52.
    发明专利
    未知

    公开(公告)号:DE2723943A1

    公开(公告)日:1978-07-27

    申请号:DE2723943

    申请日:1977-05-27

    Applicant: IBM

    Abstract: A plating solution and method of forming such a solution for plating chromium and its alloys from Cr(III) is disclosed. The solution is an aqueous solution of a chromium(III) thiocyanate complex having at least a ligand other than water or thiocyanate in the inner coordination sphere.

    53.
    发明专利
    未知

    公开(公告)号:DK151975B

    公开(公告)日:1988-01-18

    申请号:DK475879

    申请日:1979-11-09

    Applicant: IBM

    Abstract: A very low concentration (below 0.03 M) trivalent chromium plating bath in which the source of chromium is an equilibrated aqueous solution of a chromium (III) - thiocyanate complex gives a deposit of unexpectedly light color. Such a bath is employed to produce thin overcoatings of light colored chromium for decorative applications. The bath and process is also used to plate the initial layer of a thick (greater than 5 micron) deposit for engineering applications, the major part of which is plated from a higher chromium concentration bath. Such thick deposits from a higher concentration bath are more cohesive and smoother when plated over an initial layer from the low concentration bath.

    ELECTRODEPOSITION OF CHROMIUM
    54.
    发明专利

    公开(公告)号:AU556367B2

    公开(公告)日:1986-10-30

    申请号:AU9068282

    申请日:1982-11-18

    Applicant: IBM

    Abstract: A chromium electroplating electrolyte comprising a source of trivalent chromium ions, a complexant, a buffer agent and a sulphur species selected from sulphites and dithionites, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 10 M preferably the chromium ions have a molar concentration lower than 0.01M. Complexants within this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid, 5-sulphosalicylic acid and citric acid.

    ELECTROLYTIC DISPLAY DEVICE EMPLOYING METAL ION CATALYSIS

    公开(公告)号:DE3175185D1

    公开(公告)日:1986-09-25

    申请号:DE3175185

    申请日:1981-12-24

    Applicant: IBM

    Abstract: An electrolytic display device, specifically an electrochromic display based on viologen, employs metal ions in solution to catalyse the reduction of display material at the display electrodes. The metal ions are deposited faster than the display material and subsequently chemically reduce this material. Thallium (I) as the metal catalyst in combination with an oxy-anion of phosphorus accelerates the display reaction without causing undesired precipitation from the solution. Cadmium (II) in combination with sulphate anions is also an effective catalyst. Either a greater amount of display material may be deposited than without the catalyst or the same amount deposited in a shorter time.

    ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS

    公开(公告)号:DE3265889D1

    公开(公告)日:1985-10-03

    申请号:DE3265889

    申请日:1982-11-11

    Applicant: IBM

    Abstract: A chromium electroplating electrolyte containing trivalent chromium ions, a complexant, a buffer agent and thiocyanate ions for promoting chromium deposition, the thiocyanate having a molar concentration lower than that of the chromium ions. The chromium preferably has a concentration lower than 0.01M. Preferably the complexant is selected so that the stability constant K1 of chromium complex is in the range 10 M . Complexants in this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid and 5-sulphosalicylic acid.

    59.
    发明专利
    未知

    公开(公告)号:NO151473C

    公开(公告)日:1985-04-17

    申请号:NO793615

    申请日:1979-11-09

    Applicant: IBM

    Abstract: A very low concentration (below 0.03 M) trivalent chromium plating bath in which the source of chromium is an equilibrated aqueous solution of a chromium (III) - thiocyanate complex gives a deposit of unexpectedly light color. Such a bath is employed to produce thin overcoatings of light colored chromium for decorative applications. The bath and process is also used to plate the initial layer of a thick (greater than 5 micron) deposit for engineering applications, the major part of which is plated from a higher chromium concentration bath. Such thick deposits from a higher concentration bath are more cohesive and smoother when plated over an initial layer from the low concentration bath.

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