PRINTED LEDS, BATTERY, AND DRIVER CIRCUIT ON THIN SUBSTRATE FOR PACKAGING
    1.
    发明申请
    PRINTED LEDS, BATTERY, AND DRIVER CIRCUIT ON THIN SUBSTRATE FOR PACKAGING 审中-公开
    印刷LED,电池和驱动电路在薄基板上进行包装

    公开(公告)号:WO2017011688A1

    公开(公告)日:2017-01-19

    申请号:PCT/US2016/042333

    申请日:2016-07-14

    Abstract: On a flexible substrate is printed, LEDs, a battery, a flasher, and an actuator. The actuator may be a photo-switch that causes the battery and flasher to periodically energize the LEDs when a sufficient ambient light impinges on the actuator. The substrate may be an insert in a transparent package containing a product, such as a razor. When the package is in the front of a display in a store, the ambient light causes the LEDs to flash, such as every 10-30 seconds to attract consumers to the product. The substrate may also form part of the outer surface of the package. The flasher may simply flash the LEDs or create a dynamic display by energizing different groups of the LEDs at different times.

    Abstract translation: 在柔性基板上印刷,LED,电池,闪光器和致动器。 致动器可以是光电开关,当足够的环境光照射在致动器上时,该光开关使得电池和闪光器周期性地给LED供电。 衬底可以是包含诸如剃刀的产品的透明包装中的插入物。 当包装在商店中的显示器的前面时,环境光使LED闪烁,例如每10-30秒吸引消费者使用该产品。 衬底也可以形成封装的外表面的一部分。 闪光灯可以简单地闪烁LED或通过在不同时间激励不同组的LED来创建动态显示。

    METHOD TO NEUTRALIZE INCORRECTLY ORIENTED PRINTED DIODES

    公开(公告)号:WO2019067371A1

    公开(公告)日:2019-04-04

    申请号:PCT/US2018/052486

    申请日:2018-09-24

    Abstract: A programmable circuit includes an array of printed groups of microscopic transistors or diodes having pn junctions. The devices are pre-formed and printed as an ink and cured. The devices have a proper orientation and a reverse orientation after settling on a conductor layer. The devices are connected in parallel within small groups. To neutralize the reverse-oriented devices, a sufficient voltage is applied across the parallel-connected diodes to forward bias only the devices having the reverse orientation. This causes a sufficient current to flow through each of the reverse-orientated devices to destroy an electrical interface between an electrode of the devices and the conductor layer to create an open circuit, such that those devices do not affect a rectifying function of the devices in the group having the proper orientation. An interconnection conductor pattern may then interconnect the groups to form complex logic circuits.

    LED AND VERTICAL MOS TRANSISTOR FORMED ON SAME SUBSTRATE

    公开(公告)号:WO2019199603A1

    公开(公告)日:2019-10-17

    申请号:PCT/US2019/026029

    申请日:2019-04-05

    Abstract: An LED module is disclosed containing an integrated MOSFET driver transistor in series with an LED. In one embodiment, GaN-based LED layers are epitaxially grown over an interface layer on a silicon substrate. The MOSFET gate is formed in a trench in the silicon substrate and creates a vertical channel between a top source and a bottom drain when the gate is biased to turn on the LED. A conductor on the die connects the MOSFET in series with the LED. One power electrode is located on a top of the die, another power electrode is located on the bottom of the die, and the gate electrode may be on the top or the side of the die.

    SELF-ALIGNMENT OF OPTICAL STRUCTURES TO RANDOM ARRAY OF PRINTED MICRO-LEDS

    公开(公告)号:WO2019199602A1

    公开(公告)日:2019-10-17

    申请号:PCT/US2019/026023

    申请日:2019-04-05

    Abstract: Printed micro-LEDs have a top metal anode electrode that is relatively tall and narrow and a bottom cathode electrode. After the LED ink is cured, the bottom electrodes are in electrical contact with a conductive layer on a substrate. The locations of the LEDs are random. A thin dielectric layer is then printed between the LEDs, and a thin conductive layer, such as a nano-wire layer, is then printed over the dielectric layer to contact the anode electrodes. The top conductive layer over the tall anode electrodes has bumps corresponding with the locations of the LEDs. An omniphobic liquid is then printed which only resides in the "low" areas of the top conductive layer between the bumps. Any optical material is then uniformly printed over the resulting surface. The printed optical material accumulates only on the bump areas by adhesion and surface tension, so is self-aligned with the individual LEDs.

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