公开(公告)号：JP2000236035A

公开(公告)日：2000-08-29

申请号：JP29423599

申请日：1999-10-15

Applicant: DAISHINKU CORP

Inventor： NAKADA HOZUMI ,  NAKAJIMA MIKIO ,  IIZUKA MINORU ,  MIURA YASUNORI

IPC: H01L23/02 ,  H03H9/02 ,  H03H9/10 ,  H03H9/19

Abstract: PROBLEM TO BE SOLVED: To offer a piezoelectric vibration device and a package for an electronic component, which can maintain the reliability of hermetic seal at a practicable level and improve the electrical performance of the electronic component even if the package is microminiaturized. SOLUTION: A ceramic package 1 comprises a ceramic base 10 and a frame- shaped metal layer formed on the bank of the concave base. The metal layer is composed of a metalized layer 11 made of tungsten, etc., and a first metal film layer 12 formed on the top of the metalized layer 11. A metal lid 2, which is to be hermetically sealed, has a frame-shaped second metal film layer 21 which is mated with the first frame-shaped metal film layer 12, at the bottom face of a metal base 20 made of covar, etc. The second metal film layer 21 is made of silver solder, etc. The metal lid 2 and the metal film layers of the ceramic package 1 are bonded by seam welding.

公开(公告)号：JP2000195978A

公开(公告)日：2000-07-14

申请号：JP37036498

申请日：1998-12-25

Applicant: DAISHINKU CORP

Inventor： NAKADA HOZUMI ,  NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: H01L23/02

Abstract: PROBLEM TO BE SOLVED: To improve reliability of a sealing, when heating locally by a high-frequency power the blazing portion of a metallic cover to a ceramic package, by passing a gas along the central portion of the metal cover, and by lowering relatively the temperature of its central portion than that of its peripheral portion which contributes to airtight joining to the ceramic package. SOLUTION: In an annular high-frequency coil 5 provided in a high-frequency heating apparatus, there is formed a receiving platform 7 made of mica, etc., which serves as one portion of an suction apparatus by using its hollow inside as an sucking tube 71. The receiving platform 7 is formed of a material unheated by high-frequency heating to make avoidable the waste of an excess energy. A metal cover 2 is mounted on the top surface of the receiving platform 7, and further a ceramic package 1 is mounted on the metallic cover 2 so that an electronic element 3 is stored in it airtightly. Then, while sucking the metallic cover 2 in the direction shown by an arrow by the sucking tube 71 of the receiving platform 7, the high-frequency coil 5 is subjected to current application for brazing the cover 2 to the package 1 by the high-frequency heating. At this time, since the metal cover 2 is sucked by the suction tube 71, its central portion is cooled to suppress the vaporization of a brazing material.

公开(公告)号：JPH11111880A

公开(公告)日：1999-04-23

申请号：JP29152997

申请日：1997-10-07

Applicant: DAISHINKU CORP

Inventor： NAKADA HOZUMI ,  IIZUKA MINORU

IPC: H01L23/02 ,  H01L23/10 ,  H03H9/02 ,  H03H9/10 ,  H03H9/25

Abstract: PROBLEM TO BE SOLVED: To provide a more highly reliable package for an electronic component capable of miniaturizing the package for the electronic component, without lowering sealing property of the package for the electronic component. SOLUTION: A housing space 11 of an electronic element and an outer wall 12 are provided, metallization parts 131 and 132 for brazing are formed on the upper surface of the outer wall 12, an insulation case 1 provided with a metallic sealing ring 2 through brazing filler metal 3 on the upper surface of the metallization parts 131 and 132 is provided and this package for the electronic component is composed by performing air-tight sealing by welding a metallic lid body 4 onto the metallic sealing ring 2 of the insulation case 1. A recessed part or a projected part or a recessed and projected part is formed at the brazing filler metal joined part of the metallic sealing ring 2 and the projected part or the recessed part or a projected and recessed part corresponding to the recessed part or projected part or recessed and projected part of the metallic sealing ring 2 is formed on the insulation case.

