公开(公告)号：US20100231816A1

公开(公告)日：2010-09-16

申请号：US12716945

申请日：2010-03-03

Applicant: Susumu Mikajiri

Inventor： Susumu Mikajiri

IPC: G02F1/13

CPC classification number: B41J2/473 ,  G02B26/124 ,  G02B26/127 ,  G02F1/1313 ,  H04N1/032 ,  H04N1/1135 ,  H04N2201/0241 ,  H04N2201/02412 ,  H04N2201/02414 ,  H04N2201/02425 ,  H04N2201/02427 ,  H04N2201/02449 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02485

Abstract: An optical scanning device includes a light source, an optical system, and a housing. The light source projects a light beam. The housing includes a holder and encloses the optical system. The optical system includes a liquid crystal element held by the housing via the holder, to modulate a phase of the light beam projected from the light source against a scanned surface. The liquid crystal element includes a plurality of substantially transparent substrates, a liquid crystal layer, and a sealing member. One of the plurality of the transparent substrates has a size larger than any other transparent substrates and is positioned in the holder. The liquid crystal layer is sandwiched between the plurality of substantially transparent substrates. The sealing member seals the liquid crystal layer between the plurality of substantially transparent substrates.

Abstract translation: 光学扫描装置包括光源，光学系统和壳体。 光源投射光束。 壳体包括一个固定器并且包围光学系统。 光学系统包括通过保持器由壳体保持的液晶元件，以调制从光源投影的光束相对于扫描表面的相位。 液晶元件包括多个基本上透明的基板，液晶层和密封元件。 多个透明基板中的一个具有比任何其它透明基板大的尺寸并且位于保持器中。 液晶层夹在多个基本上透明的基板之间。 密封构件将液晶层密封在多个基本上透明的基板之间。

公开(公告)号：US07385169B2

公开(公告)日：2008-06-10

申请号：US11516888

申请日：2006-09-07

Applicant: Tomihisa Saitou ,  Harunobu Yoshida ,  Masahide Wakisaka ,  Masaki Kitaoka

Inventor： Tomihisa Saitou ,  Harunobu Yoshida ,  Masahide Wakisaka ,  Masaki Kitaoka

IPC: H01L27/00

CPC classification number: H04N1/0318 ,  H04N2201/02412 ,  H04N2201/02429 ,  H04N2201/02441 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02483 ,  H04N2201/03112 ,  H04N2201/03141 ,  H04N2201/03145

Abstract: A contact image sensor is provided including a housing, a slit plate a lens, one or two light sources and a light-receiving element array mounted on a light-receiving element array substrate. The housing contains the slit plate, the lens, the one or two light sources and the light-receiving element array substrate. The optical system of the contact image sensor is aligned and one or more depressions are formed on an end of the substrate for the alignment. Power to the one or two light sources is applied through one or more leads. Each of the one or more depressions is large enough so that each of the leads can be passed through the respective depressions.

Abstract translation: 提供一种接触图像传感器，包括壳体，狭缝板，透镜，一个或两个光源和安装在光接收元件阵列基板上的光接收元件阵列。 壳体包含狭缝板，透镜，一个或两个光源和光接收元件阵列基板。 接触图像传感器的光学系统对准，并且在用于对准的基板的端部上形成一个或多个凹陷。 对一个或两个光源的电力通过一个或多个引线施加。 一个或多个凹陷中的每一个都足够大，使得每个引线可以通过相应的凹陷。

公开(公告)号：US20070228266A1

公开(公告)日：2007-10-04

申请号：US11761063

申请日：2007-06-11

Applicant: Ken-ichi TOMITA ,  Masaki Sato ,  Akihiro Fukutomi

Inventor： Ken-ichi TOMITA ,  Masaki Sato ,  Akihiro Fukutomi

IPC: H01J40/14 ,  H01J3/14

CPC classification number: G02B26/124 ,  B41J2/471 ,  G02B5/045 ,  H04N1/1135 ,  H04N1/12 ,  H04N2201/0082 ,  H04N2201/02458 ,  H04N2201/02462 ,  H04N2201/0247 ,  H04N2201/02474 ,  H04N2201/02481

Abstract: An optical scanning apparatus constructed to dispose optical elements guiding light beams to a deflector such as a rotary polygon mirror at a low cost with high accuracy, includes a first light source, a second light source, a deflector, a first optical member provided on a first optical path between the first light source and the deflector, a second optical member provided on a second optical path between the second light source and the deflector, and one wall holding both of a side surface of the first optical member and a side surface of the second optical member.

