公开(公告)号：US20170200666A1

公开(公告)日：2017-07-13

申请号：US15292554

申请日：2016-10-13

Applicant: Infineon Technologies AG

Inventor： Wolfram Hable ,  Martin Gruber ,  Juergen Hoegerl

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H02M5/297 ,  H02M3/158 ,  H02M7/217 ,  H02M7/537 ,  H02M5/293 ,  H01L25/18 ,  H01L21/56

CPC classification number: H01L23/3735 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/24 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/18 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H02M3/158 ,  H02M5/293 ,  H02M5/297 ,  H02M7/003 ,  H02M7/217 ,  H02M7/537 ,  H01L2224/45099

Abstract: A semiconductor chip package is disclosed. The package includes a carrier, a plurality of semiconductor chips disposed on the carrier, a first encapsulation layer disposed above the semiconductor chips. A metallization layer is disposed above the first encapsulation layer, the metallization layer including a plurality of first metallic areas forming electrical connections between selected ones of the semiconductor chips. A second encapsulation layer is disposed above the solder resist layer. A plurality of external connectors are provided, each one of the external connectors being connected with one of the first metallic areas and extending outwardly through a surface of the second encapsulation layer.

公开(公告)号：US20160377689A1

公开(公告)日：2016-12-29

申请号：US15049923

申请日：2016-02-22

Applicant: Infineon Technologies AG

Inventor： Giuliano Angelo Babulano ,  Jens Oetjen ,  Liu Chen ,  Toni Salminen ,  Stefan Mieslinger ,  Markus Dinkel ,  Martin Gruber ,  Franz Jost ,  Thorsten Meyer ,  Rainer Schaller

IPC: G01R33/00 ,  G01R33/09

CPC classification number: G01R33/0047 ,  G01R33/091 ,  H01L43/02 ,  H01L43/08 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/4903

Abstract: An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

Abstract translation: 互连模块包括具有第一端部分，第二端部部分和在第一和第二端部部分之间延伸的中间部分的金属夹。 第一端部部分被配置为外部连接到附接到载体或载体的金属区域的裸半导体管芯或封装的半导体管芯。 第二端部构造成用于外部附接到载体的不同金属区域或者附接到载体的不同的半导体管芯或封装的半导体管芯。 该模块还包括固定到金属夹的磁场传感器。 磁场传感器可操作以感测由流过金属夹的电流产生的磁场。 互连模块可以用于在模块附接到的载体的部件和/或金属区域之间形成直接电连接。