公开(公告)号：US20090168330A1

公开(公告)日：2009-07-02

申请号：US12118758

申请日：2008-05-12

Applicant: YANG LI ,  YU-HSU LIN ,  JENG-DA WU ,  LEI GUO ,  LIANG-LIANG CAO

Inventor： YANG LI ,  YU-HSU LIN ,  JENG-DA WU ,  LEI GUO ,  LIANG-LIANG CAO

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device includes an enclosure (30), a circuit board (40), and an airflow guiding duct (10). The enclosure includes a bottom wall (31) and a rear wall (32) perpendicular to the bottom wall. The circuit board is mounted on the bottom wall of the enclosure. The circuit board includes a first heat generating element (41) and a second heat generating element (42) near to the first heat generating element. The airflow guiding duct includes two side panels (11) and a connecting panel (13) connecting a pair of side edges (112) of the two side panels. A first opening (17) is defined by a lower edge (131) of the connecting panel and lower edges (111) of the two side panels and corresponding to the first heat generating element. The lower edges of the two side panels and the lower of the connecting panel are in the same plane. The first opening is a predetermined distance from the circuit board and the airflow guiding duct is capable of allowing air flow from different directions.

Abstract translation: 电子设备包括外壳（30），电路板（40）和气流引导导管（10）。 外壳包括垂直于底壁的底壁（31）和后壁（32）。 电路板安装在外壳的底壁上。 电路板包括靠近第一发热元件的第一发热元件（41）和第二发热元件（42）。 气流引导管道包括两个侧板（11）和连接两个侧板的一对侧边缘（112）的连接板（13）。 第一开口（17）由连接板的下边缘（131）和两个侧板的下边缘（111）限定，并且对应于第一发热元件。 两个侧板的下边缘和连接面板的下边缘在同一平面内。 第一开口距离电路板预定的距离，气流引导管能够允许来自不同方向的空气流动。

公开(公告)号：US07482204B2

公开(公告)日：2009-01-27

申请号：US11962109

申请日：2007-12-21

Applicant: Chin-Li Kao ,  Yi-Shao Lai ,  Jeng-Da Wu ,  Tong-Hong Wang

Inventor： Chin-Li Kao ,  Yi-Shao Lai ,  Jeng-Da Wu ,  Tong-Hong Wang

IPC: H01L21/44

CPC classification number: H01L23/36 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a chip is disposed on the first encapsulant and the chip is electrically connected to the circuit substrate. Finally, a compound is deposited over the first encapsulant and the chip to form a chip package. The chip package is warp resistant and the chip packaging process increases overall production yield.

Abstract translation: 提供了芯片封装工艺。 首先，在散热器上形成空腔。 第一密封剂形成在空腔的底部。 电路基板设置在散热器的上方。 电路基板具有与空腔相对应的开口。 此后，芯片设置在第一密封剂上，并且芯片电连接到电路基板。 最后，化合物沉积在第一密封剂和芯片上以形成芯片封装。 芯片封装具有抗扭性，芯片封装工艺提高了整体生产成本。

公开(公告)号：US20080247149A1

公开(公告)日：2008-10-09

申请号：US12138444

申请日：2008-06-13

Applicant: Jeng-Da Wu

Inventor： Jeng-Da Wu

IPC: H05K7/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A chip package structure including a carrier, a chip, and an underfill layer is disclosed. The carrier has a number of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.

Abstract translation: 公开了一种包括载体，芯片和底部填充层的芯片封装结构。 载体上设置有多个凸块。 该芯片具有活性表面。 芯片通过凸块倒装芯片结合并与载体电连接，使得芯片的有源表面面向载体。 底部填充层在芯片和载体之间设置在载体上，使得在底部填充层和芯片之间保持间隙。

公开(公告)号：US20080096325A1

公开(公告)日：2008-04-24

申请号：US11962109

申请日：2007-12-21

Applicant: Chin-Li Kao ,  Yi-Shao Lai ,  Jeng-Da Wu ,  Tong-Hong Wang

Inventor： Chin-Li Kao ,  Yi-Shao Lai ,  Jeng-Da Wu ,  Tong-Hong Wang

IPC: H01L21/56

CPC classification number: H01L23/36 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a chip is disposed on the first encapsulant and the chip is electrically connected to the circuit substrate. Finally, a compound is deposited over the first encapsulant and the chip to form a chip package. The chip package is warp resistant and the chip packaging process increases overall production yield.

Abstract translation: 提供了芯片封装工艺。 首先，在散热器上形成空腔。 第一密封剂形成在空腔的底部。 电路基板设置在散热器的上方。 电路基板具有与空腔相对应的开口。 此后，芯片设置在第一密封剂上，并且芯片电连接到电路基板。 最后，化合物沉积在第一密封剂和芯片上以形成芯片封装。 芯片封装具有抗扭性，芯片封装工艺提高了整体生产成本。

公开(公告)号：US20080088035A1

公开(公告)日：2008-04-17

申请号：US11309881

申请日：2006-10-17

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H01L23/48

CPC classification number: H01L24/81 ,  H01L2224/13111 ,  H01L2224/8119 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A circuit board assembly includes a circuit board and a semiconductor chip mounted on the board. The semiconductor chip includes a plurality of solder spots arrayed thereon in a matrix pattern. The solder spots except those located at corners of the pattern are jointed to the board via tin balls to form signal transmitting channels for transmitting signals between the board and the chip. Should the circuit board suffer impact, damage to the signal transmitting channels may be effectively minimized or prevented.

