METHOD FOR MANUFACTURING AN ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, SUBSTRATE TO BE USED WITH SUCH A METHOD AND AN ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE OBTAINED WITH THE METHOD
    62.
    发明申请
    METHOD FOR MANUFACTURING AN ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, SUBSTRATE TO BE USED WITH SUCH A METHOD AND AN ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE OBTAINED WITH THE METHOD 审中-公开
    用于制造有机电致发光显示器件的方法,用这种方法使用的衬底和用该方法获得的有机电致发光显示器件

    公开(公告)号:WO2004070840A1

    公开(公告)日:2004-08-19

    申请号:PCT/NL2003/000937

    申请日:2003-12-24

    Abstract: A method for manufacturing an organic electroluminescent display device, wherein an arrangement of layers is applied to a substrate such, that in a first direction, first conductors extend as well as in a second direction, while between the intersections of the conductors an organic electroluminescent connection has been provided which, under the influence of an electric tension, emits light, the substrate being manufactured from plastic and being provided with a surface structure which forms a boundary for at least a number of the layers to be applied. The invention also provides a substrate intended for use in a method according to the invention for manufacturing an organic electroluminescent display device, wherein the substrate has been manufactured from plastic and is provided with a surface structure which forms a boundary for at least a number of the layers to be applied. The invention further provides an organic electroluminescent display device obtained with the method.

    Abstract translation: 一种制造有机电致发光显示装置的方法,其中层的布置被施加到基板,即在第一方向上,第一导体以及第二方向延伸,而在导体的交叉点之间,有机电致发光连接 已经提供了在电张力的影响下发光的衬底,其由塑料制成并且具有形成用于至少多个待施加层的边界的表面结构。 本发明还提供了一种用于根据本发明的用于制造有机电致发光显示装置的方法的衬底,其中衬底已经由塑料制成并且设置有表面结构,该表面结构形成至少多个 要应用的层。 本发明还提供了一种通过该方法获得的有机电致发光显示装置。

    METHOD AND APPARATUS FOR COMPLETELY OR PARTLY COVERING AT LEAST ONE ELECTRONIC COMPONENT WITH A COMPOUND
    63.
    发明申请
    METHOD AND APPARATUS FOR COMPLETELY OR PARTLY COVERING AT LEAST ONE ELECTRONIC COMPONENT WITH A COMPOUND 审中-公开
    用于完整或部分覆盖至少一个电子元件与化合物的方法和装置

    公开(公告)号:WO2004015757A1

    公开(公告)日:2004-02-19

    申请号:PCT/NL2003/000577

    申请日:2003-08-12

    CPC classification number: H01L21/565 H01L2924/0002 H01L2924/00

    Abstract: A method and apparatus for at least partly covering at least one electronic component with compound, the apparatus being provided with a first mold half and a second mold half, the first mold half being moveable relative to the second mold half, while means are provided for placing an electronic component on a mold half for inclusion of this component in a mold cavity defined by the two mold halves, the first mold half being provided with a number of actuators with the aid of which the position of the first mold half relative to the second mold half is continuously and accurately regulable, while the distance between the two mold halves is continuously regulated and, if desired, adjusted during the two mold halves being moved towards each other and during their being held in a position when moved towards each other.

    Abstract translation: 一种用于至少部分地用化合物覆盖至少一个电子部件的方法和装置,所述装置设置有第一半模和第二半模,所述第一半模可相对于所述第二半模移动,而所述装置被设置用于 将电子部件放置在半模上以将该部件包含在由两个半模限定的模具腔中,第一半模设置有多个致动器,借助于此,第一半模的位置相对于 第二半模可持续且准确地调节,而两个半模之间的距离是连续调节的,并且如果需要的话,在两个半模之间被相互移动并且当它们被保持在朝向彼此移动的位置时被调节。

    METHOD FOR MANUFACTURING A POLYMER OLED
    64.
    发明申请
    METHOD FOR MANUFACTURING A POLYMER OLED 审中-公开
    制造聚合物OLED的方法

    公开(公告)号:WO2003098716A1

    公开(公告)日:2003-11-27

    申请号:PCT/NL2003/000371

    申请日:2003-05-20

    CPC classification number: H01L51/0002 H01L51/5253 H01L51/5259

    Abstract: A method for manufacturing a polymer OLED, wherein after the application of a number of active layers onto a substrate to form the OLED, these active layers are encapsulated with at least one sealing, wherein prior to the application of the sealing, the OLED is heated for some time, as a result of which volatile substances present in the active layers evaporate from the OLED, and subsequently the respective sealing is applied. Optionally independently of the heating of the OLED prior to the application of the sealing, the sealing can be formed by at least a UV-setting resist layer which is applied with one of the following techniques: printing, such as inkjet printing, screen printing, tampon printing, offset printing and the like, or a mechanical coating technique, such as spray coating, curtain coating, spin coating and the like.

