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    51.
    发明专利
    未知

    公开(公告)号：SE0004494L

    公开(公告)日：2002-06-06

    申请号：SE0004494

    申请日：2000-12-05

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LEWIN THOMAS ,  LIGANDER PER ,  GEVORGIAN SPARTAK

    IPC: H01Q15/14

    Abstract: The present invention relates an antenna arrangement (23, 330, 430, 530, 630) comprising a fit layer (331, 431, 531, 631) consisting of a dielectric material and a second reflective layer (335, 435, 535, 640, The dielectric material has variable dielectric characteristics. An electromagnetic radiation (50) passing through said first layer (331, 431, 531, 631) and at least partly reflected by said second layer (335, 435, 535, 640) is modulated by varying said variable dielectric characteristics of said first layer.

    52.
    发明专利
    未知

    公开(公告)号：BR0010572A

    公开(公告)日：2002-06-04

    申请号：BR0010572

    申请日：2000-05-18

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER

    IPC: H01L23/12 ,  H01L21/48 ,  H01L23/15 ,  H01L23/36 ,  H01L23/373

    Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.

    53.
    发明专利
    未知

    公开(公告)号：SE515856C2

    公开(公告)日：2001-10-22

    申请号：SE9901831

    申请日：1999-05-19

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER

    IPC: H01L23/12 ,  H01L21/48 ,  H01L23/15 ,  H01L23/36 ,  H01L23/373

    Abstract: A carrier intended for one or several electronic components and having spaces provided for the components on at least one surface is provided. The carrier has an at least partly conductive Low Temperature Cofire Ceramic (LTCC) material with good thermal conduction capacity, so that the carrier provides mechanical support for the components and conducts heat generated by the components.

    56.
    发明专利
    未知

    公开(公告)号：SE0101181D0

    公开(公告)日：2001-03-30

    申请号：SE0101181

    申请日：2001-03-30

    Applicant: ERICSSON TELEFON AB L M

    Inventor： LIGANDER PER ,  BERGSTEDT LEIF ,  KARLSSON INGMAR

    IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q

    Abstract: An antenna arrangement includes a first portion and a second portion, each portion being arranged spaced apart and on first and second sides of at least one carrier structure. Each of said first and second portions includes at least one antenna element. The antenna elements of each antenna portion are electrically connected and the antenna element of said first portion is arranged to transmit an incident electromagnetic radiation on said first side of said carrier in form of an electrical signal to the antenna element of said second portion on said second side of said carrier. The antenna element of said second portion is arranged to transform and radiate the electrical signal from the second side of the carrier. Each antenna element comprises a thin layer of a conductive coating arranged on at least part of surface of said carrier.

    57.
    发明专利
    未知

    公开(公告)号：SE9900840L

    公开(公告)日：2000-09-10

    申请号：SE9900840

    申请日：1999-03-09

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER

    IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H05K3/00

    Abstract: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

    59.
    发明专利
    未知

    公开(公告)号：SE9702490D0

    公开(公告)日：1997-06-27

    申请号：SE9702490

    申请日：1997-06-27

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER

    IPC: H01P3/08 ,  H01Q1/38 ,  H01Q13/08 ,  H01Q21/00 ,  H01P

    Abstract: An environmentally compatible microstrip structure for electromagnetic signals in the microwave frequency range and higher. The microstrip structure according to the invention comprises at least two dielectric bodies made of an inorganic non-metallic material. Conductors of the microstrip structure are disposed on a first dielectric body. The ground plane of the microstrip structure is disposed on a second dielectric body. The dielectric bodies are so oriented that the second dielectric is between the at least one conductor and the ground plane while the first dielectric body is not. At least one cavitity is formed in the second dielectric body around at least one of the conductors to thereby create a composite dielectric comprising gas/air/vacuum of the cavity and the second dielectric body. The composite dielectric giving the microstrip structure adequate performance with dielectrically poor but environmentally compatible dielectric materials forming the dielectric bodies.

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