Abstract:
PROBLEM TO BE SOLVED: To solve the problems on a technique for improving the original performance of microphotofabrication using far ultraviolet light, EUV, electron beam or the like, particularly ArF excimer laser light; to provide an excellent actinic ray- or radiation-sensitive resin composition which in patterning by liquid immersion exposure as well as by normal exposure, suppresses development defects, can reduce line edge roughness, and ensures a wide exposure latitude; and to provide a pattern forming method using the same. SOLUTION: The actinic ray- or radiation-sensitive resin composition comprises (A) a compound which generates an acid upon exposure with actinic rays or radiation, (B) a resin whose dissolution rate in an alkali developer increases by the action of an acid, and (C) a compound having a radical trapping group. The pattern forming method using the same is also provided. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray-sensitive or radiation-sensitive resin composition having an effect in the improvement of tapered profile of a resist pattern and enabling formation of a pattern with good LER performance, and a pattern forming method using the composition. SOLUTION: An actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a resin capable of increasing a solubility of the resin in an alkali developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, wherein the compound capable of generating an acid upon irradiation with an actinic ray or radiation is contained in an amount of 10 to 30 mass% based on the entire solid content of the actinic ray-sensitive or radiation-sensitive resin composition. The pattern forming method uses the composition. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an active light sensitive or a radiation sensitive resin composition which provides a fine pattern superior in exposure latitude and a pattern form, and to provide a pattern forming method using the same. SOLUTION: The active light sensitive or the radiation sensitive resin composition contains (A) a resin that has a repeating unit including structure represented by general formula (1) and a repeating unit including structure represented by general formula (I) and increases solubility in an alkali developing solution by the action of an acid, and (B) a compound that produces an acid by active light or radiation irradiation. Wherein, codes in formulas (1) and (I) represent differential meanings. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a pattern for reducing a residue on a substrate and obtaining a favorable cross-sectional shape.SOLUTION: The method for forming a pattern includes steps of: (a) forming an antireflection film on a substrate by using a first resin composition (I); (b) forming a resist film on the antireflection film by using a second resin composition (II); (c) exposing a laminate film to light; and (d) forming a negative pattern by developing the exposed laminate film by using a developing solution containing an organic solvent. The first resin composition (I) contains a first resin having polarity that is increased by the action of acid to decrease solubility with the developing solution containing an organic solvent. The second resin composition (II) contains a second resin having polarity that is increased by the action of acid to decrease solubility with the developing solution containing an organic solvent. At least one of (I) and (II) contains a compound that generates acid by irradiation with actinic rays or radiation.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a pattern for preventing pattern collapse in a process of forming a negative pattern by organic solvent development, and to provide a laminate resist pattern formed by the method, a laminate film for organic solvent development suitably used for the pattern forming method, a resist composition suitably used for the pattern forming method, a method for manufacturing an electronic device, and an electronic device.SOLUTION: The method for forming a pattern includes steps of: (a) forming a first film on a substrate by using a first resin composition (I) containing a resin, in which the content of a repeating unit having a group that is decomposed by the action of acid to produce a polar group is 20 mol% or less with respect to the whole repeating units of the resin; (b) forming a second film on the first film by using a second resin composition (II), which is different from the first resin composition (I) and which contains a resin having a group that is decomposed by the action of acid to produce a polar group, and a compound that generates acid by irradiation with actinic rays or radiation; (c) exposing the laminate film having the first film and the second film to light; and (d) forming a negative pattern by developing the first film and the second film in the exposed laminate film by using a developing solution containing an organic solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide an actinic ray sensitive or radiation sensitive resin composition having an ultrafine pore diameter (for instance, 60 nm or smaller), and capable of forming a hole pattern excellent in circularity with excellent dependence on development time, and to provide a resist film, a pattern forming method, a method for manufacturing an electronic device, and an electronic device using the same.SOLUTION: There is provided an actinic ray sensitive or radiation sensitive resin composition including: (P) a resin having a repeating unit (a) represented by the following general formula (I); and (B) a compound that generates an organic acid by irradiation with an actinic ray or radiation. A content of the compound (B) is 8.0 mass% or more based on the total solid content of the actinic ray sensitive or radiation sensitive resin composition. A resist film, a pattern forming method, a method for manufacturing an electronic device and an electronic device using the same are also provided. In the general formula (I), Rrepresents a hydrogen atom or a methyl group.
Abstract:
PROBLEM TO BE SOLVED: To provide a negative pattern formation method that allows excellent roughness performance such as line width roughness, exposure latitude, and dry etching resistance, and an actinic ray-sensitive or radiation-sensitive resin composition and a resist film used for the same.SOLUTION: A negative pattern formation method comprises: (A) a step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition including a resin containing repeating units consisting of 65 mol% or more repeating units including a group that is decomposed by the action of acid to generate a polar group, with respect to the repeating units in the resin as a whole, and expressed by a following general formula (I); (B) a step of exposing the film; and (C) a step of developing an image using a developing solution including an organic solvent to form a negative pattern.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern formation method that allows excellent roughness performance such as line width roughness and exposure latitude, and an actinic ray-sensitive or radiation-sensitive resin composition and a resist film used for the same.SOLUTION: A pattern formation method comprises: (A) a step of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition including a resin containing repeating units consisting of 65 mol% or more repeating units including a group that is decomposed by the action of acid to generate a polar group, with respect to the repeating units in the resin as a whole, and expressed by a following general formula (I) or (II); (B) a step of exposing the film; and (C) a step of developing an image using a developing solution including an organic solvent.