Abstract translation: 一种光学扫描装置，其被构造成以高精度配置以低成本将光束引导到诸如旋转多面镜的偏转器的光学元件，包括第一光源，第二光源，偏转器，设置在第一光源上的第一光学构件 第一光源和偏转器之间的第一光路，设置在第二光源和偏转器之间的第二光路上的第二光学构件和保持第一光学构件的侧表面和第一光学构件的侧表面的一个壁 第二光学构件。

公开(公告)号：US06870275B2

公开(公告)日：2005-03-22

申请号：US10393973

申请日：2003-03-24

Applicant: Mitsuru Nakajima

Inventor： Mitsuru Nakajima

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/31 ,  H01L23/367 ,  H04N1/00 ,  H04N1/028 ,  H04N1/03 ,  H04N5/335 ,  H04N5/369 ,  H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/315 ,  H01L23/367 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H04N1/00885 ,  H04N1/00907 ,  H04N1/00989 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02487 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.

Abstract translation: 半导体器件包括具有功能表面的半导体芯片，在形成于基板和功能表面之间的空间处与半导体芯片的功能表面相对的基板，与半导体的功能表面的一部分电连接的供电装置 并且与半导体芯片之间形成的空间之外形成的密封部件，该密封部件密封形成在半导体芯片的基板和功能面之间的空间， 基板和通过固定构件彼此固定的除了形成在供电装置和基板之间的间隙之外的半导体芯片的功能表面。 密封构件比固定构件具有更大的弹性。

公开(公告)号：US20040016982A1

公开(公告)日：2004-01-29

申请号：US10393973

申请日：2003-03-24

Inventor： Mitsuru Nakajima

IPC: H01L031/0203 ,  H01L023/495

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/315 ,  H01L23/367 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H04N1/00885 ,  H04N1/00907 ,  H04N1/00989 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02487 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.

Abstract translation: 半导体器件包括具有功能表面的半导体芯片，在形成于基板和功能表面之间的空间处与半导体芯片的功能表面相对的基板，与半导体的功能表面的一部分电连接的供电装置 并且与半导体芯片之间形成的空间之外形成的密封部件，该密封部件密封形成在半导体芯片的基板和功能面之间的空间， 基板和通过固定构件彼此固定的除了形成在供电装置和基板之间的间隙之外的半导体芯片的功能表面。 密封构件比固定构件具有更大的弹性。

公开(公告)号：US06350980B1

公开(公告)日：2002-02-26

申请号：US09385123

申请日：1999-08-27

Applicant: David D. Bohn

Inventor： David D. Bohn

IPC: G01N2186

CPC classification number: H04N1/0312 ,  H04N1/0311 ,  H04N1/0314 ,  H04N1/107 ,  H04N2201/02456 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/0471 ,  H04N2201/04713 ,  H04N2201/04734

Abstract: An optical imaging assembly comprises a mounting surface and at least one semiconductor die having a face and an edge portion. The edge portion of the at least one semiconductor die is mounted to the mounting surface. A light sensitive optical detector is located on the face of the at least one semiconductor die. An optical system is mounted to the mounting surface adjacent the at least one semiconductor die.

Abstract translation: 光学成像组件包括安装表面和至少一个具有面和边缘部分的半导体管芯。 至少一个半导体管芯的边缘部分安装到安装表面。 光敏光学检测器位于至少一个半导体管芯的表面上。 光学系统安装到邻近至少一个半导体管芯的安装表面。

公开(公告)号：EP2615815B1

公开(公告)日：2018-08-01

申请号：EP13151160.2

申请日：2013-01-14

Applicant: Canon Finetech Nisca Inc.

Inventor： Sasaki, Takeshi ,  Yokote, Saori

IPC: H04N1/028 ,  H04N1/024

CPC classification number: H04N1/02481 ,  H04N1/0249 ,  H04N1/02855 ,  H04N2201/02458 ,  H04N2201/0247 ,  H04N2201/02483 ,  H04N2201/02485

Abstract: An image reading apparatus configured to read an image of an original, including: a light source configured to irradiate the original with light; an optical system configured to condense and image a light beam from the light source reflected from the original; a substrate member having a photoelectric conversion unit; a fixing member fixed to the substrate member; a support member configured to support the optical system; and an adhesive bonding the fixing member and the support member together, wherein one of the support member and the fixing member has a protruding portion which protrudes toward the other of the support member and the fixing member, the other has a recessed portion opposed to the protruding portion, the protruding portion protrudes in the recessed portion in a non-contact state to maintain a gap between the protruding portion and the recessed portion, and the adhesive is applied to the gap.

