公开(公告)号：JP2017109304A

公开(公告)日：2017-06-22

申请号：JP2016241721

申请日：2016-12-13

Applicant: 株式会社村田製作所

Inventor： ヘイッキ・クイスマ ,  マッティ・マンティサロ

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81B7/0006 ,  B81C1/00095 ,  B81C1/00373 ,  B81B2207/07 ,  B81C2201/0184

Abstract: 【課題】絶縁層によって分離された層を相互に連結させる、最適な方法を提供する。 【解決手段】積層された固体構造を含む微小電気機械デバイスにおいて、固体構造は、第1導電材料層81と、第2導電材料層83と、第1導電材料層81と第2導電材料層83との間の第3絶縁材料層82と、第2導電材料層83の表面から第3絶縁材料層82を貫通して、第1導電材料層81にまで延在しているビア溝89と、ビア溝89の底面に延在し、ビア溝89の高さよりも低い高さまでの、第1導電材料層81と第2導電材料層83との間の導電経路を成すように延在する導電性相互接合素子811と、を有し、導電性相互接合素子811は、ビア溝89の側壁814、818との間のある点においてよりも、ビア溝89の側壁814、818において、または、第3絶縁材料層82に形成されるアンダーカット内において実質的に高い。 【選択図】図12B

公开(公告)号：JP2014027322A

公开(公告)日：2014-02-06

申请号：JP2013232137

申请日：2013-11-08

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： YOSHIZUMI KENSUKE ,  HARIMA NORIKO ,  YAMADA TOMOKO

IPC: H01L21/288 ,  H01L21/3205 ,  H01L21/336 ,  H01L21/768 ,  H01L27/10 ,  H01L29/786

CPC classification number: H05K3/1283 ,  B81C1/00095 ,  B81C2201/0184 ,  H01L21/288 ,  H01L21/76879 ,  H01L51/0022 ,  H01L2924/0002 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/087 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To reduce firing temperature at the time of forming wiring and a conductive film, in a coating method that needs firing, such as a droplet discharge method.SOLUTION: Compositions, in which nanoparticles comprising conductive material are dispersed, are discharged by using a coating method such as a droplet discharge method, then solvent is evaporated by drying. Next, after pre-processing is performed by using active oxygen, wiring or a conductive film is formed by firing. In this way, firing temperature at manufacturing can be reduced, by performing the pre-processing using the active oxygen prior to firing.

Abstract translation: 要解决的问题：为了降低形成布线时的烧成温度和导电膜，以需要点火的涂布方法，例如液滴喷射法。溶液：其中分散有导电材料的纳米颗粒的组合物被排出 通过使用液滴喷射法等涂布方法，通过干燥蒸发溶剂。 接下来，在通过使用活性氧进行预处理之后，通过烧制来形成布线或导电膜。 这样，通过在烧成前进行使用活性氧的预处理，可以降低制造时的烧成温度。

公开(公告)号：JP5745597B2

公开(公告)日：2015-07-08

申请号：JP2013232137

申请日：2013-11-08

Applicant: 株式会社半導体エネルギー研究所

Inventor： 吉住 健輔 ,  針馬 典子 ,  山田 智子

IPC: H01L21/3205 ,  H01L21/768 ,  H01L27/10 ,  H01L29/786 ,  H01L21/336 ,  H01L21/288

CPC classification number: H05K3/1283 ,  B81C1/00095 ,  H05K3/125 ,  B81C2201/0184 ,  H01L21/288 ,  H01L21/76879 ,  H01L2924/0002 ,  H01L51/0022 ,  H05K2203/013 ,  H05K2203/087

