Abstract:
The invention relates to a method for producing a bonding of two substrates of which at least one is transparent and of which at least one has a surface having a surface energy (measured according to test method C) of 40 mN/m at maximum, comprising the use off a double-sided adhesive product having a first and a second adhesive surface, wherein the first adhesive surface is covered by a first separating layer and the second adhesive surface is covered by a second separating layer, wherein the pull-off force of the first separating layer from the first adhesive surface, AZK 1 , is less than the pull-off force of the second separating layer from the second adhesive surface, AZK 2 , and wherein the ratio of adhesion force of the fresh bond of the first adhesive surface on a surface having a surface energy (measured according to test method C) of 40 mN/m at maximum (KK fresh , measured according to test method B) to the pull-off force (measured according to test method A) of the second separating layer from the second adhesive surface, KK fresh : AZK 2 , equals at least 13.5, comprising the following step: (a) removing the first separating layer from the first adhesive surface and bringing the first adhesive surface into contact with the surface having a surface energy (measured according to test method C) of 40 mN/m at maximum.
Abstract:
Haftklebemasse enthaltend: a) mindestens 28 Gew.-% und höchstens 60 Gew.-% einer Elastomerkomponente, wobei i. die Elastomerkomponente zumindest 60 Gew.-% und bevorzugt höchstens 90 Gew.-%, jeweils bezogen auf die Elastomerkomponente, wenigstens ein hydriertes Polyvinylaromat-Polydien-Blockcopolymer mit einem Polyvinylaromatenanteil von mindestens 18 Gew.-% und einem Peak-Molekulargewicht von 100.000 bis 500.000 g/mol, bestimmt gemäß GPC (Test I), enthält, ii. die Polydien-Blöcke im Wesentlichen voll hydriert sind, iii. das hydrierte Polyvinylaromat-Polydien-Blockcopolymer einen ABA-Aufbau, (AB) n Z-Aufbau mit n = 2 oder radialen (AB) n -Aufbau oder radialen (AB) n -Z-Aufbau mit n ≥ 3 aufweist, wobei A = Polyvinylaromat, B = Ethylen und Butylen oder Ethylen und Propylen und Z = Derivat einer Kopplungssubstanz sind und wobei der Ethylen-Anteil in den B-Blöcken bevorzugt mindestens 50 Gew.-% beträgt, und iv. die Elastomerkomponente zumindest eine Sorte eines hydrierten Diblockcopolymers mit einem A'B'-Aufbau oder (A'B') n Z-Aufbau mit n = 1 enthält, wobei A' = Polyvinylaromat, B' = Ethylen und Butylen oder Ethylen und Propylen, Z = Derivat einer Kopplungssubstanz ist und A' = A und B' = B sein kann,
b) eine Klebharzkomponente, c) optional eine Weichmacherkomponente, d) mindestens 2,5 Gew.-% bis 22 Gew.-%, bevorzugt mindestens 4 Gew.-% bis zu 18 Gew.-%, einer Verstärkungskomponente, die wenigstens ein Harz mit einem MMAP-Wert zwischen -10 °C und +30 °C, bevorzugt zwischen 0 °C und +20 °C, und einem Erweichungspunkt von mindestens 140 °C ist, e) optional weitere Zuschlagsstoffe, wobei sich der Anteil der Elastomerkomponente auf das Gesamtgewicht der Haftklebemasse bezieht.
