Abstract in simplified Chinese:在一第一导体层上方印刷一层微观三端晶体管,使得该等晶体管之底部电极电接触该第一导体层。一第一介电层上覆于该第一导体层,且该第一介电层上方之一第二导体层接触该等晶体管上之该等底部电极与该等顶部电极之间的中间电极。一第二介电层上覆于该第二导体层,且该第二介电层上方之一第三导体层接触该等顶部电极。设备因此借由该第一导体层、该第二导体层及该第三导体层之一组合而并联电连接。该等设备之单独群组可经互连以形成更复杂的电路。所得电路可为一非常薄的挠性电路。
Abstract in simplified Chinese:在一基板上之一释放层上方形成极薄可挠性LED灯层。该等LED灯层包含:一第一导体层,其上覆于该释放层;一垂直发光二极管(VLED)数组,其被印刷在该第一导体层上方,其中该等VLED具有电接触该第一导体层之一底部电极;及一第二导体层,其上覆于该等VLED且接触该等VLED之一顶部电极。可形成其他层,诸如保护层、反射层及磷光体层。随后,将该等LED灯层从该基板剥离,其中该释放层提供该基板与该等LED灯层之间之一弱黏着性,以允许该等LED灯层与该基板分离而不损坏。该等所得LED灯层系极可挠性,使该等LED灯层能够黏着至包含衣服之可挠性目标表面。
Abstract in simplified Chinese:揭示紫外线可固化导电墨水及黏着介质之组成物、方法及制造物,其可用于介电墨水与导电墨水。代表性紫外线可固化黏着介质组成物包含:双官能脂族聚碳酸酯胺基甲酸酯丙烯酸酯寡聚物;单官能单体,诸如丙烯酸异佛尔酯单体或丙烯酸酯单体;双官能单体,诸如双官能烷氧基化丙烯酸酯或甲基丙烯酸酯单体;第一光引发剂,诸如α-羟基酮类光引发剂;及第二光引发剂,诸如α-胺基酮类光引发剂。黏着介质中可包括多个导电粒子,诸如银粒子及石墨烯粒子,以提供紫外线可固化导电墨水且当固化时提供例如导电层或电线。
Abstract:
On a flexible substrate is printed, LEDs, a battery, a flasher, and an actuator. The actuator may be a photo-switch that causes the battery and flasher to periodically energize the LEDs when a sufficient ambient light impinges on the actuator. The substrate may be an insert in a transparent package containing a product, such as a razor. When the package is in the front of a display in a store, the ambient light causes the LEDs to flash, such as every 10-30 seconds to attract consumers to the product. The substrate may also form part of the outer surface of the package. The flasher may simply flash the LEDs or create a dynamic display by energizing different groups of the LEDs at different times.
Abstract:
In one embodiment, a security label comprises a random arrangement of printed LEDs. During fabrication of the label, the LEDs are energized, and the resulting dot pattern is converted into a unique digital first code and stored in a database. The label is then attached to an object to be later authenticated, or the LEDs are printed directly on the object, such as a passport, license, bank note, certificate, etc. For authenticating the object, the LEDs are energized and the dot pattern is converted into a code. The code is compared to the first code stored in the database. If there is a match, the object is authenticated. The label may also have a printed second code associated with the first code, and both codes must match codes stored in the database for authentication. The general shape of the printed pattern may convey the proper orientation of the pattern.
Abstract:
A thin film vertical light emitting diode (VLED) structure and process are described. Features of the design include the following: bonding multiple smaller diameter LED wafers to a larger diameter carrier wafer, which reduces the per LED fabrication cost; using thin film techniques to metalize the anode and cathode and using respective annealing steps prior to photolithography patterning of LED structures; enabling the thin film process by semi-permanent bonding techniques which provide thermal and chemical stability, while allowing bond release at an opportune time by thermal, optical, or chemical means; using epitaxial substrate removal techniques to separate the entire LED film from its growth substrate; and patterning various vertical LED devices which can emit light from the n-type side (cathode), p-type side (anode), side wall, or a combination of the surfaces by using mirror layers and electrically conductive and optically transmissive layers.
Abstract:
An LED module (10) is disclosed containing an integrated driver transistor (e.g, a MOSFET) (30) in series with an LED (32). In one embodiment, LED layers (42, 44) are grown over a substrate (34). The transistor regions (50, 52, 54)are formed in or over this substrate. After the LED layers (42, 44), such as GaN layers, are grown to form the LED portion (32), a central area of the LED is etched away to expose a semiconductor surface in which the transistor regions are formed. A conductor (58) connects the transistor in series with the LED. Another node of the transistor is electrically coupled to an electrode on the bottom surface of the substrate. In one embodiment, an anode of the LED is connected to one terminal of the module, one current carrying node of the transistor is connected to a second terminal of the module, and the control terminal of the transistor is connected to a third terminal of the module.