System and method for a biosensor integrated in a vehicle

    公开(公告)号:US10238346B2

    公开(公告)日:2019-03-26

    申请号:US15811479

    申请日:2017-11-13

    Abstract: A vehicle includes one or more integrated biosensors, such as finger sensors or other user touchpoints. The integrated biosensors are configured to obtain biosensor data, such as a patient's vitals or concentrations of substances in the blood flow of a user. A control module of a vehicle receives the biosensor data and controls operation of one or more systems of the vehicle in response to the biosensor data. The control module may also present the biosensor data on a display of the vehicle and receive user commands to control the biosensors. The control module may also generate warnings for display in response to the biosensor data exceeding one or more predetermined thresholds.

    MODULAR MOTHERBOARD FOR A COMPUTER SYSTEM AND METHOD THEREOF

    公开(公告)号:US20190045634A1

    公开(公告)日:2019-02-07

    申请号:US16057580

    申请日:2018-08-07

    Abstract: One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.

    Non-volatile dual in-line memory module (NVDIMM) multichip package

    公开(公告)号:US10199364B2

    公开(公告)日:2019-02-05

    申请号:US15600690

    申请日:2017-05-19

    Abstract: A single multichip package is provided, comprising: a substrate having opposing upper and lower surfaces. A first die is mounted on the upper surface of the substrate and includes one or more non-volatile memory devices. A second die is mounted on the upper surface of the substrate, and includes at least one of: (a) a non-volatile memory controller that facilitates transfer of data to/from the one or more non-volatile memory devices, (b) a register clock driver for volatile memory devices, and/or (c) one or more multiplexer switches configured to switch between two or more of the volatile memory devices. A plurality of wire bonds connect the first and second dies. A plurality of solder balls are located on the lower surface of the substrate for mounting the single multichip package to a printed circuit board, the plurality of solder balls electrically coupled to the first die and the second die.

    USING A HEATING ELEMENT TO MANAGE ENERGY STORAGE CELL EQUIVALENT SERIES RESISTANCE (ESR)

    公开(公告)号:US20180145374A1

    公开(公告)日:2018-05-24

    申请号:US15820363

    申请日:2017-11-21

    Abstract: An apparatus and method of keeping an energy storage cell at or above a target temperature, includes receiving at a processing circuit, an analog voltage that is proportional to a temperature of the energy storage cell, converting, at the processing circuit, the analog voltage to a pulse-width-modulated signal having a duty cycle that is proportional to the analog voltage, and driving a switch, with the pulse-width-modulated signal, between conductive and non-conductive states to modulate a voltage passing across (or a current flowing through) a heating element in series with the switch, the heating element being in thermal communication with the energy storage cell, wherein the duty cycle of the pulse-width-modulated signal is adjusted to maintain the temperature of the energy storage cell at or above the target temperature.

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