自基板移除之極薄經印刷發光二極體層
    64.
    发明专利
    自基板移除之極薄經印刷發光二極體層 审中-公开
    自基板移除之极薄经印刷发光二极管层

    公开(公告)号:TW201448168A

    公开(公告)日:2014-12-16

    申请号:TW103109775

    申请日:2014-03-14

    Abstract: 在一基板上之一釋放層上方形成極薄可撓性LED燈層。該等LED燈層包含:一第一導體層,其上覆於該釋放層;一垂直發光二極體(VLED)陣列,其被印刷在該第一導體層上方,其中該等VLED具有電接觸該第一導體層之一底部電極;及一第二導體層,其上覆於該等VLED且接觸該等VLED之一頂部電極。可形成其他層,諸如保護層、反射層及磷光體層。隨後,將該等LED燈層從該基板剝離,其中該釋放層提供該基板與該等LED燈層之間之一弱黏著性,以允許該等LED燈層與該基板分離而不損壞。該等所得LED燈層係極可撓性,使該等LED燈層能夠黏著至包含衣服之可撓性目標表面。

    Abstract in simplified Chinese: 在一基板上之一释放层上方形成极薄可挠性LED灯层。该等LED灯层包含:一第一导体层,其上覆于该释放层;一垂直发光二极管(VLED)数组,其被印刷在该第一导体层上方,其中该等VLED具有电接触该第一导体层之一底部电极;及一第二导体层,其上覆于该等VLED且接触该等VLED之一顶部电极。可形成其他层,诸如保护层、反射层及磷光体层。随后,将该等LED灯层从该基板剥离,其中该释放层提供该基板与该等LED灯层之间之一弱黏着性,以允许该等LED灯层与该基板分离而不损坏。该等所得LED灯层系极可挠性,使该等LED灯层能够黏着至包含衣服之可挠性目标表面。

    具有共同黏著介質的紫外線可固化導電墨水和介電墨水組成物、其製造物及製造方法
    65.
    发明专利
    具有共同黏著介質的紫外線可固化導電墨水和介電墨水組成物、其製造物及製造方法 审中-公开
    具有共同黏着介质的紫外线可固化导电墨水和介电墨水组成物、其制造物及制造方法

    公开(公告)号:TW201435005A

    公开(公告)日:2014-09-16

    申请号:TW102143208

    申请日:2013-11-27

    CPC classification number: C09D11/52 C09D11/101

    Abstract: 揭示紫外線可固化導電墨水及黏著介質之組成物、方法及製造物,其可用於介電墨水與導電墨水。代表性紫外線可固化黏著介質組成物包含:雙官能脂族聚碳酸酯胺基甲酸酯丙烯酸酯寡聚物;單官能單體,諸如丙烯酸異佛爾酯單體或丙烯酸酯單體;雙官能單體,諸如雙官能烷氧基化丙烯酸酯或甲基丙烯酸酯單體;第一光引發劑,諸如α-羥基酮類光引發劑;及第二光引發劑,諸如α-胺基酮類光引發劑。黏著介質中可包括多個導電粒子,諸如銀粒子及石墨烯粒子,以提供紫外線可固化導電墨水且當固化時提供例如導電層或電線。

    Abstract in simplified Chinese: 揭示紫外线可固化导电墨水及黏着介质之组成物、方法及制造物,其可用于介电墨水与导电墨水。代表性紫外线可固化黏着介质组成物包含:双官能脂族聚碳酸酯胺基甲酸酯丙烯酸酯寡聚物;单官能单体,诸如丙烯酸异佛尔酯单体或丙烯酸酯单体;双官能单体,诸如双官能烷氧基化丙烯酸酯或甲基丙烯酸酯单体;第一光引发剂,诸如α-羟基酮类光引发剂;及第二光引发剂,诸如α-胺基酮类光引发剂。黏着介质中可包括多个导电粒子,诸如银粒子及石墨烯粒子,以提供紫外线可固化导电墨水且当固化时提供例如导电层或电线。

    PRINTED LEDS, BATTERY, AND DRIVER CIRCUIT ON THIN SUBSTRATE FOR PACKAGING
    67.
    发明申请
    PRINTED LEDS, BATTERY, AND DRIVER CIRCUIT ON THIN SUBSTRATE FOR PACKAGING 审中-公开
    印刷LED,电池和驱动电路在薄基板上进行包装

    公开(公告)号:WO2017011688A1

    公开(公告)日:2017-01-19

    申请号:PCT/US2016/042333

    申请日:2016-07-14

    Abstract: On a flexible substrate is printed, LEDs, a battery, a flasher, and an actuator. The actuator may be a photo-switch that causes the battery and flasher to periodically energize the LEDs when a sufficient ambient light impinges on the actuator. The substrate may be an insert in a transparent package containing a product, such as a razor. When the package is in the front of a display in a store, the ambient light causes the LEDs to flash, such as every 10-30 seconds to attract consumers to the product. The substrate may also form part of the outer surface of the package. The flasher may simply flash the LEDs or create a dynamic display by energizing different groups of the LEDs at different times.

