Abstract:
A method for applying a thin film barrier stack to a device with microstructures, such as, for instance, an OLED, wherein the thin film barrier stack forms a barrier to at least moisture and oxygen, wherein the stack is built up from a combination of organic and inorganic layers, characterized in that a first organic intermediate layer is applied, wherein the organic intermediate layer is applied in liquid form, wherein the viscosity of the organic intermediate layer liquid is so low that grooves, hollows and like narrow cavities are at least partly filled up with the organic liquid under the influence of capillary forces while other parts of the device are only covered with a thin layer of the organic liquid, such that a layer of variable thickness is formed.
Abstract:
A method for manufacturing an organic electroluminescent display device, wherein an arrangement of layers is applied to a substrate such, that in a first direction, first conductors extend as well as in a second direction, while between the intersections of the conductors an organic electroluminescent connection has been provided which, under the influence of an electric tension, emits light, the substrate being manufactured from plastic and being provided with a surface structure which forms a boundary for at least a number of the layers to be applied. The invention also provides a substrate intended for use in a method according to the invention for manufacturing an organic electroluminescent display device, wherein the substrate has been manufactured from plastic and is provided with a surface structure which forms a boundary for at least a number of the layers to be applied. The invention further provides an organic electroluminescent display device obtained with the method.
Abstract:
A method and apparatus for at least partly covering at least one electronic component with compound, the apparatus being provided with a first mold half and a second mold half, the first mold half being moveable relative to the second mold half, while means are provided for placing an electronic component on a mold half for inclusion of this component in a mold cavity defined by the two mold halves, the first mold half being provided with a number of actuators with the aid of which the position of the first mold half relative to the second mold half is continuously and accurately regulable, while the distance between the two mold halves is continuously regulated and, if desired, adjusted during the two mold halves being moved towards each other and during their being held in a position when moved towards each other.
Abstract:
A method for manufacturing a polymer OLED, wherein after the application of a number of active layers onto a substrate to form the OLED, these active layers are encapsulated with at least one sealing, wherein prior to the application of the sealing, the OLED is heated for some time, as a result of which volatile substances present in the active layers evaporate from the OLED, and subsequently the respective sealing is applied. Optionally independently of the heating of the OLED prior to the application of the sealing, the sealing can be formed by at least a UV-setting resist layer which is applied with one of the following techniques: printing, such as inkjet printing, screen printing, tampon printing, offset printing and the like, or a mechanical coating technique, such as spray coating, curtain coating, spin coating and the like.
Abstract:
Sputter cathode (1) with a target (8) around an axis and a number of permanent magnets provided around the axis. The permanent magnets produce a tunnel shaped radially oriented magnetic field in the vicinity of the surface of the target to be sputtered. Further an electromagnet (24) with a yoke and first and second poles produces an axially oriented magnetic field along the axis. The first pole is located nearer to the axis than the electromagnet and the second pole is located further of the axis than the electromagnet. A magnetic shunt (25) is provided in the axial direction between the electromagnet and the target and in the radial direction between the axis and the second pole.
Abstract:
A system for treating substrates, provided with at least one processing chamber (1) to treat at least one substrate (5) with a vacuum process, wherein said processing chamber (1) is provided with a substrate access (13) closable by a closing body (15), wherein the system is provided with a conveying device (8) which is at least arranged to move said closing body (15), wherein said conveying device (8) is arranged to convey a mask (4), intended to at least partly cover said substrate (5) during said vacuum process, at least between a position outside the processing chamber (1) and a position inside the processing chamber (1). It is advantageous when at least said substrate holder (2) is provided with positioning means (50) to position the substrate holder (2) and the mask (4) relative to each other. The invention further provides a use of such a system.
Abstract:
A method and apparatus wherein a substrate is provided with a Preformatted structure, with structural elements arranged in a matrix, wherein the matrix extends in an X-direction and Y-direction, wherein a processing head is provided, wherein a camera is provided which is connected with the processing head and which comprises at least one series of sensors arranged along a main line, wherein the camera scans the substrate and thereby provides at least one one-dimensional camera signal, wherein, for real-time determining at least the X-position and the Y-position of the structure with respect to the camera, the said main line includes an angle with the X-direction and with the Y-direction, wherein the angle is chosen such that the camera signal contains spatially separated X-position information and Y-position information and that the X-position information and the Y-position information can be separated from the sensor signal with the aid of signal processing.
Abstract:
A method and apparatus for applying a coating on a substrate, wherein, opposite the substrate, at least two expanding thermal plasma (ETP) sources are arranged which provide the substrate with a coating, wherein the substrate is located in a process room in which the pressure is lower than the pressure, prevailing in the ETP sources, of a carrier gas which is introduced into the process room via the sources and which forms the expanding plasma, wherein the coating provided by each source has a layer thickness according to a certain deposition profile, for instance a Gaussian deposition profile, and wherein different process parameters are chosen such that, after the coating process, the addition of the deposition profiles results in a substantially uniform layer thickness of the coating on a relevant part of the substrate. Preferably, the distance between sources producing plasma at the same time is chosen and/or settable such that the expanding plasmas substantially do not influence each other.
Abstract:
A method for treating a surface of at least one substrate, wherein the at least one substrate is placed in a process chamber, wherein the pressure in the process chamber is relatively low, wherein a plasma is generated by at least one plasma source, wherein, during the treatment, at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is moved relative to the substrate surface. The invention further provides an apparatus for treating a surface of at least one substrate, wherein the apparatus is provided with a process chamber and at least one plasma source, wherein the at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is movably arranged.
Abstract:
A method and apparatus for at least partly covering at least one electronic component with compound, the apparatus being provided with a first mold half and a second mold half, the first mold half being moveable relative to the second mold half, while means are provided for placing an electronic component on a mold half for inclusion of this component in a mold cavity defined by the two mold halves, the first mold half being provided with a number of actuators with the aid of which the position of the first mold half relative to the second mold half is continuously and accurately regulable, while the distance between the two mold halves is continuously regulated and, if desired, adjusted during the two mold halves being moved towards each other and during their being held in a position when moved towards each other.