公开(公告)号：WO2015180616A1

公开(公告)日：2015-12-03

申请号：PCT/CN2015/079764

申请日：2015-05-26

Applicant: BYD COMPANY LIMITED

Inventor： ZHANG, Faliang ,  JIAN, Yongxi ,  GONG, Qing

IPC: C22C23/02 ,  C22C23/04 ,  C22C23/00 ,  B22D21/04

CPC classification number: C22C23/04 ,  C22C23/02 ,  C22F1/06

Abstract: An Al-Mg alloy plate and a method for preparing the same are provided. The Al-Mg alloy plate having a thickness of larger than 5mm includes a crystalline grain having a crystal grain size of less than about 60 μm; a pore having a particle diameter of less than about 200 μm; and an impurity having a particle diameter of less than about 200 μm.

Abstract translation: 提供了一种Al-Mg合金板及其制备方法。 厚度大于5mm的Al-Mg合金板包括晶粒尺寸小于约60μm的晶粒; 具有小于约200μm的粒径的孔; 和粒径小于约200μm的杂质。

公开(公告)号：WO2015058692A1

公开(公告)日：2015-04-30

申请号：PCT/CN2014/089164

申请日：2014-10-22

Applicant: BYD COMPANY LIMITED

Inventor： GONG, Qing ,  LIN, Xinping ,  WU, Hui ,  LI, Xiaofang ,  REN, Maolin ,  WANG, Shumin ,  WU, Mengxiang ,  DENG, Tianyou ,  WEN, Huaitong ,  ZHANG, Weifeng ,  QIU, Hongmei

IPC: H05B3/32 ,  H05B3/84

CPC classification number: B60S1/026 ,  F24H3/0435 ,  H05B3/03 ,  H05B3/04 ,  H05B3/141 ,  H05B3/40 ,  H05B3/50 ,  H05B2203/009 ,  H05B2203/02 ,  H05B2203/023 ,  H05B2214/02

Abstract: A positive temperature coefficient heating assembly includes a heating core (10) including a first metal electrode plate (2a), a second metal electrode plate (2b) and a plurality of PTC ceramic chips (1); an insulating layer coated on the heating core (10); and a metal tube (8); the PTC ceramic chip (1) includes a positive electrode layer, a negative electrode layer, and a ceramic sintered layer; a plurality of first limit grooves (21a) are formed in the first metal electrode plate (2a), a plurality of second limit grooves (2b) are formed in the second metal electrode plate (21b), a first end of each of the PTC ceramic chips (1) is embedded in one of the first limit grooves (21a), and a second end of each of the PTC ceramic chips (1) is embedded in one of the second limit grooves (21b).

Abstract translation: 正温度系数加热组件包括包括第一金属电极板（2a），第二金属电极板（2b）和多个PTC陶瓷芯片（1）的加热芯（10）; 涂覆在加热芯（10）上的绝缘层; 和金属管（8）; PTC陶瓷芯片（1）包括正极层，负极层和陶瓷烧结层; 在第一金属电极板（2a）中形成有多个第一限制槽（21a），在第二金属电极板（21b）中形成有多个第二限制槽（2b），每个PTC的第一端 陶瓷芯片（1）嵌入在第一极限槽（21a）中的一个中，并且每个PTC陶瓷芯片（1）的第二端嵌入在第二限制槽（21b）中的一个中。

公开(公告)号：WO2012155811A1

公开(公告)日：2012-11-22

申请号：PCT/CN2012/075368

申请日：2012-05-11

Applicant: BYD COMPANY LIMITED ,  GONG, Qing ,  LIN, Xinping ,  REN, Yongpeng ,  ZHANG, Baoxiang

Inventor： GONG, Qing ,  LIN, Xinping ,  REN, Yongpeng ,  ZHANG, Baoxiang

IPC: C04B41/88 ,  C23C18/16

CPC classification number: H05K3/181 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/88 ,  C04B2111/00844 ,  C23C18/06 ,  C23C18/1245 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1639 ,  H05K1/0306 ,  H05K3/182 ,  H05K3/185 ,  H05K2203/107 ,  Y10T428/24917 ,  C04B35/00 ,  C04B35/04 ,  C04B35/10 ,  C04B35/18 ,  C04B35/19 ,  C04B35/195 ,  C04B35/44 ,  C04B35/48 ,  C04B35/505 ,  C04B35/563 ,  C04B35/565 ,  C04B35/583 ,  C04B35/584 ,  C04B35/597 ,  C04B41/0036 ,  C04B41/4541 ,  C04B41/4572 ,  C04B41/0045 ,  C04B35/185 ,  C04B35/443 ,  C04B35/20