Abstract:
A self-adhesive article comprising (i) at least one carrier material which comprises at least one foamed layer having a first surface A and a second surface B, the at least one foamed layer of the carrier material having a thickness of at least 500 µm und at most 1800 µm, a tensile strength in detachment direction of at least 500 kPa, a tensile elongation in detachment direction of at least 300 % and a compressive hardness of at least 50 kPa, (ii) a layer HKA of pressure-sensitive adhesive (PSA) assigned to the surface A, (iii) a PSA layer HKB assigned to the surface B, and (iv) optionally further layers; the PSA layers HKA and HKB may be two PSA layer combinations, in which case, for PSA layer combination 1, PSA layer HKA is a PSA layer HKA1 with particularly good properties for bonding to rough substrates, and PSA layer HKB is a PSA layer HKB1 with a tensile strength of at least 9 MPa, and, for PSA layer combination 2, PSA layer HKA is a PSA layer HKA2 and PSA layer HKB is a PSA layer HKB2, each of these layers, but independently of one another, featuring not only good properties of bonding to rough substrates but also sufficient tensile strength at the same time, is particularly suitable for bonding to rough substrates whilst possessing strippability.
Abstract:
Composite made of two substrates more particularly for use for optical, electronic and/or precision-engineered equipment, comprising a first substrate and a second substrate and, arranged so as to connect the first substrate to the second substrate, an adhesive layer, characterized in that the adhesive layer comprises or consists of an adhesive which has, relative to the mixture, (a) from 60 % by weight to 90 % by weight of a first polymer component based on polyacrylate and (b) from 10 % by weight to 40 % by weight of a second polymer component based on elastomers, where the second polymer component is in essence not miscible with the first polymer component, so that the adhesive is present in at least two separate phases in the adhesive layer.
Abstract:
The invention relates to a self-adhesive compound, at least comprising a) at least one elastomer, wherein the elastomer has a ratio of at least 40 wt.-% relative to the adhesive compound composition and wherein at least one type of polybutadiene block copolymer is used as an elastomer, b) at least one partially hydrogenated hydrocarbon resin (resin type 1) having a softening temperature of at least 90 °C c) at least one additional hydrocarbon resin, a terpene phenol resin and/or a colophonium resin having a softening temperature of at least 90 °C (resin type 2) as applicable, d) a soft resin as applicable, and e) additional additives as applicable.
Abstract:
The invention relates to a pressure-sensitive adhesive comprising at least one synthetic rubber based on at least one vinylaromatic (A) and on at least one diene (B) and comprising block copolymers or else mixtures of these with a structure A-B-A and/or (A-B) n and derivatives thereof, where n is an integer which is at least 2, A is a polymer block comprising at least one vinylaromatic and B is a polymer block comprising at least one diene, and the proportion of the synthetic rubbers in the entire composition of the pressure-sensitive adhesive is at most 45% by weight, at least one bio-based adhesive resin and/or adhesive-resin mixture based to an extent of at least 85% by weight on renewable raw materials and having a softening point of at least 80°C and at most 110°C and making up a proportion of at least 35% by weight to at most 64% by weight of the entire composition of the pressure-sensitive adhesive, and at least one bio-based soft resin and/or soft-resin mixture based to an extent of at least 85% by weight on renewable raw materials and making up a proportion of at least 1% by weight to at most 25% by weight of the entire composition of the pressure-sensitive adhesive, where the entire pressure-sensitive adhesive without solvent corresponds to 100% by weight.
Abstract:
The aim of the invention is to improve the barrier effect of an adhesive strip for encapsulating electronic arrangements against permeates, in particular water and oxygen. This is achieved by providing a composite system for encapsulating electronic arrangements which comprises at least (a) an adhesive strip containing at least one pressure-sensitive adhesive substance for direct application on a substrate; and (b) at least one release liner which lies directly upon the pressure-sensitive adhesive substance, the surface of the release liner that faces the pressure-sensitive adhesive substance having a surface roughness of less that 100nm, measured as an arithmetic mean S a as per ISO/FDIS 25178-2:2011 of the amounts of at least 10,000 height values of the profile of a partial surface of at least 200µm x 200µm. The invention further relates to a method for producing a release liner with a smooth surface, the use of such a release liner for equipping barrier adhesive strips and the use of an adhesive strip obtained from the composite system as per the invention by removing the liner in order to encapsulate electronic arrangements.