatus by a motor. The motor can be a stepping motor. An encoder detects rotation of the motor to output a position signal. An encoder connector part connects the motor to the encoder, including a cable(216) connected to the encoder, a circular plug(210) connected to the cable, and a terminal box(220) having a circular terminal(225) such that the terminal box is connected to the motor. The plug has four connection pins(214).

Abstract translation: 提供了一种用于晶片盒的分度器，以避免在使用圆形插头和端子时形成连接到用于晶片盒的分度器中的电动机的编码器连接器，由电动机的振动引起的编码器连接器的移动和噪声。 将其中堆叠晶片的盒放置在支撑台上。 升降装置与支撑台组合地垂直地移动支撑台。 驱动力由马达施加到升降装置。 电机可以是步进电机。 编码器检测电机的旋转以输出位置信号。 编码器连接器部分将电动机连接到编码器，包括连接到编码器的电缆（216），连接到电缆的圆形插头（210）和具有圆形端子（225）的接线盒（220），使得 接线盒连接到电机。 插头有四个连接引脚（214）。

公开(公告)号：KR1020070000923A

公开(公告)日：2007-01-03

申请号：KR1020050056594

申请日：2005-06-28

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: F16K31/04 ,  F16K31/44 ,  B23B31/169

Abstract: A pulley gear and a driving apparatus of a throttle valve with the same are provided to preclude the timing belt from being abraded and extend the lift space of the timing belt according to the round-shaped formation of the thread of the pulley gear. A pulley gear is composed of disk-shaped gear bodies(151,161); a gear rib(163) formed at one surface of the gear body and combined with a predetermined shaft; and a round-shaped thread formed at the outer peripheral surface of the gear body and formed with a predetermined interval. A driving apparatus of a throttle valve contains a rotary shaft combined at one side of a flapper, a driven pulley gear(150) fitted at the rotary shaft and formed with a round-shaped thread(155), a driving pulley gear(160) formed with a round-shaped thread(165), a timing belt(170) winding the driven and driving pulley gears, and a driving motor(180) driving the driving pulley gear.

Abstract translation: 提供了一种带有齿轮的带轮齿轮和具有该滑轮的节流阀的驱动装置，以防止正时带被磨损，并根据滑轮齿轮的螺纹的圆形形状延长同步带的提升空间。 滑轮齿轮由盘形齿轮体（151,161）组成; 形成在所述齿轮体的一个表面并与预定轴组合的齿轮肋（163）; 以及形成在齿轮体的外周面并以规定间隔形成的圆形螺纹。 节流阀的驱动装置包括组合在挡板一侧的旋转轴，安装在旋转轴处并形成有圆形螺纹（155）的从动皮带轮齿轮（150），驱动滑轮齿轮（160） 形成有圆形螺纹（165），卷绕从动和驱动滑轮齿轮的同步皮带（170）和驱动滑轮齿轮的驱动马达（180）。

公开(公告)号：KR1020060113155A

公开(公告)日：2006-11-02

申请号：KR1020050036062

申请日：2005-04-29

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: H01L21/02

CPC classification number: H01L21/02 ,  F04B37/14 ,  F04B45/02

Abstract: An isolation valve is provided to prevent pollutants, which are generated by a bellows, from permeating inside a chamber through a vacuum line by forming a pumping line along a body of the isolation valve. An isolation valve includes a chamber, a body(100), a vacuum line(114), and a pumping line(110). The chamber provides a space for a predetermined reaction. The body includes a bellows, which switches on/off a flow of liquid toward the chamber. The vacuum line is formed on one side of the body and connected to the chamber. The pumping line is formed on the other side of the body and biased toward an expansion direction of the bellows. The bellows is moved by an acoustic pressure. The body includes a soft line, which adjusts a pressure inside the body before regulating the flow of liquid by using the bellows.

Abstract translation: 隔离阀被设置成防止由波纹管产生的污染物通过沿着隔离阀体的主体形成泵送线，通过真空管线渗入室内。 隔离阀包括腔室，主体（100），真空管线（114）和泵送管线（110）。 该室为预定的反应提供了空间。 主体包括一个波纹管，其将液体流朝室内打开/关闭。 真空管线形成在主体的一侧并连接到腔室。 泵送线形成在主体的另一侧并朝向波纹管的膨胀方向偏压。 波纹管被声压移动。 身体包括一条软线，它通过使用波纹管来调节液体流动之前调节身体内部的压力。

公开(公告)号：KR100585162B1

公开(公告)日：2006-05-30

申请号：KR1020040084865

申请日：2004-10-22

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: G11B5/09

Abstract: 본 발명은 데이터 저장 장치 및 그 제어 방법에 관한 것으로서, 특히 디스크 드라이브별 특성 차를 고려하여 라이트 파라미터들을 온도 변화에 대하여 적응적으로 결정하는 방법 및 장치에 관한 것이다.
본 발명에 의한 온도에 따른 적응적 라이트 파라미터 결정 방법은 디스크 드라이브 파라미터 결정 방법에 있어서, (a) 헤드 별로 디스크의 각 존에서 라이트 파라미터를 가변시키면서 소정의 성능을 측정하는 단계, (b) 상기 단계(a)에서 측정한 결과를 이용하여 헤드 별로 디스크의 각 존에서 라이트 파라미터에 대한 소정의 성능의 상관 관계식을 산출하는 단계 및 (c) 상기 상관 관계식으로부터 상기 소정의 성능이 설계 목표를 만족시키는 범위에서 상기 라이트 파라미터의 온도 특성에 상응하여 비례 상관적으로 온도에 따른 상기 라이트 파라미터 값을 헤드 별로 디스크의 각 존에서 각각 산출하는 단계를 포함함을 특징으로 한다.

