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    SERIES AND PARALLEL HYBRID SWITCHED CAPACITOR NETWORKS FOR IC POWER DELIVERY
    63.
    发明申请
    SERIES AND PARALLEL HYBRID SWITCHED CAPACITOR NETWORKS FOR IC POWER DELIVERY 有权
    系列和并联混合开关电容网络用于IC电源交付

    公开(公告)号：US20140159681A1

    公开(公告)日：2014-06-12

    申请号：US14180166

    申请日：2014-02-13

    Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

    Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

    IPC: H02M3/07

    CPC classification number: H02M3/07 ,  H02J1/102 ,  H02J9/005 ,  H02M2001/008 ,  Y10T307/406

    Abstract: Series switches for power delivery. A regulator operated as a current source is arranged in parallel with a switched capacitor divider. A switched capacitor divider is configured in series with a plurality of linear regulators with each regulating one of a plurality of voltage outputs from the switched capacitor divider. In another embodiment, a series switch bridge has a first pair of switches connected in series with a second pair of switches across a voltage input, each switch within a pair of switches is switched in-phase with the other while the first pair of switches is switched out of phase with the second pair of switches. A balancing capacitor is coupled across one switch in both the first and second pair to be in parallel when either of the pair of switches is closed to reduce a charge imbalance between the switches.

    Abstract translation: 串联交换机供电。 作为电流源工作的调节器与开关电容分压器并联布置。 开关电容器分配器与多个线性调节器串联配置，每个线性调节器调节来自开关电容器分压器的多个电压输出中的一个。 在另一个实施例中，串联开关桥具有跨越电压输入与第二对开关串联连接的第一对开关，一对开关内的每个开关与另一个开关同相切换，而第一对开关为 与第二对开关切换异相。 平衡电容器耦合在第一对和第二对中的一个开关上，以在两对开关中的任一个闭合时并联，以减少开关之间的电荷不平衡。

    INTEGRATED VOLTAGE REGULATORS WITH MAGNETICALLY ENHANCED INDUCTORS
    64.
    发明申请
    INTEGRATED VOLTAGE REGULATORS WITH MAGNETICALLY ENHANCED INDUCTORS 有权
    集成电压调节器与磁性增强型电感器

    公开(公告)号：US20140092574A1

    公开(公告)日：2014-04-03

    申请号：US13631092

    申请日：2012-09-28

    Applicant: Uwe ZILLMANN ,  Andre SCHAEFER ,  Ruchir SARASWAT ,  Telesphor KAMGAING ,  Paul B. FISCHER ,  Guido DROEGE

    Inventor： Uwe ZILLMANN ,  Andre SCHAEFER ,  Ruchir SARASWAT ,  Telesphor KAMGAING ,  Paul B. FISCHER ,  Guido DROEGE

    IPC: H05K7/02 ,  H05K3/30

    CPC classification number: G06F1/3296 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/165 ,  Y02D10/172 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to carry an electrical current proximate to a magnetic layer disposed on a substrate through which the TSV passes. In certain magnetically enhanced inductor embodiments, a TSV fill metal is disposed within a magnetic material lining the TSV. In certain magnetically enhanced inductor embodiments, a magnetically enhanced inductor includes a plurality of interconnected TSVs disposed proximate to a magnetic material layer on a side of a substrate. In embodiments, voltage regulation circuitry disposed on a first side of a substrate is integrated with one or more magnetically enhanced inductors utilizing a TSV passing through the substrate. In further embodiments, integrated circuitry on a same substrate as the magnetically enhanced inductor, or on another substrate stacked thereon, completes the VR and/or is powered by the VR circuitry.