Abstract: A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E is at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

Abstract translation: 提供了选择性地金属化陶瓷基板的表面，陶瓷产品和陶瓷产品的用途的方法。 该方法包括以下步骤：A）模制和烧结陶瓷组合物以获得陶瓷基体，其中陶瓷组合物包含分散在陶瓷粉末中的陶瓷粉末和功能性粉末; 陶瓷粉末是选自E的氧化物，E的氮化物，E的氮氧化物和E的碳化物中的至少一种。 E是选自Li，Na，K，Rb，Cs，Be，Mg，Ca，Sr，Ba，B，Al，Ga，Si，Ge，P，As，Sc，Y，Zr中的至少一种 ，Hf和镧系元素; 功能性粉末是选自M的氧化物，M的氮化物，M的氧氮化物，M的碳化物和M的单质中的至少一种; 并且M是选自由Ti，V，Cr，Mn，Fe，Co，Ni，Cu，Zn，Nb，Mo，Tc，Ru，Rh，Pd，Ag，Cd，Ta， Re，Os，Ir，Pt，Au，In，Sn，Sb，Pb，Bi，Ce，Pr，Nd，Pm，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu; B）使用能量束照射陶瓷衬底的表面的预定区域，以在陶瓷衬底的表面的预定区域上形成化学电镀活性中心; 和C）在形成有化学电镀活性中心的陶瓷衬底上进行化学镀以在陶瓷衬底的表面的预定区域上形成金属层。

公开(公告)号：WO2011085584A1

公开(公告)日：2011-07-21

申请号：PCT/CN2010/075232

申请日：2010-07-19

Applicant: BYD COMPANY LIMITED ,  GONG, Qing ,  ZHOU, Liang ,  MIAO, Weifeng ,  ZHANG, Xiong

Inventor： GONG, Qing ,  ZHOU, Liang ,  MIAO, Weifeng ,  ZHANG, Xiong

IPC: C23C18/24 ,  G03F7/004 ,  H05K3/10 ,  B32B27/20 ,  B32B9/00

CPC classification number: C23C18/1653 ,  C23C18/1639 ,  C23C18/1651 ,  C23C18/1868 ,  C23C18/31 ,  C25D5/14 ,  C25D5/56 ,  Y10T428/12493 ,  Y10T428/1291

Abstract: A method for metalizing a plastic surface is provided. The method may comprise the steps of: 1) gasifying the plastic surface to expose the chemical plating promoter; 2) chemical plating a layer of copper or nickel on the plastic surface, and 3) plating the plated surface in step 2) by electroplating or chemical plating at least one more time to form a metalized layer on the plastic surface. Further, A method for preparing a plastic article and a plastic article manufactured by the method as described may be provided.

Abstract translation: 提供了塑料表面金属化的方法。 该方法可以包括以下步骤：1）气化塑料表面以暴露化学电镀促进剂; 2）在塑料表面上化学镀一层铜或镍，以及3）通过电镀或化学镀至少一次以上在塑料表面上形成金属化层，在步骤2）中镀覆电镀表面。 此外，可以提供通过所述方法制造的塑料制品和塑料制品的制备方法。

公开(公告)号：WO2011057552A1

公开(公告)日：2011-05-19

申请号：PCT/CN2010/078525

申请日：2010-11-08

Applicant: BYD COMPANY LIMITED ,  GONG, Qing ,  LI, Yunchun ,  JIAN, Yongxi ,  ZHANG, Faliang

Inventor： GONG, Qing ,  LI, Yunchun ,  JIAN, Yongxi ,  ZHANG, Faliang

IPC: C22C45/10 ,  C22C45/00 ,  C22C1/02

CPC classification number: C22C1/02 ,  C22C45/10

Abstract: A zirconium (Zr)-based amorphous alloy and a preparing method thereof are provided. The Zr-based amorphous alloy is represented by the general formula of (Zr a M b N c ) 100-x Q x , in which M is at least one transition metal except Zr; N is Be or Al; Q is selected from the group consisting of CaO, MgO, Y 2 O 3 , Nd 2 O 3 and combinations thereof; a, b and c are atomic percents of corresponding elements; and 45≤a≤75, 20≤b≤40, 1≤c≤25, a+b+c=100, and 1≤x≤15. A method for recycling a Zr-based amorphous alloy is also provided.

