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    Method for extracting oil-and-fat of woven fabric by supercritical fluid
    1.
    发明专利
    Method for extracting oil-and-fat of woven fabric by supercritical fluid 审中-公开
    通过超临界流体提取织物的油脂的方法

    公开(公告)号：JP2009293176A

    公开(公告)日：2009-12-17

    申请号：JP2008186649

    申请日：2008-07-18

    Applicant: Chih-Huang Cheng ,  Li-Hao Cheng ,  Po-Jen Cheng ,  力豪 鄭 ,  博仁 鄭 ,  志皇 鄭

    Inventor： CHENG PO-JEN ,  CHENG LI-HAO ,  CHENG CHIH-HUANG

    IPC: D06L1/00 ,  B08B7/00

    CPC classification number: D06L1/00 ,  D06L1/02

    Abstract: PROBLEM TO BE SOLVED: To provide a method for extracting oil-and-fat of woven fabric by a supercritical fluid.
    SOLUTION: The method for extracting oil-and-fat of woven fabric by a supercritical fluid comprises a step of placing a woven fabric in an extraction tank 10 having a central pillar body in which an opening 11 for pouring a supercritical fluid is provided, a step of pouring a gas into a storage tank 20, a step of cooling the gas by a cooling apparatus 30, a step of pressing the gas by a pump 40, a step of heating the gas by a heating apparatus 50 to form a supercritical fluid and a step of carrying out oil-and-fat extraction by pouring the supercritical fluid into an extraction tank 10. The method efficiently washes woven fabric, etc., to which oil-and-fat are attached without requiring a detergent or a washing water.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 待解决的问题：提供一种通过超临界流体提取织物的油脂的方法。 解决方案：通过超临界流体提取机织物的油脂的方法包括将织物放置在具有中心柱体的提取罐10中的步骤，在该中央柱体中，用于倾倒超临界流体的开口11为 提供了将气体注入储罐20的步骤，通过冷却装置30冷却气体的步骤，通过泵40按压气体的步骤，通过加热装置50加热气体的步骤以形成 超临界流体和通过将超临界流体倾倒到提取罐10中进行油脂萃取的步骤。该方法有效地洗涤机织织物等，其中连接油脂并不需要洗涤剂或 洗水。 版权所有（C）2010，JPO＆INPIT

    Method for manufacturing a device having a high aspect ratio via
    5.
    发明授权
    Method for manufacturing a device having a high aspect ratio via 有权
    制造具有高纵横比的装置的方法

    公开(公告)号：US07863181B2

    公开(公告)日：2011-01-04

    申请号：US12170138

    申请日：2008-07-09

    Applicant: Hsueh An Yang ,  Po Jen Cheng

    Inventor： Hsueh An Yang ,  Po Jen Cheng

    IPC: H01L21/4763

    CPC classification number: H01L21/0272 ,  H01L21/31144 ,  H01L21/32115 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/051 ,  H01L2224/056 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00014

    Abstract: Method for manufacturing a device having a conductive via includes the following steps. A dielectric material layer including a through hole is formed on a substrate. A seed metallic layer is formed on the dielectric material layer and in the through hole. A metallic layer is formed on the seed metallic layer, and is filled in the through hole. The metallic layer located over the seed metallic layer and outside the through hole is etched by a spin etching process, whereby the metallic layer located in the through hole is formed to a lower portion. An upper portion is formed on the lower portion, and a metallic trace is formed on the seed metallic layer, wherein the upper and lower portions is formed to a conductive via, and the conductive via and the metallic trace expose a part of the seed metallic layer. The exposed seed metallic layer is etched.

    Abstract translation: 具有导电通孔的装置的制造方法包括以下步骤。 在基板上形成包括通孔的电介质材料层。 在电介质材料层和通孔中形成种子金属层。 在种子金属层上形成金属层，并填充在通孔中。 通过旋转蚀刻工艺蚀刻位于种子金属层上方的金属层和通孔外部，由此将位于通孔中的金属层形成为下部。 在下部形成上部，在种子金属层上形成金属线，其中上部和下部形成为导电通孔，并且导电通孔和金属迹线暴露出种子金属的一部分 层。 暴露的种子金属层被蚀刻。

    Three-dimensional package and method of making the same
    6.
    发明授权
    Three-dimensional package and method of making the same 有权
    三维包装及其制作方法

    公开(公告)号：US07642132B2

    公开(公告)日：2010-01-05

    申请号：US11584546

    申请日：2006-10-23

    Applicant: Min-Lung Huang ,  Wei-Chung Wang ,  Po-Jen Cheng ,  Kuo-Chung Yee ,  Ching-Huei Su ,  Jian-Wen Lo ,  Chian-Chi Lin

    Inventor： Min-Lung Huang ,  Wei-Chung Wang ,  Po-Jen Cheng ,  Kuo-Chung Yee ,  Ching-Huei Su ,  Jian-Wen Lo ,  Chian-Chi Lin

    IPC: H01L21/44

    CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2224/05099

    Abstract: The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a semiconductor body; (b) forming at least one blind hole in the semiconductor body; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) patterning the conductive layer; (f) removing a part of the lower surface of the semiconductor body and a part of the isolation layer, so as to expose a part of the conductive layer; (g) forming a solder on the lower end of the conductive layer; (h) stacking a plurality of the semiconductor bodies, and performing a reflow process; and (i) cutting the stacked semiconductor bodies, so as to form a plurality of three-dimensional packages. As such, the lower end of the conductive layer and the solder thereon are “inserted” into the space formed by the conductive layer of the lower semiconductor body, so as to enhance the joining between the conductive layer and the solder, and effectively reduce the overall height of the three-dimensional packages after joining.