    Abstract translation: 在芯片级与微电子器件集成的磁性增强型电感器。 在实施例中，磁增强电感器包括具有填充金属的穿通衬底通孔（TSV），以承载靠近设置在TSV通过的衬底上的磁性层的电流。 在某些磁增强电感器实施例中，TSV填充金属设置在衬在TSV内的磁性材料内。 在某些磁增强电感器实施例中，磁增强电感器包括靠近基板一侧的磁性材料层设置的多个互连TSV。 在实施例中，设置在衬底的第一侧上的电压调节电路与利用穿过衬底的TSV的一个或多个磁增强电感器集成。 在另外的实施例中，在与磁增强电感器相同的衬底上或在其上堆叠的另一衬底上的集成电路完成VR和/或由VR电路供电。

    HYBRID PACKAGE TRANSMISSION LINE CIRCUITS
    65.
    发明申请
    HYBRID PACKAGE TRANSMISSION LINE CIRCUITS 有权
    混合包传输线路电路

    公开(公告)号：US20140001643A1

    公开(公告)日：2014-01-02

    申请号：US13538887

    申请日：2012-06-29

    Applicant: Chung Peng (Jackson) KONG ,  Chang-Tsung FU ,  Telesphor KAMGAING ,  Chan Kim LEE ,  Ping Ping OOI

    Inventor： Chung Peng (Jackson) KONG ,  Chang-Tsung FU ,  Telesphor KAMGAING ,  Chan Kim LEE ,  Ping Ping OOI

    IPC: H01L23/498

    CPC classification number: H01L23/5226 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/528 ,  H01L2224/16

    Abstract: “Hybrid” transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.

    Abstract translation: 描述了采用多个互连级别以跨越封装长度传播或返回单条信号线的“混合”传输线路电路。 在封装传输线路电路实施例中，信号线在电耦合在一起的两个不同的互连级别中使用共同定位的迹线。 在另外的实施例中，参考平面被提供在至少一个共定位轨迹的上方，下方或共面上。 在实施例中，平衡信号线对包括作为传播信号线的两个相邻互连级别中的第一和第二同位置迹线，以及在两个相邻互连级别中的第三和第四同位序列作为具有接地平面Co 平面，和/或上方和/或下方两个相邻互连层。

    Series and parallel hybrid switched capacitor networks for IC power delivery
    66.
    发明授权
    Series and parallel hybrid switched capacitor networks for IC power delivery 有权
    串联和并联混合开关电容网络用于IC功率输送

    公开(公告)号：US08330436B2

    公开(公告)日：2012-12-11

    申请号：US12165492

    申请日：2008-06-30

    Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

    Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

    IPC: G05F1/00

    CPC classification number: H02M3/07 ,  H02J1/102 ,  H02J9/005 ,  H02M2001/008 ,  Y10T307/406

    Abstract: Series switches for power delivery. A regulator operated as a current source is arranged in parallel with a switched capacitor divider. A switched capacitor divider is configured in series with a plurality of linear regulators with each regulating one of a plurality of voltage outputs from the switched capacitor divider. In another embodiment, a series switch bridge has a first pair of switches connected in series with a second pair of switches across a voltage input, each switch within a pair of switches is switched in-phase with the other while the first pair of switches is switched out of phase with the second pair of switches. A balancing capacitor is coupled across one switch in both the first and second pair to be in parallel when either of the pair of switches is closed to reduce a charge imbalance between the switches.

    Abstract translation: 串联交换机供电。 作为电流源工作的调节器与开关电容分压器并联布置。 开关电容器分配器与多个线性调节器串联配置，每个线性调节器调节来自开关电容器分压器的多个电压输出中的一个。 在另一个实施例中，串联开关桥具有跨越电压输入与第二对开关串联连接的第一对开关，一对开关内的每个开关与另一个开关同相切换，而第一对开关为 与第二对开关切换异相。 平衡电容器耦合在第一对和第二对中的一个开关上，以在两对开关中的任一个闭合时并联，以减少开关之间的电荷不平衡。

    Package-based filtering and matching solutions
    67.
    发明授权
    Package-based filtering and matching solutions 有权
    基于包的过滤和匹配解决方案

    公开(公告)号：US08111521B2

    公开(公告)日：2012-02-07

    申请号：US11835960

    申请日：2007-08-08

    Applicant: Telesphor Kamgaing ,  Emile Davies-Venn

    Inventor： Telesphor Kamgaing ,  Emile Davies-Venn

    IPC: H05K7/00

    CPC classification number: H01P1/212 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/48095 ,  H01L2224/48225 ,  H01L2224/48237 ,  H01L2224/49113 ,  H01L2924/181 ,  H01L2924/00012

    Abstract: A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A harmonic rejection filter may comprise a metal-insulator-metal (MIM) capacitor serially coupled between bond pads disposed on a RF amplifier circuit die, a first wire bond coupling a first bond pad to a package output, where the first bond pad is coupled to the output of the RF amplifier, and a second wire bond coupling a second bond pad to a package ground. The harmonic rejection filter may be appropriately configured to filter one or more harmonics at different frequencies.

