公开(公告)号：KR100462868B1

公开(公告)日：2004-12-17

申请号：KR1020010038481

申请日：2001-06-29

Applicant: 삼성전자주식회사

Inventor： 최재훈 ,  최봉

IPC: H01L21/304

CPC classification number: B24B53/017 ,  B24B37/04

Abstract: The operation of a polishing pad conditioner for a CMP apparatus is monitored. The polishing pad conditioner includes a housing, a first drive pulley disposed in the housing and connected to a motor at a first side of the housing, a conditioning head having a diamond disk for conditioning the polishing pad and mounted to a second side of the housing, a second pulley coupled to the conditioning head for transferring the driving force from the drive pulley to the conditioning head, a timing belt engaged with the first and second pulleys, an air supply tube for supplying air under pressure to the conditoner head to force the head against a polishing pad of the CMP apparatus, and at least one sensor disposed in the housing for sensing the operation of the conditioning head.

Abstract translation: 监测用于CMP设备的抛光垫修整器的操作。 抛光垫修整器包括壳体，设置在壳体中并在壳体的第一侧连接到马达的第一驱动皮带轮，具有用于修整抛光垫的金刚石盘的修整头，并安装到壳体的第二侧 ，连接到调节头的第二滑轮，用于将驱动力从驱动滑轮传递到调节头;与第一和第二滑轮接合的同步皮带;供气管，用于向压力机头供应压缩空气以迫使 头部靠在CMP设备的抛光垫上，并且至少一个传感器设置在壳体中用于感测调节头的操作。