公开(公告)号：US20230207492A1

公开(公告)日：2023-06-29

申请号：US17561559

申请日：2021-12-23

Applicant: Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Veronica STRONG ,  Brandon RAWLINGS ,  Robert MONGRAIN ,  Beomseok CHOI

Inventor： Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Veronica STRONG ,  Brandon RAWLINGS ,  Robert MONGRAIN ,  Beomseok CHOI

IPC: H01L23/64 ,  H01F27/40 ,  H01L23/15 ,  H01L23/498

CPC classification number: H01L23/645 ,  H01F27/40 ,  H01L23/15 ,  H01L23/49827

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through a thickness of the substrate, and a first layer is over sidewalls of the via opening. In an embodiment, the first layer comprises a magnetic material. In an embodiment, a second layer is over the first layer, where the second layer is an insulator. In an embodiment, a third layer fills the via opening, where the third layer is a conductor.

公开(公告)号：US20230207439A1

公开(公告)日：2023-06-29

申请号：US17561533

申请日：2021-12-23

Applicant: Adel A. ELSHERBINI ,  Telesphor KAMGAING

Inventor： Adel A. ELSHERBINI ,  Telesphor KAMGAING

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/15 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L23/15 ,  H01L23/5381 ,  H01L23/5385 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L2224/1703 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/3511

Abstract: Embodiments disclosed herein include die modules, electronic packages, and electronic systems. In an embodiment, a die module comprises a substrate, where the substrate comprises glass. In an embodiment, a blind cavity is formed into the substrate. In an embodiment, a first die is in the blind cavity, a second die is over the substrate, and a third die is over the substrate and adjacent to the second die.

公开(公告)号：US20190207287A1

公开(公告)日：2019-07-04

申请号：US15859482

申请日：2017-12-30

Applicant: Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING

IPC: H01P5/10 ,  H01P3/02

CPC classification number: H01P5/1007 ,  H01P3/026 ,  H01P5/1015 ,  H01P5/107

Abstract: Embodiments include waveguide launchers and connectors (WLCs), and a method of forming a WLC. The WLC has a waveguide connector with a waveguide launcher, a taper, and a slot-line signal converter; and a balun structure on the slot-line signal converter, where the taper is on the slot-line signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The WLC may have the waveguide connector disposed on the package, and a waveguide coupled to waveguide connector. The WLC may include assembly pads and external walls of the waveguide connector electrically coupled to package. The WLC may have the balun structure convert a signal to a slot-line signal, and the waveguide launcher converts the slot-line signal to a closed waveguide mode signal, and emits the closed signal along channel and propagates the closed signal along taper slot to the waveguide coupled to waveguide connector.

公开(公告)号：US20190204508A1

公开(公告)日：2019-07-04

申请号：US15859477

申请日：2017-12-30

Applicant: Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Erich N. EWY ,  Telesphor KAMGAING ,  Johanna M. SWAN

Inventor： Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Erich N. EWY ,  Telesphor KAMGAING ,  Johanna M. SWAN

IPC: G02B6/28 ,  G02B6/38 ,  G02B6/12

CPC classification number: H01P5/107 ,  G05D1/00 ,  H01Q1/32 ,  H04L12/40189 ,  H04L2012/40273 ,  H04W4/38 ,  H04W4/40

Abstract: Embodiments include a sensor node, a method of forming the sensor node, and a vehicle with a communication system that includes sensor nodes. A sensor node includes an interconnect with an input connector, an output connector, and an opening on one or more sidewalls. The sensor node also includes a package with one or more sidewalls, a top surface, and a bottom surface, where at least one of the sidewalls of the package is disposed on the opening of interconnect. The sensor node may have a control circuit on the package, a first millimeter-wave launcher on the package, and a sensor coupled to the control circuit, where the sensor is coupled to the control circuit with an electrical cable. The sensor node may include that at least one of the sidewalls of the package is crimped by the opening and adjacent and co-planar to an inner wall of the interconnect.

公开(公告)号：US08816906B2

公开(公告)日：2014-08-26

申请号：US13101883

申请日：2011-05-05

Applicant: Telesphor Kamgaing ,  Valluri R. Rao ,  Yorgos Palaskas

Inventor： Telesphor Kamgaing ,  Valluri R. Rao ,  Yorgos Palaskas

IPC: H01Q3/00

CPC classification number: H01Q3/30 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15321 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01Q21/065 ,  H01Q23/00 ,  Y10T29/49004 ,  Y10T29/49018

Abstract: An apparatus includes a die with through-silicon vias and radio frequency integrated circuit capabilities and it is vertically integrated with a phased-array antenna substrate. The through-silicon via and a radio frequency integrated circuit is coupled to a plurality of antenna elements disposed on the phased-array antenna substrate where each of the plurality of antenna elements is coupled to the through-silicon vias and radio frequency integrated circuit through a plurality of through-silicon vias. A process of assembling the through-silicon vias and radio frequency integrated circuit to the phased-array antenna substrate includes testing the apparatus.