    Abstract translation: 本发明涉及三维包装及其制造方法。 该方法包括：（a）提供半导体本体; （b）在半导体本体中形成至少一个盲孔; （c）在盲孔的侧壁上形成隔离层; （d）在隔离层上形成导电层; （e）图案化导电层; （f）去除所述半导体主体的下表面的一部分和所述隔离层的一部分，以暴露所述导电层的一部分; （g）在导电层的下端形成焊料; （h）堆叠多个半导体体，进行回流处理; 和（i）切割堆叠的半导体本体，以便形成多个三维封装。 因此，导电层的下端和其上的焊料被“插入”到由下半导体本体的导电层形成的空间中，以便增强导电层和焊料之间的接合，并且有效地减少 加入后三维包装的整体高度。

    METHOD OF EXTRACTING OIL OF CLOTH VIA SUPERCRITICAL FLUID
    7.
    发明申请
    METHOD OF EXTRACTING OIL OF CLOTH VIA SUPERCRITICAL FLUID 审中-公开
    通过超临界流体萃取油的方法

    公开(公告)号：US20090300849A1

    公开(公告)日：2009-12-10

    申请号：US12430317

    申请日：2009-04-27

    Applicant: Po-Jen Cheng ,  Li-Hao Cheng ,  Chih-Huang Cheng

    Inventor： Po-Jen Cheng ,  Li-Hao Cheng ,  Chih-Huang Cheng

    IPC: B01D11/02 ,  D06L1/02

    CPC classification number: D06L1/00 ,  D06L1/02

    Abstract: The present invention relates to a method of extracting oil of cloth via supercritical fluid, comprises the steps of: a cloth to be extracted is provided in an extracting tank; a gas is filled into a storing tank; a water-cooling machine is provided and served to cool down the temperature of the gas; a pump is provided and served to compress the gas; a water-heating machine is provided and served to raise the temperature of the gas so the gas becomes a supercritical fluid; and the supercritical fluid is inserted into the extracting tank for extracting the oil. By the above mentioned method, the cleanness of the cleanroom wiping cloth can be immediately sensed and obtained, and the gas can be recycled for achieving energy-saving.

    Abstract translation: 本发明涉及一种通过超临界流体提取布料的方法，包括以下步骤：提取罐中提取的布料; 将气体填充到储存罐中; 提供了一台水冷机，用来冷却气体的温度; 提供一个泵并用来压缩气体; 提供了一种水加热机，用于提高气体的温度，使气体成为超临界流体; 并将超临界流体插入提取罐中以提取油。 通过上述方法，可以立即检测和获得洁净室擦拭布的清洁度，并且可以再循环气体以实现节能。

    Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same
    9.
    发明授权
    Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same 有权
    在低介电常数材料中具有高纵横比通孔结构的器件及其制造方法

    公开(公告)号：US07501342B2

    公开(公告)日：2009-03-10

    申请号：US12050601

    申请日：2008-03-18

    Applicant: Wei Chung Wang ,  Po Jen Cheng ,  Hsueh An Yang ,  Pei Chun Chen

    Inventor： Wei Chung Wang ,  Po Jen Cheng ,  Hsueh An Yang ,  Pei Chun Chen

    IPC: H01L21/44

    CPC classification number: H01L23/5226 ,  H01L21/02118 ,  H01L21/312 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L2225/06572 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/19041

    Abstract: A method for manufacturing a device having a via structure includes the following steps. A seed metallic layer is formed on a substrate. A patterned metallic-trace layer is formed on the seed metallic layer. A positive-type photoresist layer is formed on the patterned metallic-trace layer and seed metallic layer. The photoresist layer is patterned for defining a through hole which exposes a part of the patterned metallic-trace layer, wherein the through hole has a high aspect ratio. A metallic material is electroplated in the through hole so as to form a metallic pillar. The photoresist layer is removed. A part of the seed metallic layer is etched, whereby traces of the patterned metallic-trace layer are electrically isolated from each other. A dielectric material layer is formed on the substrate for sealing the patterned metallic-trace layer and a part of the metallic pillar and exposing a top surface of the metallic pillar.

    Abstract translation: 用于制造具有通孔结构的器件的方法包括以下步骤。 种子金属层形成在基片上。 在种子金属层上形成图案化的金属痕迹层。 在图案化的金属痕迹层和种子金属层上形成正型光致抗蚀剂层。 图案化光致抗蚀剂层以限定暴露图案化的金属 - 迹线层的一部分的通孔，其中通孔具有高纵横比。 在通孔中电镀金属材料，形成金属柱。 去除光致抗蚀剂层。 蚀刻种子金属层的一部分，由此图案化的金属迹线层的迹线彼此电隔离。 在基板上形成电介质材料层，用于密封图案化的金属迹线层和金属柱的一部分并暴露金属柱的顶表面。

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