    Abstract translation: 在柔性基板上印刷,LED,电池,闪光器和致动器。 致动器可以是光电开关,当足够的环境光照射在致动器上时,该光开关使得电池和闪光器周期性地给LED供电。 衬底可以是包含诸如剃刀的产品的透明包装中的插入物。 当包装在商店中的显示器的前面时,环境光使LED闪烁,例如每10-30秒吸引消费者使用该产品。 衬底也可以形成封装的外表面的一部分。 闪光灯可以简单地闪烁LED或通过在不同时间激励不同组的LED来创建动态显示。

    SECURITY LABEL USING PRINTED LEDS
    68.
    发明申请
    SECURITY LABEL USING PRINTED LEDS 审中-公开
    使用印刷LED的安全标签

    公开(公告)号:WO2016081152A1

    公开(公告)日:2016-05-26

    申请号:PCT/US2015/057170

    申请日:2015-10-23

    CPC classification number: G07D7/2033 G07D7/12

    Abstract: In one embodiment, a security label comprises a random arrangement of printed LEDs. During fabrication of the label, the LEDs are energized, and the resulting dot pattern is converted into a unique digital first code and stored in a database. The label is then attached to an object to be later authenticated, or the LEDs are printed directly on the object, such as a passport, license, bank note, certificate, etc. For authenticating the object, the LEDs are energized and the dot pattern is converted into a code. The code is compared to the first code stored in the database. If there is a match, the object is authenticated. The label may also have a printed second code associated with the first code, and both codes must match codes stored in the database for authentication. The general shape of the printed pattern may convey the proper orientation of the pattern.

    Abstract translation: 在一个实施例中,安全标签包括印刷的LED的随机排列。 在制造标签期间,LED被激励,并且所得到的点图案被转换成唯一的数字第一代码并存储在数据库中。 然后将标签附着到待认证的对象上,或者将LED直接打印在对象上,例如护照,许可证,纸币,证书等。为了认证对象,LED被激活,点图案 被转换成代码。 将代码与存储在数据库中的第一个代码进行比较。 如果有匹配,则对象进行身份验证。 标签还可以具有与第一代码相关联的打印的第二代码,并且两个代码必须匹配存储在数据库中的代码以用于认证。 印刷图案的一般形状可以传达图案的正确取向。

    FORMING THIN FILM VERTICAL LIGHT EMITTING DIODES
    69.
    发明申请
    FORMING THIN FILM VERTICAL LIGHT EMITTING DIODES 审中-公开
    形成薄膜垂直发光二极管

    公开(公告)号:WO2015089079A1

    公开(公告)日:2015-06-18

    申请号:PCT/US2014/069354

    申请日:2014-12-09

    CPC classification number: H01L33/0079 H01L33/0095

    Abstract: A thin film vertical light emitting diode (VLED) structure and process are described. Features of the design include the following: bonding multiple smaller diameter LED wafers to a larger diameter carrier wafer, which reduces the per LED fabrication cost; using thin film techniques to metalize the anode and cathode and using respective annealing steps prior to photolithography patterning of LED structures; enabling the thin film process by semi-permanent bonding techniques which provide thermal and chemical stability, while allowing bond release at an opportune time by thermal, optical, or chemical means; using epitaxial substrate removal techniques to separate the entire LED film from its growth substrate; and patterning various vertical LED devices which can emit light from the n-type side (cathode), p-type side (anode), side wall, or a combination of the surfaces by using mirror layers and electrically conductive and optically transmissive layers.

    Abstract translation: 描述了薄膜垂直发光二极管(VLED)结构和工艺。 该设计的特点包括:将多个较小直径的LED晶片连接到较大直径的载体晶片,从而降低每个LED制造成本; 使用薄膜技术使阳极和阴极金属化,并且在LED结构的光刻图案化之前使用各自的退火步骤; 通过提供热和化学稳定性的半永久粘合技术实现薄膜过程,同时通过热,光学或化学方式在适当的时间允许粘合释放; 使用外延衬底去除技术将整个LED膜与其生长衬底分离; 并且通过使用镜面层和导电和光学透射层来构图可以从n型侧(阴极),p型侧(阳极),侧壁或表面的组合发射光的各种垂直LED器件。

    ACTIVE LED MODULE WITH LED AND TRANSISTOR FORMED ON SAME SUBSTRATE
    70.
    发明申请
    ACTIVE LED MODULE WITH LED AND TRANSISTOR FORMED ON SAME SUBSTRATE 审中-公开
    在相同衬底上形成LED和晶体管的有源LED模块

    公开(公告)号:WO2014151012A3

    公开(公告)日:2014-09-25

    申请号:PCT/US2014/024758

    申请日:2014-03-12

    Abstract: An LED module (10) is disclosed containing an integrated driver transistor (e.g, a MOSFET) (30) in series with an LED (32). In one embodiment, LED layers (42, 44) are grown over a substrate (34). The transistor regions (50, 52, 54)are formed in or over this substrate. After the LED layers (42, 44), such as GaN layers, are grown to form the LED portion (32), a central area of the LED is etched away to expose a semiconductor surface in which the transistor regions are formed. A conductor (58) connects the transistor in series with the LED. Another node of the transistor is electrically coupled to an electrode on the bottom surface of the substrate. In one embodiment, an anode of the LED is connected to one terminal of the module, one current carrying node of the transistor is connected to a second terminal of the module, and the control terminal of the transistor is connected to a third terminal of the module.

    Abstract translation: 公开了包含与LED(32)串联的集成驱动器晶体管(例如,MOSFET)(30)的LED模块(10)。 在一个实施例中,LED层(42,44)生长在衬底(34)上。 晶体管区域(50,52,54)形成在该衬底中或上方。 在诸如GaN层的LED层(42,44)生长以形成LED部分(32)之后,LED的中心区域被蚀刻掉以暴露其中形成晶体管区域的半导体表面。 导体(58)将晶体管与LED串联连接。 晶体管的另一节点电耦合到衬底底表面上的电极。 在一个实施例中,LED的阳极连接到模块的一个端子,晶体管的一个载流节点连接到模块的第二端子,并且晶体管的控制端子连接到模块的第三端子 模块。

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