Abstract translation: 提供了一种锆（Zr）基非晶合金及其制备方法。 Zr基非晶合金由通式（ZraMbNc）100-xQx表示，其中M是除Zr以外的至少一种过渡金属; N为Be或Al; Q选自CaO，MgO，Y2O3，Nd2O3及其组合; a，b和c是相应元素的原子百分比; 并且45 = a = 75,20 = b = 40,1 = c = 25，a + b + c = 100，1 = x = 15。 还提供了一种用于再循环Zr基非晶态合金的方法。

公开(公告)号：WO2011050695A1

公开(公告)日：2011-05-05

申请号：PCT/CN2010/078014

申请日：2010-10-22

Applicant: BYD COMPANY LIMITED ,  GONG, Qing ,  ZHANG, Faliang ,  LI, Yunchun ,  QU, Jiangtao ,  HU, Xiaolei

Inventor： GONG, Qing ,  ZHANG, Faliang ,  LI, Yunchun ,  QU, Jiangtao ,  HU, Xiaolei

IPC: C22C45/10 ,  C22C45/00 ,  C22C1/02

CPC classification number: C22C16/00 ,  C22C1/002 ,  C22C1/02 ,  C22C45/10

Abstract: A Zr-based amorphous alloy and a method of preparing the same are provided. TheZr-based amorphous alloy is represented by the general formula of (Zr a M 1-a ) 100-x O x , inwhich a is an atomic fraction of Zr, and x is an atomic percent of O, in which: 0.3≤a≤0.9, 5and 0.02≤x≤0.6; and M may represent at least three elements selected from the groupconsisting of transition metals other than Zr, Group IIA metals, and Group IIIA metals in the Periodic Table of Elements.

Abstract translation: 提供了一种Zr基非晶态合金及其制备方法。 基于Zr的非晶合金由通式（ZraM1-a）100-xOx表示，其中a是Zr的原子分数，x是O的原子百分比，其中：0.3 = a = 0.9,5和0.02 = X = 0.6; M可以代表元素周期表中选自除Zr，IIA族金属和IIIA族金属以外的过渡金属的组中的至少三种元素。

公开(公告)号：WO2011032432A1

公开(公告)日：2011-03-24

申请号：PCT/CN2010/075594

申请日：2010-07-30

Applicant: BYD COMPANY LIMITED ,  GONG, Qing ,  DENG, Xiaoxia ,  DU, Xin

Inventor： GONG, Qing ,  DENG, Xiaoxia ,  DU, Xin

IPC: H01F1/053

CPC classification number: H01F41/0273 ,  B22F2998/10 ,  B22F2999/00 ,  C22C38/005 ,  C22C38/06 ,  C22C38/10 ,  C22C38/12 ,  C22C38/14 ,  C22C38/16 ,  H01F1/0577 ,  B22F9/08 ,  B22F9/04 ,  B22F1/0059 ,  B22F3/093 ,  B22F2003/248 ,  B22F2009/044 ,  B22F9/023

Abstract: A rare earth permanent magnetic material is provided, which is represented by the general formula of R a-x-y Ho x Dy y Fe 1-a-b-c-d Co d M c B b , wherein x, y, a, b, c and d are weight percentages of corresponding elements, in which 28%≤ a ≤34%, 0.95%≤ b ≤1.3%, 0≤ c ≤1.5%, 1%≤ d ≤10%, 15%≤ x ≤20% and 3%≤ y ≤8%; wherein R is a rare earth element, which is selected from the group consisting of Nd, Pr, La, Ce, Gd, Tb and combinations thereof; and wherein M is selected from the group consisting of Al, Cu, Ti, V, Cr, Zr, Hf, Nb, Sn, Mo, Ga, Si and combinations thereof. A method for preparing the rare earth permanent magnetic material is also provided.

Abstract translation: 提供稀土永磁材料，其由通式Ra-x-yHoxDyyFe1-abc-dCodMcBb表示，其中x，y，a，b，c和d是相应元素的重量百分数，其中28％ = a = 34％，0.95％= b = 1.3％，0 = c = 1.5％，1％= d = 10％，15％= x = 20％和3％= y = 8％ 其中R是选自Nd，Pr，La，Ce，Gd，Tb及其组合的稀土元素; 其中M选自Al，Cu，Ti，V，Cr，Zr，Hf，Nb，Sn，Mo，Ga，Si及其组合。 还提供了一种制备稀土永磁材料的方法。

公开(公告)号：WO2017092591A1

公开(公告)日：2017-06-08

申请号：PCT/CN2016/106864

申请日：2016-11-23

Applicant: BYD COMPANY LIMITED

Inventor： GONG, Qing ,  LIN, Xinping ,  CHEN, Ge ,  WU, Bo

IPC: C04B35/48 ,  C04B35/622

CPC classification number: C04B35/63488 ,  C04B35/488 ,  C04B35/6261 ,  C04B35/62655 ,  C04B35/63416 ,  C04B2235/3213 ,  C04B2235/3246 ,  C04B2235/3251 ,  C04B2235/3255 ,  C04B2235/442 ,  C04B2235/604 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2235/761 ,  C04B2235/762

Abstract: A Zr-based composite ceramic material, a preparation method thereof and a shell or a decoration are provided. The Zr-based composite ceramic material includes a zirconia matrix and a cubic Sr x NbO 3 stable phase dispersed within the zirconia matrix, where 0.7≤x≤0.95.