    Abstract translation: 公开了一种具有射频（RF）放大器电路并且并入谐波抑制滤波器和整体形成在封装中的匹配电路的微电子封装。 谐波抑制滤波器可以包括串联连接在RF放大器电路管芯上的接合焊盘之间的金属 - 绝缘体 - 金属（MIM）电容器，将第一接合焊盘耦合到封装输出端的第一引线键合，其中第一接合焊盘耦合 到RF放大器的输出，以及将第二接合焊盘耦合到封装地的第二引线接合。 谐波抑制滤波器可以被适当地配置为滤波不同频率的一个或多个谐波。

    SERIES AND PARALLEL HYBRID SWITCHED CAPACITOR NETWORKS FOR IC POWER DELIVERY
    68.
    发明申请
    SERIES AND PARALLEL HYBRID SWITCHED CAPACITOR NETWORKS FOR IC POWER DELIVERY 有权
    用于IC电源的系列和并联混合开关电容网络

    公开(公告)号：US20090322304A1

    公开(公告)日：2009-12-31

    申请号：US12165492

    申请日：2008-06-30

    Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

    Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

    IPC: G05F3/02

    CPC classification number: H02M3/07 ,  H02J1/102 ,  H02J9/005 ,  H02M2001/008 ,  Y10T307/406

    Abstract: Series switches for power delivery. A regulator operated as a current source is arranged in parallel with a switched capacitor divider. A switched capacitor divider is configured in series with a plurality of linear regulators with each regulating one of a plurality of voltage outputs from the switched capacitor divider. In another embodiment, a series switch bridge has a first pair of switches connected in series with a second pair of switches across a voltage input, each switch within a pair of switches is switched in-phase with the other while the first pair of switches is switched out of phase with the second pair of switches. A balancing capacitor is coupled across one switch in both the first and second pair to be in parallel when either of the pair of switches is closed to reduce a charge imbalance between the switches.

    Abstract translation: 串联交换机供电。 作为电流源工作的调节器与开关电容分压器并联布置。 开关电容器分配器与多个线性调节器串联配置，每个线性调节器调节来自开关电容器分压器的多个电压输出中的一个。 在另一个实施例中，串联开关桥具有跨越电压输入与第二对开关串联连接的第一对开关，一对开关内的每个开关与另一个开关同相切换，而第一对开关为 与第二对开关切换异相。 平衡电容器耦合在第一对和第二对中的一个开关上，以在两对开关中的任一个闭合时并联，以减少开关之间的电荷不平衡。

    Multiband antenna array using electromagnetic bandgap structures
    70.
    发明申请
    Multiband antenna array using electromagnetic bandgap structures 有权
    多频带天线阵列使用电磁带隙结构

    公开(公告)号：US20070285336A1

    公开(公告)日：2007-12-13

    申请号：US11449915

    申请日：2006-06-09

    Applicant: Telesphor Kamgaing

    Inventor： Telesphor Kamgaing

    IPC: H01Q1/36 ,  H01Q15/24

    CPC classification number: H01Q1/2258 ,  H01Q1/241 ,  H01Q15/008

    Abstract: In some embodiments, a multiband antenna array using electromagnetic bandgap structures is presented. In this regard, an antenna array is introduced having two or more planar antennas situated substantially on a surface of a substrate, a first set of electromagnetic bandgap (EBG) cells situated substantially between and on plane with the antennas, and a second set of EBG cells situated within the substrate below the antennas. Other embodiments are also disclosed and claimed.

    Abstract translation: 在一些实施例中，提出了使用电磁带隙结构的多频带天线阵列。 在这方面，引入天线阵列，其具有基本上位于衬底的表面上的两个或更多个平面天线，基本上位于天线之间并且与天线平面上的第一组电磁带隙（EBG）单元，以及第二组EBG 位于天线下方的基板内的单元。 还公开并要求保护其他实施例。

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