公开(公告)号：KR100290957B1

公开(公告)日：2001-09-17

申请号：KR1019920021140

申请日：1992-11-11

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: H02P3/00

Abstract: PURPOSE: A motor stoppage control circuit is provided to reduce data damage and contact between head and medium by stopping the motor in a shortest time period. CONSTITUTION: A motor stoppage control circuit comprises a commutation control unit(52) for allowing a motor to perform commutation through first, second and third phases(U,V,W); an electric potential accumulation unit(50) for operating the commutation control unit by charging power received from the first phase which serves as a reference phase, or discharging the charged power during power off; a power off detection unit(54) for preventing commutation from being performed through the other two phases, by transferring the discharged voltage to the commutation control unit during power off state; and a retracting power supply unit(56) for receiving voltage from the first phase, and supplying a retracting voltage to a head retracting circuit.

公开(公告)号：KR1020000013881A

公开(公告)日：2000-03-06

申请号：KR1019980033002

申请日：1998-08-14

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: H01L21/60

CPC classification number: H01L2224/11 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PURPOSE: A chip size package(CSP) device and fabricating method of the same is provided to simplify the process by connecting a solder pump to a bonding pad scattered on a wafer using a conventional process and wiring pattern of the circuit substrate. CONSTITUTION: The fabricating method of the CSP device is comprising the steps of forming a semiconductor circuit and a bonding pad on a wafer, connecting a solder pump to the bonding pad, forming a terminal pad connected with an outer terminal on the circuit substrate and forming a connection pad connected with the solder pump under the circuit substrate and forming a wiring pattern connecting the terminal pad and the connection pad electrically, placing the circuit substrate on the wafer and connecting the solder pump of the wafer and the connection pad of the circuit substrate, injecting a molding resin into the space between the wafer and the circuit substrate.

Abstract translation: 目的：提供一种芯片尺寸封装（CSP）器件及其制造方法，以通过使用电路基板的常规工艺和布线图案将焊料泵连接到散射在晶片上的焊盘来简化工艺。 构成：CSP器件的制造方法包括以下步骤：在晶片上形成半导体电路和接合焊盘，将焊料泵连接到焊盘，形成与电路基板上的外部端子连接的端子焊盘，并形成 连接焊盘，其与所述焊料泵连接在所述电路基板下方，并且形成将所述端子焊盘和所述连接焊盘电连接的布线图案，将所述电路基板放置在所述晶片上，并且连接所述晶片的焊料泵和所述电路基板的连接焊盘 将模塑树脂注入到晶片和电路基板之间的空间中。

公开(公告)号：KR1019980030912A

公开(公告)日：1998-07-25

申请号：KR1019960050393

申请日：1996-10-30

Applicant: 삼성전자주식회사

Inventor： 김재준 ,  안승호 ,  이규진

IPC: H01L21/60

Abstract: 본 발명은 실장밀도를 향상시키고 제조원가를 낮추도록 한 칩 스케일 패키지(chip scale package)에 관한 것이다.
본 발명의 목적은 실장밀도를 향상시키고 제조원가를 낮추는 칩 스케일 패키지를 제공하는데 있다.
이와 같은 목적을 달성하기 위한 본 발명은 인쇄 회로 기판 본체가 반도체 칩의 크기를 가지며 범프 대신 와이어본딩을 적용하고 필요에 따라 반도체 칩의 하부면에 히트싱크를 부착할 수 있다.

公开(公告)号：KR1019970053771A

公开(公告)日：1997-07-31

申请号：KR1019950068102

申请日：1995-12-30

Applicant: 삼성전자주식회사

Inventor： 김재준

IPC: H01L23/50

Abstract: 본 발명은 개별 패키지의 리드 말단부에 용융 솔더를 묻히는 단계와, 개별 패키지를 적충시키는 적충 단계와, 용융 솔더가 녹을 수 있도록 가온시키는 단계와, 개별 패키지가 적층된 상태에서 접착이 이루어지도록 졍화시키는 단계를 포함하는 것을 특징으로 하는 적층형 3차원 패키지의 개별 패키지 적층 방법을 제공함으로써, 적층체를 개별 패키지 상태에서부터 정열시키고 한번의 공정으로 적층이 완성되게 하여 덩구 간편한 3차원패키지 제조 공정을 확립할 수 있고 솔더링의 시간을 감소시키는 효과를 나타낸다.