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公开(公告)号:US10983650B2
公开(公告)日:2021-04-20
申请号:US16863647
申请日:2020-04-30
Applicant: Apple Inc.
Inventor: Brett W. Degner , Daniel D. Sunshine , Ron A. Hopkinson , Christiaan A. Ligtenberg , William F. Leggett , Patrick Kessler
IPC: G06F3/0354 , G06F3/044 , G06F1/16 , G06F3/01 , G06F3/0488 , G06F3/041 , G06F3/02
Abstract: A dynamic input surface for an electronic device and a method of reconfiguring the same is disclosed. The input surface has a partially-flexible metal contact portion defining an input area, and a group of indicators. The indicators may be group of holes extending through the contact portion. The group of holes may be selectively illuminated based on a gesture performed on the contact portion. A size of the input area may be dynamically varied based on the gesture. Additionally, the group of indicators indicates a boundary of the input area.
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公开(公告)号:US10959331B2
公开(公告)日:2021-03-23
申请号:US16914131
申请日:2020-06-26
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
IPC: H05K1/00 , H05K1/03 , H05K1/18 , H05K1/11 , H01L23/31 , H01L23/498 , H05K1/02 , D03D1/00 , A41D1/00
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号:US20200375031A1
公开(公告)日:2020-11-26
申请号:US16993115
申请日:2020-08-13
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , Daniel A. Podhajny , Kathryn P. Crews , Kirk M. Mayer , John Arthur Maasberg
Abstract: Strands of material may be intertwined using weaving techniques, knitting techniques, non-woven or entanglement techniques, or braiding techniques. Fabric that is formed from the strands of material may be used in forming a fabric-based item. The fabric based item may include electrical components. The strands may include conductive strands that form signal paths. The signal paths can carry electrical signals associated with operation of the electrical components. Each strand may have an elongated core and a coating. Strands may also include intermediate layers between the cores and coatings. The cores, intermediate layers, and coatings may be formed from polymer without conductive filler, polymer with conductive filler, and/or metal. A polymer core may be provided with recesses to help retain subsequently deposited layers such as a metal coating layer. The recesses may be grooves that extend along the longitudinal axis of the core.
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公开(公告)号:US10829878B2
公开(公告)日:2020-11-10
申请号:US15913653
申请日:2018-03-06
Applicant: Apple Inc.
Inventor: Yohji Hamada , Daniel A. Podhajny , Daniel D. Sunshine , Kathryn P. Crews , Joseph B. Walker
Abstract: An item may include fabric or other materials formed from intertwined strands of material. The strands of material may include non-conductive strands and conductive strands. The strands may be intertwined by a warp knitting machine to produce a warp knit fabric. The warp knit fabric may include intertwined warp strands and weft insertion strands that are inserted amongst the warp strands. The weft insertion strands may extend across less than all of the warp strands. The weft insertion strands may include parallel segments that each extend across a different portion of the warp strands. The segments of weft insertion strands may have different widths relative to one another and relative to the width of the fabric. The weft insertion strands may be inserted into the warp knitting machine across the warp strands using a weft insertion device that is positioned by a computer-controlled positioner.
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公开(公告)号:US20200329559A1
公开(公告)日:2020-10-15
申请号:US16914131
申请日:2020-06-26
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号:US10756020B2
公开(公告)日:2020-08-25
申请号:US16584537
申请日:2019-09-26
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H01L29/18 , H01L23/538 , H05K1/18 , H05K1/03 , D02G3/44 , G01D11/30 , H01L23/31 , H01L25/075 , H01L33/56 , A41D1/00 , H05K1/02 , H05K3/28 , F21Y115/10 , H01L21/48 , H01L23/00 , H01L33/62
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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公开(公告)号:US20200257375A1
公开(公告)日:2020-08-13
申请号:US16863647
申请日:2020-04-30
Applicant: Apple Inc.
Inventor: Brett W. Degner , Daniel D. Sunshine , Ron A. Hopkinson , Christiaan A. Ligtenberg , William F. Leggett , Patrick Kessler
IPC: G06F3/01 , G06F3/044 , G06F3/0488 , G06F1/16 , G06F3/0354 , G06F3/041 , G06F3/02
Abstract: A dynamic input surface for an electronic device and a method of reconfiguring the same is disclosed. The input surface has a partially-flexible metal contact portion defining an input area, and a group of indicators. The indicators may be group of holes extending through the contact portion. The group of holes may be selectively illuminated based on a gesture performed on the contact portion. A size of the input area may be dynamically varied based on the gesture. Additionally, the group of indicators indicates a boundary of the input area.
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公开(公告)号:US10724158B2
公开(公告)日:2020-07-28
申请号:US15549110
申请日:2016-02-12
Applicant: Apple Inc.
Inventor: Daniel A. Podhajny , Daniel D. Sunshine , Kathryn P. Crews
Abstract: Weaving equipment may include warp strand positioning equipment that positions warp strands and weft strand positioning equipment that inserts weft strands among the warp strands to form fabric. The fabric may include insulating strands and conductive strands. Conductive strands may run orthogonal to each other and may cross at open circuit and short circuit intersections. The fabric may be formed using pairs of interwoven warp and weft strands. Conductive warp and weft strands may be interposed within the pairs of strands. The fabric may be a single layer fabric or may contain two or more layers. Stacked warp strands may be formed between pairs of adjacent insulating warp strands. The stacked warp strands may include insulating and conductive strands. Touch sensors and other components may include conductive structures that are formed from the conductive strands in the fabric.
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公开(公告)号:US10701802B2
公开(公告)日:2020-06-30
申请号:US16685846
申请日:2019-11-15
Applicant: Apple Inc.
Inventor: Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
IPC: H05K1/00 , H05K1/03 , D03D1/00 , H01L23/498 , H05K1/02 , H01L23/31 , H05K1/11 , H05K1/18 , A41D1/00
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号:US20200087823A1
公开(公告)日:2020-03-19
申请号:US16415486
申请日:2019-05-17
Applicant: Apple Inc.
Inventor: Peter F. Coxeter , Didio V. Gomes , Benjamin J. Grena , Steven J. Keating , David M. Kindlon , Maurice P. May , Daniel A. Podhajny , Andrew L. Rosenberg , Daniel D. Sunshine
Abstract: A fabric-based item may include fabric formed from intertwined strands of material. The fabric may include first and second fabric layers that at least partially surround a pocket. Initially, the pocket may be completely enclosed by the first and second layers of fabric. A shim may be placed in the pocket before the pocket is closed. An opening may be formed in the first layer of fabric to expose a conductive strand in the pocket. The shim may prevent the cutting tool from cutting all the way through to the second layer of fabric. After cutting the hole in the first layer of fabric, the shim may be removed and an electrical component may be soldered to the conductive strand in the pocket. A polymer material may be injected into the pocket to encapsulate the electrical component. The polymer material may interlock with the surrounding pocket walls.
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