Abstract translation: 一种装置包括具有通硅通孔和射频集成电路能力的管芯，并且其与相控阵天线基板垂直集成。 穿硅通孔和射频集成电路耦合到布置在相控阵天线基板上的多个天线元件，其中多个天线元件中的每一个天线元件通过一个通孔硅通孔和射频集成电路 多个通硅通孔。 将穿硅通孔和射频集成电路组装到相控阵天线基板的过程包括测试该装置。

公开(公告)号：US20120280380A1

公开(公告)日：2012-11-08

申请号：US13101891

申请日：2011-05-05

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01L25/16 ,  H01P11/00 ,  H01L23/48 ,  H01Q21/08

CPC classification number: H01Q1/1271 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L2223/6677 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32155 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01Q1/2283 ,  H01Q3/26 ,  H01Q21/0087 ,  H01Q21/0093 ,  H01Q21/065 ,  Y10T29/49016 ,  H01L2924/00

Abstract: A glass-based, high-performance 60 GHz/mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces are disposed on the PAA substrate opposite the planar antenna elements and the emitter traces, the cavities, and the planar antenna elements are vertically aligned.

Abstract translation: 基于玻璃的高性能60GHz / mm波天线包括设置在相控阵天线（PAA）衬底中的腔体。 空腔设置在平面天线元件下方。 发射极迹线设置在与平面天线元件相对的PAA衬底上，发射极迹线，空腔和平面天线元件垂直对齐。

公开(公告)号：US20090321876A1

公开(公告)日：2009-12-31

申请号：US12165487

申请日：2008-06-30

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01L29/00 ,  H01L21/60

CPC classification number: H01L23/66 ,  H01L23/50 ,  H01L23/645 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2223/6677 ,  H01L2224/04026 ,  H01L2224/274 ,  H01L2224/32057 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/83191 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01074 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package comprises an integrated radio frequency circuit that may be provided in a semiconductor die. A ground plane may be attached to the semiconductor die. The ground plane is selectively patterned in a direction that is perpendicular to an inductor trace of an inductor of the radio frequency circuit. In some embodiments, the ground plane may be selectively patterned to allow an eddy current in the semiconductor package not to flow in opposite direction of a main current in the inductor. In one example, the ground plane may be a portion of the semiconductor package substrate or a die back metallization of the semiconductor die.

Abstract translation: 半导体封装包括可设置在半导体管芯中的集成射频电路。 接地平面可以附接到半导体管芯。 在垂直于射频电路的电感器的电感迹线的方向上选择性地构图接地平面。 在一些实施例中，接地平面可以被选择性地图案化以允许半导体封装中的涡电流不会沿着与电感器中的主电流相反的方向流动。 在一个示例中，接地平面可以是半导体封装衬底的一部分或半导体管芯的后退金属化。

公开(公告)号：US07262674B2

公开(公告)日：2007-08-28

申请号：US11154078

申请日：2005-06-15

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H03H7/075

CPC classification number: H03H7/0161 ,  H03H7/09 ,  H03H7/1766 ,  H03H7/1775

Abstract: A bandpass filter having a transmission coefficient—frequency spectrum characteristic curve with a notch on each side of the passband is disclosed.

Abstract translation: 公开了一种带通滤波器，其具有在通带的每一侧具有陷波的透射系数 - 频谱特性曲线。

公开(公告)号：US20060284705A1

公开(公告)日：2006-12-21

申请号：US11154078

申请日：2005-06-15

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H03H7/01

CPC classification number: H03H7/0161 ,  H03H7/09 ,  H03H7/1766 ,  H03H7/1775

Abstract: A bandpass filter having a transmission coefficient-frequency spectrum characteristic curve with a notch on each side of the passband is disclosed.

Abstract translation: 公开了一种带通滤波器，其具有在通带的每一侧具有陷波的透射系数 - 频谱特性曲线。

公开(公告)号：US20230207404A1

公开(公告)日：2023-06-29

申请号：US17561570

申请日：2021-12-23

Applicant: Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Veronica STRONG ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Neelam PRABHU GAUNKAR

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Veronica STRONG ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Neelam PRABHU GAUNKAR

IPC: H01L23/15 ,  H01L23/498 ,  H01L23/48 ,  H01L21/48

CPC classification number: H01L23/15 ,  H01L23/49827 ,  H01L23/481 ,  H01L21/486 ,  H05K1/0306

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a via opening is formed through the substrate, where the via opening has an hourglass shaped profile. In an embodiment, a magnetic layer fills the via opening, and a via is through the magnetic layer. In an embodiment, sidewalls of the via are substantially vertical.