ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS

    公开(公告)号:ZA828368B

    公开(公告)日:1983-09-28

    申请号:ZA828368

    申请日:1982-11-15

    Applicant: IBM

    Abstract: A chromium electroplating electrolyte containing trivalent chromium ions, a complexant, a buffer agent and thiocyanate ions for promoting chromium deposition, the thiocyanate having a molar concentration lower than that of the chromium ions. The chromium preferably has a concentration lower than 0.01M. Preferably the complexant is selected so that the stability constant K1 of chromium complex is in the range 10 M . Complexants in this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid and 5-sulphosalicylic acid.

    ELECTROPLATING CHROMIUM AND ITS ALLOYS

    公开(公告)号:AU3269978A

    公开(公告)日:1979-08-02

    申请号:AU3269978

    申请日:1978-01-24

    Applicant: IBM

    Abstract: A plating solution and method of forming such a solution for plating chromium and its alloys from Cr(III) is disclosed. The solution is an aqueous solution of a chromium(III) thiocyanate complex having at least a ligand other than water or thiocyanate in the inner coordination sphere.

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