公开(公告)号：JP2008252072A

公开(公告)日：2008-10-16

申请号：JP2008040843

申请日：2008-02-22

Applicant: Semiconductor Energy Lab Co Ltd ,  株式会社半導体エネルギー研究所

Inventor： YOSHIZUMI KENSUKE ,  HARIMA NORIKO ,  YAMADA TOMOKO

IPC: H01L21/3205 ,  H01L21/288 ,  H01L23/52 ,  H01L27/10

CPC classification number: H05K3/1283 ,  B81C1/00095 ,  B81C2201/0184 ,  H01L21/288 ,  H01L21/76879 ,  H01L51/0022 ,  H01L2924/0002 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/087 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To reduce firing temperature at the time of forming a wiring and a conductive film, when a coating method, such as a droplet dicharge method that needs firing, is used. SOLUTION: Compositions, in which nanoparticles comprising conductive materials are dispersed, are discharged by using the coating method such as the droplet discharge method; then the solvent is evaporated by drying. Next, after pre-processing is performed using active oxygen, the wiring or conducting film is formed by firing. In this way, the firing temperature at fabrication can be reduced, by performing the pre-processing prior to firing using active oxygen. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了降低形成布线时的烧成温度和导电膜，可以使用如需要烧成的液滴加标法等涂布方法。 解决方案：通过使用诸如液滴喷射法的涂布方法将包含导电材料的纳米颗粒分散在其中的组合物排出; 然后通过干燥蒸发溶剂。 接下来，在使用活性氧进行预处理之后，通过烧结来形成布线或导电膜。 以这种方式，可以通过在使用活性氧进行烧制之前进行预处理来降低制造时的烧制温度。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：KR1020080091140A

公开(公告)日：2008-10-09

申请号：KR1020087016893

申请日：2006-12-19

Applicant: 폼팩터, 인코포레이티드

Inventor： 매티유개탄엘 ,  팡트렐리안트 ,  홉스에릭디

IPC: H01L21/20 ,  H01L21/00

CPC classification number: B81C1/0046 ,  B33Y10/00 ,  B81B2201/014 ,  B81B2203/0118 ,  B81C2201/0184 ,  B81C2201/0197 ,  C23C18/1608 ,  C23C18/1844 ,  C25D1/003 ,  C25D1/12 ,  C25D5/02 ,  G01R1/06755 ,  G01R3/00 ,  H01L21/288 ,  H01L21/76873 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1461 ,  H05K3/1275 ,  H01L2224/13099 ,  H01L2924/00

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract translation: 公开了用于在三维阵列中沉积多个液滴的系统和方法。 阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。 可以将结构材料电沉积到种子层上以产生三维结构。

公开(公告)号：US12091314B2

公开(公告)日：2024-09-17

申请号：US16061310

申请日：2016-10-11

Applicant: CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA—RECHERCHE ET DÉVELOPPEMENT

Inventor： Sébastien Lani ,  Raphaël Pugin

IPC: B81C1/00 ,  B22F7/08 ,  B22F10/10 ,  B22F10/28 ,  B22F10/64 ,  B33Y10/00 ,  B33Y80/00 ,  C22C1/04 ,  C22C33/02 ,  G04B13/02 ,  G04B15/14 ,  G04B17/06 ,  G04B37/22 ,  G04B45/00 ,  G04D7/12 ,  B22F10/39

CPC classification number: B81C1/00373 ,  B22F7/08 ,  B22F10/10 ,  B22F10/28 ,  B33Y10/00 ,  B33Y80/00 ,  C22C1/0416 ,  C22C1/0425 ,  C22C1/0433 ,  C22C1/0458 ,  C22C1/0466 ,  C22C33/02 ,  G04B13/02 ,  G04B15/14 ,  G04B17/063 ,  G04B37/22 ,  G04B45/00 ,  G04D7/1257 ,  B22F10/39 ,  B22F10/64 ,  B22F2202/11 ,  B22F2301/052 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2301/205 ,  B22F2301/255 ,  B22F2301/35 ,  B22F2302/256 ,  B22F2998/10 ,  B81B2201/035 ,  B81C2201/0184 ,  Y02P10/25

Abstract: The present invention relates to a method for producing a timepiece comprising at least one first part produced by a microfabrication or microforming method in at least one first material, said method comprising at least: a step of depositing, on said first part, without moulding, at least one second part of said timepiece in at least one second material, and a step of treating the second material in order to connect together the components on the first part.