公开(公告)号：EP1164800A3

公开(公告)日：2004-08-25

申请号：EP01660111.4

申请日：2001-06-12

Applicant: Oy Ekspansio Engineering Limited

Inventor： Paavola, Jyri ,  Lindström, Lasse

IPC: H04N9/097 ,  H04N5/225

CPC classification number: H04N1/00978 ,  H04N1/03 ,  H04N5/2253 ,  H04N9/097 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02485 ,  H04N2201/02497

Abstract: The invention relates to a joining construction for mounting the CCD cells of a color line camera on a color splitting prism (30) attached to a prism housing (2). Each CCD cell (6, 7, 8) is attached, by a first glue joint (13), to its fastening element (9), the length (L2) whereof is essentially larger than the length (L1) of the CCD cell, and which fastening element (9) extends from the housing margin (12a) located on one side of said exit surface (20a, 20b, 20c) of the color splitting prism to the other housing margin (12b) located on the opposite side thereof. Each fastening element (9) is attached to said margins by third glue joints (11).

Abstract translation: 本发明涉及一种用于将彩色线相机的CCD单元安装在安装在棱镜壳体（2）上的分色棱镜（30）上的接合结构。 每个CCD单元（6,7,8）通过第一胶接头（13）附接到其紧固元件（9），其长度（L2）基本上大于CCD单元的长度（L1） 并且所述紧固元件（9）从位于所述分色棱镜的所述出射表面（20a，20b，20c）的一侧的所述壳体边缘（12a）延伸到位于其相对侧上的另一壳体边缘（12b）。 每个紧固元件（9）通过第三胶接头（11）附接到所述边缘。

公开(公告)号：EP0567179B1

公开(公告)日：1997-01-02

申请号：EP93200892.3

申请日：1993-03-29

Applicant: AGFA-GEVAERT naamloze vennootschap

Inventor： Costrop, Dirk, c/o Agfa-Gevaert N.V. ,  Trouillard, Frank, c/o Agfa-Gevaert N.V. ,  Pandelaers, Patrick, c/o Agfa-Gevaert N.V.

IPC: H04N1/028 ,  H04N1/04

CPC classification number: H04N1/0303 ,  H04N1/03 ,  H04N1/1934 ,  H04N1/1935 ,  H04N1/1937 ,  H04N5/2253 ,  H04N2201/02456 ,  H04N2201/0246 ,  H04N2201/0247 ,  H04N2201/02479 ,  H04N2201/02485

Abstract: An imaging system with optically butted CCD sensors (26, 27a, 27b), and means for determining the spacial position of such sensors comprising a beam splitter (33) with mounting surfaces (46, 47) for the different sensors, and mounting members (62, 64, 69. 70, 71, 72) with a base surface and a supporting surface extending truly rectangularly thereon, the base surfaces being adhesively bonded to the mounting surfaces of said beam splitter and the supporting surfaces being adhesively bonded to lateral surfaces of the corresponding linear sensors.

公开(公告)号：EP0567179A1

公开(公告)日：1993-10-27

申请号：EP93200892.3

申请日：1993-03-29

Applicant: AGFA-GEVAERT naamloze vennootschap

Inventor： Costrop, Dirk, c/o Agfa-Gevaert N.V. ,  Trouillard, Frank, c/o Agfa-Gevaert N.V. ,  Pandelaers, Patrick, c/o Agfa-Gevaert N.V.

IPC: H04N1/028 ,  H04N1/04

CPC classification number: H04N1/0303 ,  H04N1/03 ,  H04N1/1934 ,  H04N1/1935 ,  H04N1/1937 ,  H04N5/2253 ,  H04N2201/02456 ,  H04N2201/0246 ,  H04N2201/0247 ,  H04N2201/02479 ,  H04N2201/02485

Abstract: An imaging system with optically butted CCD sensors (26, 27a, 27b), and means for determining the spacial position of such sensors comprising a beam splitter (33) with mounting surfaces (46, 47) for the different sensors, and mounting members (62, 64, 69. 70, 71, 72) with a base surface and a supporting surface extending truly rectangularly thereon, the base surfaces being adhesively bonded to the mounting surfaces of said beam splitter and the supporting surfaces being adhesively bonded to lateral surfaces of the corresponding linear sensors.

Abstract translation: 具有光学对接CCD传感器（26,27a，27b）的成像系统和用于确定这种传感器的空间位置的装置，包括分束器（33），其具有用于不同传感器的安装表面（46,47）和安装构件 62,64,69,70,71,72），其基面和支撑表面真正地在其上方延伸，所述基面粘接到所述分束器的安装表面上，并且所述支撑表面粘附到 相应的线性传感器。