公开(公告)号：US10597321B2

公开(公告)日：2020-03-24

申请号：US15114236

申请日：2015-01-27

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Jose Mario Quintal ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner ,  Andrea Nichole Yeary

IPC: B23K26/40 ,  C03B33/02 ,  B23K26/08 ,  C03B33/09 ,  C03B33/08 ,  B23K26/53 ,  B24B9/10 ,  B23K26/02 ,  B23K26/04 ,  B23K26/035 ,  B23K26/361 ,  B23K26/0622 ,  B23K26/362 ,  B23K26/402 ,  C03C21/00 ,  B23K103/00

Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

公开(公告)号：US20200055766A1

公开(公告)日：2020-02-20

申请号：US16608037

申请日：2018-04-24

Applicant: CORNING INCORPORATED

Inventor： Alejandro Antonio Becker ,  Michele Marie-Louise Fredholm ,  Thomas Hackert ,  Albert Roth Nieber ,  Sergio Tsuda

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/53 ,  C03B23/025 ,  C03B33/033

Abstract: In some embodiments, a method of forming a glass article comprises perforating a glass substrate along a contour with a laser forming a plurality of perforations, such that the contour separates a first portion of the glass substrate from a second portion of the glass substrate. After perforating, thermal forming the glass substrate into a non-planar shape with a mold, and separating the first portion of the glass substrate from the second portion of the glass substrate.

公开(公告)号：US10442719B2

公开(公告)日：2019-10-15

申请号：US14530410

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B23K26/02 ,  B23K26/08 ,  C03B33/02 ,  C03B33/08 ,  C03B33/09 ,  B23K26/53 ,  B24B9/10 ,  B23K26/04 ,  B23K26/035 ,  B23K26/361 ,  B23K26/0622 ,  B23K26/362 ,  B23K26/402 ,  C03C21/00 ,  B23K103/00

Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

公开(公告)号：US10293436B2

公开(公告)日：2019-05-21

申请号：US14535800

申请日：2014-11-07

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Shyamala Shanmugam ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B23K26/04 ,  B23K26/06 ,  B23K26/38 ,  B23K26/53 ,  B23K26/55 ,  B32B17/06 ,  C03B33/02 ,  C03B33/09 ,  C03C15/00 ,  C03C17/00 ,  B23K26/384 ,  B23K26/402 ,  B23K26/0622 ,  C09K13/00 ,  B23K103/00

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

公开(公告)号：US10233112B2

公开(公告)日：2019-03-19

申请号：US15251605

申请日：2016-08-30

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/08 ,  B23K26/00 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/53 ,  C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/382 ,  B23K26/55 ,  B23K26/359 ,  B23K103/00

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

公开(公告)号：US10183885B2

公开(公告)日：2019-01-22

申请号：US15496393

申请日：2017-04-25

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Stephan Lvovich Logunov ,  Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Kamjula Pattabhirami Reddy ,  Pushkar Tandon ,  Sergio Tsuda ,  Natesan Venkataraman ,  Robert Stephen Wagner

IPC: C03B33/02 ,  C03B25/087 ,  C03B33/07 ,  B23K26/53 ,  B23K26/0622 ,  B23K26/402 ,  C03B17/06 ,  C03B33/09 ,  B23K26/359 ,  B23K103/00 ,  B23K103/16

Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.

公开(公告)号：US09975799B2

公开(公告)日：2018-05-22

申请号：US15472593

申请日：2017-03-29

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Albert Roth Nieber ,  Stephan Lvovich Logunov ,  Pushkar Tandon ,  Sergio Tsuda

IPC: C03B9/12 ,  C03B9/46 ,  C03B33/08

CPC classification number: C03B9/46 ,  B23K26/0624 ,  B23K26/0648 ,  B23K26/0652 ,  B23K26/0738 ,  B23K26/0838 ,  B23K26/103 ,  B23K26/38 ,  B23K26/382 ,  B23K26/402 ,  B23K2101/04 ,  B23K2103/50 ,  B23K2103/54 ,  C03B9/12 ,  C03B9/42 ,  C03B13/04 ,  C03B21/04 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/082 ,  C03B33/091

Abstract: Methods of fabricating formed glass articles are described herein. In one embodiment, a method for fabricating a formed glass article may include forming a glass ribbon, forming a parison, and shaping the parison to form a glass article. The glass article may be attached to the glass ribbon at an attachment region defining an edge of the glass article. The process may also include contacting the attachment region with a focal line of a laser beam and separating the glass article from the glass ribbon at the attachment region. The attachment region may be perforated by the laser beam and the focal line may be substantially perpendicular to the plane of the glass ribbon.

公开(公告)号：US09815730B2

公开(公告)日：2017-11-14

申请号：US14530379

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/09 ,  C03B33/02 ,  C03B33/08 ,  C03B33/10 ,  C03B23/02 ,  C03B33/033 ,  C03B23/023 ,  C03B23/025 ,  B23K26/00 ,  B23K26/402 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/08 ,  C03B33/023 ,  C03B33/04 ,  B23K103/16 ,  B23K103/00

CPC classification number: C03B33/091 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/0884 ,  B23K26/359 ,  B23K26/402 ,  B23K26/53 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/54 ,  B65G2249/04 ,  C03B23/02 ,  C03B23/023 ,  C03B23/025 ,  C03B33/0222 ,  C03B33/023 ,  C03B33/033 ,  C03B33/04 ,  C03B33/082 ,  C03B33/102 ,  Y02P40/57 ,  Y10T428/15 ,  Y10T428/24777

Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.

公开(公告)号：US20170291844A1

公开(公告)日：2017-10-12

申请号：US15585305

申请日：2017-05-03

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02 ,  B32B17/06 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/00 ,  B23K26/073

CPC classification number: C03B33/0222 ,  B23K26/0006 ,  B23K26/0613 ,  B23K26/0624 ,  B23K26/0738 ,  B23K26/40 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B32B17/06 ,  B32B2250/02 ,  B32B2315/02 ,  Y02P40/57 ,  Y10T428/21 ,  Y10T428/24273 ,  Y10T428/24355

Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

公开(公告)号：US20170189999A1

公开(公告)日：2017-07-06

申请号：US15325893

申请日：2015-07-14

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Stephan Lvovich Logunov ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Pushkar Tandon ,  Sergio Tsuda

IPC: B23K26/402 ,  B23K26/0622 ,  B23K26/064 ,  C03B33/07 ,  B23K26/08 ,  B23K26/359 ,  B23K26/57 ,  C03B33/02 ,  B23K26/53 ,  B23K26/073

CPC classification number: B23K26/402 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0738 ,  B23K26/08 ,  B23K26/359 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/076 ,  Y02P40/57

Abstract: A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.