公开(公告)号：DE3789102D1

公开(公告)日：1994-03-24

申请号：DE3789102

申请日：1987-12-03

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  REIGNIER MARIANNE ,  DUJARDIN FRANCOIS

IPC: C23G1/08 ,  C23F1/28 ,  C23F3/00 ,  C23F3/06

Abstract: Baths comprising, in aqueous solution, a mixture of hydrochloric acid, phosphoric acid, nitric acid and sulphosalicylic acid and at least one abietic compound.

公开(公告)号：NO173025C

公开(公告)日：1993-10-13

申请号：NO875201

申请日：1987-12-14

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  REIGNIER MARIANNE ,  DUJARDIN FRANCOIS

IPC: C23G1/08 ,  C23F1/28 ,  C23F3/00 ,  C23F3/06 ,  C23G1/06

Abstract: Baths comprising, in aqueous solution, a mixture of hydrochloric acid, phosphoric acid, nitric acid and sulphosalicylic acid and at least one abietic compound.

公开(公告)号：PT97999A

公开(公告)日：1992-03-31

申请号：PT9799991

申请日：1991-06-17

Applicant: SOLVAY

Inventor： BARTHELEMY NATHALIE ,  TYTGAT DANIEL

IPC: C23F3/06 ,  C23F3/00

Abstract: Baths for the chemical polishing of stainless steel surfaces which comprise a mixture of hydrochloric acid, nitric acid and phosphoric acid, a substituted or unsubstituted hydroxybenzoic acid and an amine in aqueous solution.

公开(公告)号：NO904579L

公开(公告)日：1991-04-25

申请号：NO904579

申请日：1990-10-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F1/18 ,  C23F3/06

Abstract: Baths for chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, phosphoric acid and tetraborate ions.

公开(公告)号：CA2028195A1

公开(公告)日：1991-04-25

申请号：CA2028195

申请日：1990-10-22

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F1/18 ,  C23F3/06 ,  C23G1/10

Abstract: Bains et procéde pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre Bains pour le polissage chimique de surfaces en cuivre ou en alliage de cuivre, comprenant, en solution aqueuse, du peroxyde d'hydrogène, de l'acide phosphorique et des ions tétraborate. Pas de figure.

公开(公告)号：AT55419T

公开(公告)日：1990-08-15

申请号：AT86200920

申请日：1986-05-27

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  LEFEVRE PIERRE

IPC: C23F3/00 ,  C23F3/06

公开(公告)号：DK529488D0

公开(公告)日：1988-09-23

申请号：DK529488

申请日：1988-09-23

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F3/00 ,  C23F3/06 ,  C23F1/18

Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.

公开(公告)号：FI884332A0

公开(公告)日：1988-09-21

申请号：FI884332

申请日：1988-09-21

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  MAGNUS STEFAAN

IPC: C23F3/00 ,  C23F3/06 ,  C23F

Abstract: Baths for the chemical polishing of copper or copper alloy surfaces, comprising, in aqueous solution, hydrogen peroxide, chloride ions, phosphoric acid and phosphate and hydrogenphosphate ions, in quantities adjusted so as to impart a pH of between 1.25 and 3 to the bath.

公开(公告)号：BR8706782A

公开(公告)日：1988-07-19

申请号：BR8706782

申请日：1987-12-14

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  REIGNIER MARIANNE ,  DUJARDIN FRANCOIS

IPC: C23G1/08 ,  C23F1/28 ,  C23F3/00 ,  C23F3/06 ,  C09K13/00

Abstract: Baths comprising, in aqueous solution, a mixture of hydrochloric acid, phosphoric acid, nitric acid and sulphosalicylic acid and at least one abietic compound.

公开(公告)号：NO875201L

公开(公告)日：1988-06-16

申请号：NO875201

申请日：1987-12-14

Applicant: SOLVAY

Inventor： TYTGAT DANIEL ,  REIGNIER MARIANNE ,  DUJARDIN FRANCOIS

IPC: C23G1/08 ,  C23F1/28 ,  C23F3/00 ,  C23F3/06 ,  C23G

Abstract: Baths comprising, in aqueous solution, a mixture of hydrochloric acid, phosphoric acid, nitric acid and sulphosalicylic acid and at least one abietic compound.