公开(公告)号：JPH04260087A

公开(公告)日：1992-09-16

申请号：JP4415091

申请日：1991-02-15

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU

IPC: G09F9/37

Abstract: PURPOSE:To reduce the voltage at the time of driving and to realize excellent recognition of all three colors with a wide view angle by eliminating additional weighting by forming no color film, etc., on an insulating film, and providing a 3rd color on the opposite surface of a movable electrode film. CONSTITUTION:First and second movable electrode films 31 and 32 are installed between 1st and 2nd fixed electrode plates 1 and 2 in parallel at a specific interval. The movable electrode films 31 and 32 use soft thin elastic films as their core materials, metallic thin film electrodes 31b and 32b of aluminum, etc., are formed on the opposite surfaces of the fixed electrode plates 1 and 2 and processed into specular surfaces, and 3rd insulating color films 31a and 32a are provided on the opposite surface of the insulating film 33. The insulating film 33 is provided between the 1st and 2nd movable electrode films 31 and 32 and an elastic film of polyethylene terephthalate, etc., is used for the insulating film 33 as well. Then voltages are applied to the fixed electrodes 1 and 2 and movable electrode films 31 and 32 independently.

公开(公告)号：JPH02202627A

公开(公告)日：1990-08-10

申请号：JP2438489

申请日：1989-02-01

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU ,  TOGO HIDEHIKO

IPC: G06F3/153 ,  G06T11/80

Abstract: PURPOSE:To incorporate software into the picture editing system of a dot matrix type display by once reading a digital RGB signal outputted from a personal computer for picture input into RAM, transferring picture data to a personal computer for picture editing and re-editing it. CONSTITUTION:A read/write selector 33 and an address control part 34 are controlled by the control program of the personal computer (PC) for picture editing. When the selector 33 is set in a write mode, picture data which PC for picture input 2 has inputted is written in RAM 32. When the selector 33 is set in a read mode, the control signals of a column number counter, a row number counter and a bit counter are outputted in a control program on PC 1. When serial data from RAM 32 change into picture data of one byte, they are shifted on GRAM 11 in PC 1. Thus, picture-generating software can be incorporated in the picture editing system without changing software.

公开(公告)号：JP2011055391A

公开(公告)日：2011-03-17

申请号：JP2009204337

申请日：2009-09-04

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU

IPC: H03H9/02 ,  H01L23/04

Abstract: PROBLEM TO BE SOLVED: To provide a new chip type piezoelectric vibration device in which holding and hermetic sealing of a piezoelectric vibration element can be reliably achieved.
SOLUTION: A piezoelectric vibration device is composed of a piezoelectric diaphragm 1 with a frame of a rectangular shape in a plan view, a terminal plate 3 of a rectangular shape in a plan view for packaging the piezoelectric diaphragm thereon, and a lid body 2 covering the inside of the frame. The piezoelectric diaphragm 1 with the frame has a tuning-fork type crystal diaphragm 11 and has a structure in which a frame 12 around which a belt-like frame is circumferentially formed is formed. A base material for the terminal plate 3 is constituted of a glass material such as borosilicate glass and the terminal plate 3 has a thin portion 30 and thick portions 31, 32 in a rectangular shape in a plan view. The piezoelectric diaphragm 1 with the frame is bonded onto the terminal plate 3, and the lid body 2 is bonded to an upper surface thereof. The terminal plate 3 and the frame 12 of the piezoelectric diaphragm 1 with the frame are hermetically bonded by a low fusing point glass material for bonding, and the lid body 2 is also hermetically bonded to the frame 12 by the low fusing point glass material for bonding.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种可以可靠地实现压电振动元件的保持和气密密封的新的片式压电振动装置。 解决方案：压电振动装置由平面图中具有矩形框架的压电振动板1，在其上封装压电振动板的平面图中的矩形端子板3和盖 主体2覆盖框架的内部。 具有框架的压电振动板1具有音叉型晶体振动膜11，并且具有这样的结构，其中围绕其形成有带状框架的框架12。 端子板3的基材由玻璃材料如硼硅酸盐玻璃构成，端子板3具有薄的部分30和平面图中的矩形的厚壁部分31,32。 将具有框架的压电振动膜1接合到端子板3上，并且将盖体2接合到其上表面。 具有框架的压电振动板1的端子板3和框架12通过用于粘合的低熔点玻璃材料气密地接合，并且盖体2也通过低熔点玻璃材料气密地结合到框架12，用于 结合。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010213134A