    Abstract translation: 一种制造聚合物OLED的方法,其中在将多个活性层施加到基底上以形成OLED之后,这些活性层用至少一个密封剂包封,其中在施加密封之前,将OLED加热 存在一段时间后,活性层中存在的挥发性物质从OLED中蒸发,随后施加相应的密封。 任选地,与施加密封之前的OLED的加热无关,可以通过至少一个UV成型抗蚀剂层形成密封,该抗UV层被施加以下技术之一:诸如喷墨印刷,丝网印刷, 棉塞印刷,胶版印刷等,或喷涂,幕涂,旋涂等机械涂布技术。

    SPUTTER CATHODE WITH MAGNETIC SHUNT
    65.
    发明申请

    公开(公告)号:WO2002041356A3

    公开(公告)日:2002-05-23

    申请号:PCT/NL2001/000821

    申请日:2001-11-13

    Abstract: Sputter cathode (1) with a target (8) around an axis and a number of permanent magnets provided around the axis. The permanent magnets produce a tunnel shaped radially oriented magnetic field in the vicinity of the surface of the target to be sputtered. Further an electromagnet (24) with a yoke and first and second poles produces an axially oriented magnetic field along the axis. The first pole is located nearer to the axis than the electromagnet and the second pole is located further of the axis than the electromagnet. A magnetic shunt (25) is provided in the axial direction between the electromagnet and the target and in the radial direction between the axis and the second pole.

    System and method for treating substrates
    66.
    发明公开
    System and method for treating substrates 审中-公开
    系统与Verfahren zur Behandlung von Substraten

    公开(公告)号:EP1964941A3

    公开(公告)日:2008-11-19

    申请号:EP08158671.1

    申请日:2004-08-26

    Applicant: OTB Group B.V.

    CPC classification number: C23C14/042 C23C14/568

    Abstract: A system for treating substrates, provided with at least one processing chamber (1) to treat at least one substrate (5) with a vacuum process, wherein said processing chamber (1) is provided with a substrate access (13) closable by a closing body (15), wherein the system is provided with a conveying device (8) which is at least arranged to move said closing body (15), wherein said conveying device (8) is arranged to convey a mask (4), intended to at least partly cover said substrate (5) during said vacuum process, at least between a position outside the processing chamber (1) and a position inside the processing chamber (1).
    It is advantageous when at least said substrate holder (2) is provided with positioning means (50) to position the substrate holder (2) and the mask (4) relative to each other. The invention further provides a use of such a system.

    Abstract translation: 一种用于处理基板的系统,设置有至少一个处理室(1),以用真空处理来处理至少一个基板(5),其中所述处理室(1)设置有可通过闭合关闭的基板通路(13) 主体(15),其中所述系统设置有至少布置成移动所述关闭体(15)的输送装置(8),其中所述输送装置(8)布置成输送面罩(4),所述面罩 至少在所述真空处理期间至少部分地覆盖所述基板(5),至少在所述处理室(1)外部的位置与所述处理室(1)内的位置之间。 当至少所述衬底保持器(2)设置有相对于彼此定位衬底保持器(2)和掩模(4)的定位装置(50)时,这是有利的。 本发明进一步提供了这种系统的用途。

    METHOD AND AN APPARATUS FOR APPLYING A COATING ON A SUBSTRATE
    68.
    发明公开
    METHOD AND AN APPARATUS FOR APPLYING A COATING ON A SUBSTRATE 有权
    方法和设备用于将涂料涂布在基材

    公开(公告)号:EP1664377A1

    公开(公告)日:2006-06-07

    申请号:EP04774873.6

    申请日:2004-08-12

    Applicant: OTB Group B.V.

    CPC classification number: C23C16/52 C23C4/12 C23C4/134 C23C16/513

    Abstract: A method and apparatus for applying a coating on a substrate, wherein, opposite the substrate, at least two expanding thermal plasma (ETP) sources are arranged which provide the substrate with a coating, wherein the substrate is located in a process room in which the pressure is lower than the pressure, prevailing in the ETP sources, of a carrier gas which is introduced into the process room via the sources and which forms the expanding plasma, wherein the coating provided by each source has a layer thickness according to a certain deposition profile, for instance a Gaussian deposition profile, and wherein different process parameters are chosen such that, after the coating process, the addition of the deposition profiles results in a substantially uniform layer thickness of the coating on a relevant part of the substrate. Preferably, the distance between sources producing plasma at the same time is chosen and/or settable such that the expanding plasmas substantially do not influence each other.

    METHOD AND APPARATUS FOR COMPLETELY OR PARTLY COVERING AT LEAST ONE ELECTRONIC COMPONENT WITH A COMPOUND
    70.
    发明公开
    METHOD AND APPARATUS FOR COMPLETELY OR PARTLY COVERING AT LEAST ONE ELECTRONIC COMPONENT WITH A COMPOUND 审中-公开
    方法和设备的全部或部分覆盖电子排布与复合地基

    公开(公告)号:EP1532673A1

    公开(公告)日:2005-05-25

    申请号:EP03784699.5

    申请日:2003-08-12

    CPC classification number: H01L21/565 H01L2924/0002 H01L2924/00

    Abstract: A method and apparatus for at least partly covering at least one electronic component with compound, the apparatus being provided with a first mold half and a second mold half, the first mold half being moveable relative to the second mold half, while means are provided for placing an electronic component on a mold half for inclusion of this component in a mold cavity defined by the two mold halves, the first mold half being provided with a number of actuators with the aid of which the position of the first mold half relative to the second mold half is continuously and accurately regulable, while the distance between the two mold halves is continuously regulated and, if desired, adjusted during the two mold halves being moved towards each other and during their being held in a position when moved towards each other.

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