Abstract translation: 提供Zr基复合陶瓷材料，其制备方法和壳体或装饰物。 Zr基复合陶瓷材料包括氧化锆基体和分散在氧化锆基体内的立方Sr x NbO 3稳定相，其中0.7≤x≤0.95。

公开(公告)号：WO2017032334A1

公开(公告)日：2017-03-02

申请号：PCT/CN2016/096746

申请日：2016-08-25

Applicant: BYD COMPANY LIMITED

Inventor： GONG, Qing ,  LIN, Xinping ,  XU, Qiang ,  ZHANG, Weifeng ,  SHAO, Changjian ,  WEN, Huaitong

IPC: H01L23/00

CPC classification number: H01L23/3735 ,  H01L21/4807 ,  H01L23/562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/83447 ,  H01L2224/83815 ,  H01L2924/15159 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A method for soldering a chip on a metallic-ceramic composite board is provided, the metallic-ceramic composite board comprising a ceramic substrate, a first metal plate, and a second metal plate, plate faces at two sides of the ceramic substrate being configured to be a circuit face and a non-circuit face respectively, the first metal plate being connected to the circuit face, and the second metal plate being connected to the non-circuit face, wherein the method comprises: etching the second metal plate, such that the metallic-ceramic composite board forms a bent plate shape protruding towards the side at which the non-circuit face is located； and soldering the chip on the first metal plate, so as to obtain a substantially flat-straight metallic-ceramic composite board on which the chip is soldered. In addition, a metallic-ceramic composite board for soldering a chip thereon is provided.

Abstract translation: 提供了一种在金属陶瓷复合板上焊接芯片的方法，所述金属陶瓷复合板包括陶瓷基板，第一金属板和第二金属板，所述陶瓷基板的两侧的板面构成为 分别是电路面和非电路面，第一金属板连接到电路面，第二金属板连接到非电路面，其中所述方法包括：蚀刻所述第二金属板，使得 金属陶瓷复合板形成朝向非电路面所在的一侧突出的弯曲板状; 并将芯片焊接在第一金属板上，以获得芯片焊接在其上的基本上平直的金属陶瓷复合板。 另外，提供了用于在其上焊接芯片的金属陶瓷复合板。

公开(公告)号：WO2015169232A1

公开(公告)日：2015-11-12

申请号：PCT/CN2015/078408

申请日：2015-05-06

Applicant: BYD COMPANY LIMITED

Inventor： ZHANG, Faliang ,  JIAN, Yongxi ,  LI, Shaoqing ,  GONG, Qing

IPC: C22C21/00 ,  C22C1/02 ,  C25D11/04

CPC classification number: C22C1/02 ,  C22C21/00 ,  C22C21/06 ,  C25D11/04 ,  C25D11/14 ,  C25D11/243 ,  C25D11/246

Abstract: An aluminum alloy contains 1-4wt％ of Mn, 0.1-5wt％ of Mg, 0.002-0.5wt％ of a rare earth element, 0-2wt％ of Co, 0-1.5wt％ of Fe, 0-1wt％ of Ti, 0-1wt％ of Cu, 0-1.6wt％ of Zn, 0-0.5wt％ of Si, and 82.9-98.898wt％ of Al, based on total weight of the aluminum alloy. The rare earth element contains La. Based on the total weight of the rare earth element, the content of La in the rare earth element is from 20wt％ to 100wt％. A method of preparing an aluminum alloy, a method of coloring a surface of an aluminum alloy and an aluminum alloy product are also provided.

Abstract translation: 铝合金含有1-4重量％的Mn，0.1-5重量％的Mg，0.002-0.5重量％的稀土元素，0-2重量％的Co，0-1.5重量％的Fe，0-1重量％的Ti ，0-1重量％的Cu，0-1.6重量％的Zn，0-0.5重量％的Si和82.9-98.898重量％的Al，基于铝合金的总重量。 稀土元素含有La，以稀土元素的总重量计，稀土元素中的La的含量为20重量％〜100重量％。 还提供了制备铝合金的方法，铝合金表面和铝合金产品的着色方法。