Abstract translation: 电路板组件包括安装在电路板上的电路板和半导体芯片。 半导体芯片包括以矩阵图案排列在其上的多个焊点。 除了位于图案拐角处的焊料点通过锡球接合到板上，以形成用于在板和芯片之间传输信号的信号传输通道。 如果电路板受到影响，可以有效地最小化或防止信号传输通道的损坏。

公开(公告)号：US20070128019A1

公开(公告)日：2007-06-07

申请号：US11309422

申请日：2006-08-04

Applicant: CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

Inventor： CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

IPC: F03B3/16

CPC classification number: F04D29/4226 ,  F04D29/668

Abstract: A blower includes a scroll housing and a damping rib. The scroll housing includes a body portion for guiding air, a hopper portion for discharging the air through an outlet, and a recess formed between the body portion and the hopper portion. The damping rib is adjacent to the recess connecting the body portion with the hopper portion to enhance structural integrity of the scroll housing.

Abstract translation: 鼓风机包括涡旋壳体和阻尼肋。 涡旋壳体包括用于引导空气的主体部分，用于通过出口排出空气的料斗部分和形成在主体部分和料斗部分之间的凹部。 阻尼肋与连接主体部分与料斗部分的凹槽相邻，以增强涡旋壳体的结构完整性。

公开(公告)号：US20070076540A1

公开(公告)日：2007-04-05

申请号：US11309126

申请日：2006-06-24

Applicant: CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU ,  CHUN-MING CHEN

Inventor： CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU ,  CHUN-MING CHEN

IPC: G11B7/00

CPC classification number: G11B7/0933

Abstract: In one preferred embodiment, an objective lens actuator includes a base, a suspension apparatus mounted on the base, a holder suspended by the suspension apparatus for holding an objective lens, a voice coil motor (VCM) for driving the holder to vibrate, and a cover. The VCM includes a first yoke, a second yoke and a pair of magnets fixed on the first yoke and the second yoke respectively. The first yoke and the second yoke respectively include a first part and a second part. The cover is made of a material having a magnetic conductivity. The cover connects the first part and the second part of each of the first yoke and the second yoke.

Abstract translation: 在一个优选实施例中，物镜致动器包括基座，安装在基座上的悬挂装置，由悬挂装置悬挂以保持物镜的保持架，用于驱动保持器振动的音圈马达（VCM），以及 盖。 VCM包括分别固定在第一磁轭和第二磁轭上的第一磁轭，第二磁轭和一对磁体。 第一磁轭和第二磁轭分别包括第一部分和第二部分。 该盖由具有磁导率的材料制成。 盖子连接第一磁轭和第二磁轭中的每一个的第一部分和第二部分。

公开(公告)号：US20050236704A1

公开(公告)日：2005-10-27

申请号：US10908075

申请日：2005-04-27

Applicant: Jeng-Da Wu

Inventor： Jeng-Da Wu

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/02 ,  H01L23/498

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A chip package structure comprising a carrier, a chip and an underfill layer is disclosed. The carrier has a plurality of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.

Abstract translation: 公开了一种包括载体，芯片和底部填充层的芯片封装结构。 载体具有设置在其上的多个凸块。 该芯片具有活性表面。 芯片通过凸块倒装芯片结合并与载体电连接，使得芯片的有源表面面向载体。 底部填充层在芯片和载体之间设置在载体上，使得在底部填充层和芯片之间保持间隙。

公开(公告)号：US20050200014A1

公开(公告)日：2005-09-15

申请号：US10905675

申请日：2005-01-17

Applicant: William Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Chih-Huang Chang ,  Jeng-Da Wu ,  Wen-Pin Huang ,  Po-Jen Cheng

Inventor： William Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Chih-Huang Chang ,  Jeng-Da Wu ,  Wen-Pin Huang ,  Po-Jen Cheng

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05666 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13164 ,  H01L2224/78301 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 μm is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

公开(公告)号：US06819002B2

公开(公告)日：2004-11-16

申请号：US10604795

申请日：2003-08-18

Applicant: William Tze-You Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Jeng-Da Wu ,  Chih-Huang Chang ,  Po-Jen Cheng

Inventor： William Tze-You Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Jeng-Da Wu ,  Chih-Huang Chang ,  Po-Jen Cheng

IPC: H01L2348

CPC classification number: H01L24/11 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/01083

Abstract: An under-ball-metallurgy layer between a bonding pad on a chip and a solder bump made with tin-based material is provided. The under-ball-metallurgy layer at least includes an adhesion layer over the bonding pad, a nickel-vanadium layer over the adhesion layer, a wettable layer over the nickel-vanadium layer and a barrier layer over the wettable layer. The barrier layer prevents the penetration of nickel atoms from the nickel-vanadium layer and reacts with tin within the solder bump to form inter-metallic compound. This invention also provides an alternative under-ball-metallurgy layer that at least includes an adhesion layer over the bonding pad, a wettable layer over the adhesion layer and a nickel-vanadium layer over the wettable layer. The nickel within the nickel-vanadium layer may react with tin within the solder bump to form an inter-metallic compound.

Abstract translation: 提供了一种在芯片上的焊盘与由锡基材料制成的焊料凸块之间的球下冶金层。 所述球下冶金层至少包括粘合层上的粘合层，粘附层上的镍钒层，镍 - 钒层上的可润湿层和可湿性层上的阻挡层。 阻挡层防止镍原子从镍钒层渗透，并与焊锡凸块内的锡反应形成金属间化合物。 本发明还提供了替代的球内冶金层，其至少包括粘合层上方的粘合层，粘合层上方的可润湿层和可润湿层上的镍钒层。 镍钒层内的镍可能与焊锡凸块内的锡反应形成金属间化合物。