1.
    发明专利
    未知

    公开(公告)号:FR2460344A1

    公开(公告)日:1981-01-23

    申请号:FR8007271

    申请日:1980-03-27

    Applicant: IBM

    Abstract: A process for plating thick chromium coatings for engineering applications comprises depositing a thin initial layer from a low concentration chromium III/thiocyanate bath and depositing the bulk of the remaining thickness from a relatively higher concentration chromium III/thiocyanate bath. Deposits produced by this two-stage process are more cohesive and smoother than those obtainable by plating the entire thickness from the high concentration bath alone.

    ELECTRODEPOSITION OF CHROMIUM
    4.
    发明专利

    公开(公告)号:AU9068282A

    公开(公告)日:1983-05-26

    申请号:AU9068282

    申请日:1982-11-18

    Applicant: IBM

    Abstract: A chromium electroplating electrolyte comprising a source of trivalent chromium ions, a complexant, a buffer agent and a sulphur species selected from sulphites and dithionites, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 10 M preferably the chromium ions have a molar concentration lower than 0.01M. Complexants within this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid, 5-sulphosalicylic acid and citric acid.

    6.
    发明专利
    未知

    公开(公告)号:FI793514A

    公开(公告)日:1980-05-12

    申请号:FI793514

    申请日:1979-11-09

    Applicant: IBM

    Abstract: A very low concentration (below 0.03 M) trivalent chromium plating bath in which the source of chromium is an equilibrated aqueous solution of a chromium (III) - thiocyanate complex gives a deposit of unexpectedly light color. Such a bath is employed to produce thin overcoatings of light colored chromium for decorative applications. The bath and process is also used to plate the initial layer of a thick (greater than 5 micron) deposit for engineering applications, the major part of which is plated from a higher chromium concentration bath. Such thick deposits from a higher concentration bath are more cohesive and smoother when plated over an initial layer from the low concentration bath.

    ELECTRODEPOSITION OF CHROMIUM
    7.
    发明专利

    公开(公告)号:AU556367B2

    公开(公告)日:1986-10-30

    申请号:AU9068282

    申请日:1982-11-18

    Applicant: IBM

    Abstract: A chromium electroplating electrolyte comprising a source of trivalent chromium ions, a complexant, a buffer agent and a sulphur species selected from sulphites and dithionites, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 10 M preferably the chromium ions have a molar concentration lower than 0.01M. Complexants within this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid, 5-sulphosalicylic acid and citric acid.

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