公开(公告)日：2010-09-24

申请号：JP2009058878

申请日：2009-03-12

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU

IPC: H03H9/02 ,  H01L23/02

Abstract: PROBLEM TO BE SOLVED: To provide a new chip type piezoelectric vibration device in which holding and hermetic sealing of a piezoelectric vibration element can be reliably achieved.
SOLUTION: The piezoelectric vibration device is composed of a piezoelectric diaphragm 1 with a frame of a rectangular shape in a plan view and metallic terminals 2 and 3 of a rectangular shape in a plan view. The piezoelectric diaphragm 1 with a frame has a tuning-fork type crystal diaphragm 11 at the center and has a structure in which a frame 12 around which a belt-like frame is circumferentially formed is formed. A metal film is formed on both sides of the frame 12. Covers 21 and 31 and bends 22 and 32 bent at a substantially right angle at one of the short sides are formed to the metallic terminals 2 and 3. Joining is achieved while the piezoelectric diaphragm 1 with the frame is sandwiched between the metallic terminals 2 and 3, thereby the frame inside is hermetically sealed while one terminal of the tuning-fork type crystal diaphragm is drawn out to a metallic terminal 2 side and the other terminal of the tuning-fork type crystal diaphragm is drawn out to a metallic terminal 3 side.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种可以可靠地实现压电振动元件的保持和气密密封的新的片式压电振动装置。 解决方案：压电振动装置由平面图中具有矩形框架的压电振动板1和平面图中的矩形金属端子2,3组成。 具有框架的压电振动板1在中央具有音叉型晶体振动膜11，并且具有其中周围形成有带状框架的框架12的结构。 金属膜形成在框架12的两侧。在金属端子2和3上形成有盖子21和31以及在其中一个短边处以大致直角弯曲的弯曲部22和32。压电 具有框架的隔膜1被夹在金属端子2和3之间，由此，音叉式水晶膜片的一个端子被抽出到金属端子2侧，调谐型隔板1的另一个端子被内部的框架气密地密封， 叉式晶体振膜被拉出到金属端子3侧。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2008219395A

公开(公告)日：2008-09-18

申请号：JP2007053075

申请日：2007-03-02

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU ,  MORIMOTO YOSUKE

IPC: H03H9/10 ,  H03H3/02 ,  H03H9/02

Abstract: PROBLEM TO BE SOLVED: To provide a piezoelectric vibrating device improving an impact resistive performance, enhancing a conductive performance and reducing a cost. SOLUTION: The piezoelectric vibrating device is composed of a metal base 1 with metal lead terminals, a piezoelectric diaphragm 2 loaded on the metal lead terminals and electrically connected through conductive-resin adhesives S and a metal cover 3. In the piezoelectric vibrating device, corrosion preventive films are formed to the metal lead terminals and the external surface of the metal base and oxide films for the corrosion preventive films on the uppermost surfaces of the corrosion preventive films. In the piezoelectric vibrating device, the piezoelectric diaphragm is joined directly in an electromechanical manner by using the conductive-resin adhesive softer than a pencil hardness 4B on the top faces of oxide layers for the corrosion preventive films under the state, in which the oxide layers in sections coated with at least the conductive-resin adhesives are thinner than those of other regions or the oxide films are scattered, on the inner sides of the metal lead terminals at the same time. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种提高耐冲击性能的压电振动装置，提高导电性能并降低成本。 解决方案：压电振动装置由具有金属引线端子的金属基体1，负载在金属引线端子上的压电振动膜2和通过导电树脂粘合剂S和金属盖3电连接。在压电振动 在防腐蚀膜的最上表面的金属引线端子和金属基体的外表面和防腐蚀膜用氧化物膜上形成防腐蚀膜。 在压电振动装置中，通过使用导电树脂粘合剂比在铅笔硬度4B比在用于防腐蚀膜的氧化物层的顶面上的导电树脂粘合剂更直接地接合在压电振动装置中，其中氧化物层 在至少涂覆有导电树脂粘合剂的部分中，与金属引线端子的内侧同时地，其它区域的薄膜或氧化膜被散射。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007274071A

