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公开(公告)号:DE1690575A1
公开(公告)日:1971-04-08
申请号:DEJ0035473
申请日:1968-01-11
Applicant: IBM
Inventor: HATZAKIS MICHAEL
IPC: B23K15/02 , H01J37/304 , H01L21/00 , H01J
Abstract: 1,160,353. Electron beam machining apparatus. INTERNATIONAL BUSINESS MACHINES CORP. 4 Jan., 1968 [13 Jan., 1967], No. 626/68. Heading H1D. [Also in Division G3] A beam of electrons is repeatedly scanned across an area with overshoots maintained equal on each side of the area by automatic control signals which are also utilized when the beam is moved to a working area to produce a pattern. In Fig. 3, an electron beam 19 has deflecting coils 54, 55 under the control of a programmed generator 91 to produce printed or integrated circuits on a silicon-doped wafer 20 by a series of operations. To ensure a correct datum position for the beam before the start of each operation deflecting coils 54, 55 are energized from a sine wave generator 77 and a slow sweep generator 76 so as to scan rectangular areas, formed by removing a silicon dioxide outer coating of the wafer or depositing noble metal over the coating of the wafer, in such a manner that the scan overshoots opposite edges of the rectangles. Secondary emission from a scanned area is collected at 59 and variations due to the overshoots filtered out at 62 for application to amplifiers 64, 67 which are gated by generator 77 so that each amplifier produces an output corresponding to the extent of overshoot of one edge. The two outputs are compared at 68 so that any difference is eliminated to correct the mean position of the beam by controlling through a switch 70 the energization of one or other of the additional deflecting coils 56, 57 according to which axis is being corrected. Correction relative to both axes in succession may be effected by programmer 85 changing over switch 70 as well as a switch 84 to transpose the generators associated with deflecting coils 54, 55. During the subsequent working operation the correction signals remain effective, being stored by integration amplifiers 71, 72. Simultaneous correction of the beam relative to the two axes using two different scanning frequencies is referred to.