公开(公告)号：US09594056B2

公开(公告)日：2017-03-14

申请号：US14192737

申请日：2014-02-27

Applicant: THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO

Inventor： Ryan Fobel ,  Andrea Kirby ,  Aaron Wheeler

IPC: G01N27/447 ,  B81C1/00

CPC classification number: G01N27/44791 ,  B01L3/5023 ,  B01L3/502784 ,  B01L3/502792 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2300/0867 ,  B01L2300/126 ,  B01L2400/0427 ,  B01L2400/043 ,  B41J2/01 ,  B41M5/0023 ,  B41M5/0047 ,  B41M5/0058 ,  B41M5/0064 ,  B41M5/007 ,  B81B2201/058 ,  B81C1/00095 ,  B81C1/00166 ,  B81C2201/0184 ,  B81C2201/0185 ,  G01N27/44743

Abstract: Embodiments of the present disclosure digital microfluidic arrays that may be fabricated by a printing method, whereby digital microfluidic electrodes arrays are printed, via a printing method such as inkjet printing, onto a suitable substrate. In some embodiments, a substrate and/or ink is prepared or modified to support the printing of electrode arrays, such as via changes to the surface energy. In some embodiments, porous and/or fibrous substrates are prepared by the addition of a barrier layer, or, for example, by the addition or infiltration of a suitable material to render the surface capable of supporting printed electrodes. Various example embodiments involving hybrid devices formed by the printing of digital microfluidic arrays onto a substrate having a hydrophilic layer are disclosed.

Abstract translation: 本公开的数字微流体阵列的实施例可以通过印刷方法制造，其中数字微流体电极阵列通过诸如喷墨印刷的印刷方法印刷到合适的基底上。 在一些实施例中，制备或修改基底和/或墨以支持电极阵列的印刷，例如通过对表面能的改变。 在一些实施方案中，通过添加阻挡层或例如通过添加或渗透合适的材料以使表面能够支撑印刷电极来制备多孔和/或纤维基材。 公开了涉及通过将数字微流体阵列印刷到具有亲水层的基底上形成的混合装置的各种示例实施例。

公开(公告)号：US09493022B2

公开(公告)日：2016-11-15

申请号：US13389113

申请日：2010-08-05

Applicant: Christine P. Tan ,  David M. Lin ,  Harold G. Craighead

Inventor： Christine P. Tan ,  David M. Lin ,  Harold G. Craighead

IPC: B41M3/00 ,  B81C1/00

CPC classification number: B41M3/006 ,  B81C1/00031 ,  B81C2201/0184 ,  B81C2201/0187

Abstract: An apparatus for forming an array of deposits on a substrate is disclosed. The apparatus may include a stencil capable of releasable attached to the substrate and having an array of openings and at least one alignment mark. The apparatus may further include a high throughput deposition printer aligned with the stencil to form an array of deposits on the substrate. The array of deposits may be aligned with the array of openings through the at least one alignment mark and an optional alignment device. Methods of manufacturing the stencil and using it to generate multiplexed or combinatorial arrays are also disclosed.

Abstract translation: 公开了一种用于在衬底上形成沉积物阵列的装置。 该装置可以包括能够可释放地附接到基底并具有开口阵列和至少一个对准标记的模版。 该装置还可以包括与模板对准的高通量沉积打印机，以在衬底上形成沉积物阵列。 沉积物阵列可以与通过至少一个对准标记的开口阵列和可选的对准装置对齐。 还公开了制造模板并将其用于生成多路复用或组合阵列的方法。

