公开(公告)号：KR1020100116944A

公开(公告)日：2010-11-02

申请号：KR1020090035624

申请日：2009-04-23

Applicant: 한국기술교육대학교 산학협력단

Inventor： 유승열 ,  조석진 ,  신동호

IPC: H01L21/60 ,  H05K3/34

CPC classification number: H01L24/799 ,  H01L24/75 ,  H01L2224/7999 ,  H01L2924/40403 ,  H01L2924/40404

Abstract: PURPOSE: An apparatus for removing solder ball is provided to implement a circuit of high quality by removing the defective solder ball with ease without affecting a normal solder ball. CONSTITUTION: A stage(110) supports a substrate on which a solder ball(11) is soldered on one side thereof. A light source(150) irradiates the light to the defective solder ball out of the solder balls to fuse the defective solder ball. A nozzle(170) eliminates the defective solder ball from the substrate. The gas is discharged from discharge hole to the defective solder ball.

Abstract translation: 目的：提供一种去除焊球的设备，通过轻松移除有缺陷的焊球，不会影响正常的焊球，实现高质量的电路。 构成：阶段（110）支撑在其一侧焊接有焊球（11）的基板。 光源（150）将光从焊料球照射到有缺陷的焊球上以熔化有缺陷的焊球。 喷嘴（170）消除了与基板有缺陷的焊球。 气体从排放孔排出到有缺陷的焊球。