公开(公告)日：2007-10-18

申请号：JP2006094142

申请日：2006-03-30

Applicant: Daishinku Corp ,  Kyocera Corp ,  京セラ株式会社 ,  株式会社大真空

Inventor： IIZUKA MINORU ,  SHIBUYA KOZO ,  ITO YOSHIAKI

IPC: H03H9/02 ,  H01L23/02 ,  H01L23/10

Abstract: PROBLEM TO BE SOLVED: To restrain manufacturing cost, while realizing an airtight sealing configuration that copies with environmental problems.
SOLUTION: In a quartz oscillator 1, a package 5 is constituted of joining a base 3 for holding a quartz oscillation piece 2 to a cap 4 for airtightly sealing the quartz oscillation piece 2, an airtightly sealed internal space 6 is formed in a package 5, and the quartz oscillation piece 2 is held on the base 3 in the internal space 6 by using a jointing material 7. The base 3 is formed into a box shape comprising a bottom 31 and a bank 32 laminated on the bottom 31, the bottom 31 and the bank 32 are baked integrally, while the section is into a recessed shape, and the upper surface of the bank 32 is a junction region 33 with the cap 4. A junction material 7, made of a glass material without containing lead with bismuth oxide as a main constituent, is formed on the junction region 33 for jointing to the cap 4. One portion 71 of the jointing material 7 is arranged in the internal space 6, while projecting toward the inside of a casing in a plan view of the base 3.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了抑制制造成本，同时实现与环境问题复制的气密密封构造。 解决方案：在石英振荡器1中，封装5由用于将石英振荡片2保持在用于气密密封石英振动片2的盖4的基座3上，形成气密密封的内部空间6 包装5，石英振动片2通过使用接合材料7保持在内部空间6的基部3上。基部3形成为盒状，其包括层叠在底部31上的底部31和堤岸32 ，底部31和堤32被整体烘烤，同时该部分为凹形，并且堤岸32的上表面是与盖4的接合区域33.连接材料7由玻璃材料制成，没有 在接合区域33上形成含有氧化铋作为主要成分的铅，连接到盖4上。接合材料7的一部分71配置在内部空间6中，同时向壳体内部突出 基地的平面图3.版权所有（C）2008 ，JPO＆INPIT

公开(公告)号：JP2004022558A

公开(公告)日：2004-01-22

申请号：JP2002171024

申请日：2002-06-12

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU

IPC: H05K3/32 ,  H01L23/12 ,  H03H3/02 ,  H03H3/04 ,  H05K1/02 ,  H05K3/00 ,  H05K3/24 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic part that enables downstream operations such as an inspection without the necessity for cutting off all ceramic bases after plating, in contrast to a method of improving production efficiency by dividing a ceramic base in the manufacturing of an electronic part such as a quartz oscillator.
SOLUTION: A plurality of ceramic bases are integrally formed in a ceramic laminate E in a matrix form. Plating is performed on a base metal layer having a wiring pattern and so forth which is formed beforehand on the ceramic laminate E. The ceramic laminate E is split in the column direction of the ceramic bases to have broken laminates F. Quartz resonator plates are mounted on the ceramic bases on the broken laminates F. After frequency adjustment is performed on the quartz oscillator plates, caps are joined to the ceramic bases and the broken laminates F are divided to have quartz oscillators 1.
COPYRIGHT: (C)2004,JPO