公开(公告)号：US20150107998A1

公开(公告)日：2015-04-23

申请号：US14192737

申请日：2014-02-27

Applicant: THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO

Inventor： Ryan FOBEL ,  Andrea KIRBY ,  Aaron WHEELER

IPC: G01N27/447 ,  B81C1/00

CPC classification number: G01N27/44791 ,  B01L3/5023 ,  B01L3/502784 ,  B01L3/502792 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2300/0867 ,  B01L2300/126 ,  B01L2400/0427 ,  B01L2400/043 ,  B41J2/01 ,  B41M5/0023 ,  B41M5/0047 ,  B41M5/0058 ,  B41M5/0064 ,  B41M5/007 ,  B81B2201/058 ,  B81C1/00095 ,  B81C1/00166 ,  B81C2201/0184 ,  B81C2201/0185 ,  G01N27/44743

Abstract: Embodiments of the present disclosure digital microfluidic arrays that may be fabricated by a printing method, whereby digital microfluidic electrodes arrays are printed, via a printing method such as inkjet printing, onto a suitable substrate. In some embodiments, a substrate and/or ink is prepared or modified to support the printing of electrode arrays, such as via changes to the surface energy. In some embodiments, porous and/or fibrous substrates are prepared by the addition of a barrier layer, or, for example, by the addition or infiltration of a suitable material to render the surface capable of supporting printed electrodes. Various example embodiments involving hybrid devices formed by the printing of digital microfluidic arrays onto a substrate having a hydrophilic layer are disclosed.

Abstract translation: 本公开的数字微流体阵列的实施例可以通过印刷方法制造，其中数字微流体电极阵列通过诸如喷墨印刷的印刷方法印刷到合适的基底上。 在一些实施例中，制备或修改基底和/或墨以支持电极阵列的印刷，例如通过对表面能的改变。 在一些实施方案中，通过添加阻挡层或例如通过添加或渗透合适的材料以使表面能够支撑印刷电极来制备多孔和/或纤维基材。 公开了涉及通过将数字微流体阵列印刷到具有亲水层的基底上形成的混合装置的各种示例实施例。

公开(公告)号：US20140034465A1

公开(公告)日：2014-02-06

申请号：US13961279

申请日：2013-08-07

Applicant: OMRON Corporation

Inventor： Takahiro Masuda ,  Naoki Yoshitake ,  Kenichi Hinuma ,  Junya Yamamoto ,  Takashi Fujisawa ,  Takeshi Fujiwara

IPC: H01H1/06

CPC classification number: H01H1/06 ,  B81B2201/014 ,  B81C1/00166 ,  B81C2201/0177 ,  B81C2201/0181 ,  B81C2201/0184 ,  H01H1/0036 ,  H01H2001/0052 ,  Y10T29/49105

Abstract: A switch and a relay include a contact with a smooth contacting surface. A side surface of a fixed contact faces a side surface of a movable contact. The fixed contact has an insulating layer and a base layer stacked on a fixed contact substrate, and a first conductive layer formed thereon through electrolytic plating. The side surface of the first conductive layer that faces the movable contact becomes the fixed contact (contacting surface). The movable contact has an insulating layer and a base layer stacked on the movable contact substrate, and a movable contact formed thereon through electrolytic plating. A side surface of a second conductive layer that faces the fixed contact becomes the movable contact (contacting surface). The fixed contact and the movable contact have surfaces that contact the side surfaces of the mold portion when growing the first and second conductive layers through electrolytic plating.

Abstract translation: 开关和继电器包括具有光滑接触表面的触点。 固定触点的侧表面面对活动触点的侧表面。 固定触点具有层叠在固定接触基板上的绝缘层和基层，以及通过电解电镀形成在其上的第一导电层。 第一导电层的面对可动触点的侧表面成为固定触点（接触面）。 可动触头具有堆叠在可动触点基板上的绝缘层和基极层，以及通过电解电镀形成的可动触点。 面对固定触点的第二导电层的侧表面成为可动触头（接触面）。 固定触点和可动触点具有通过电解电镀生长第一和第二导电层时与模具部分的侧表面接触的表面。