Abstract:
가격이 저렴하고 사용이 쉬울 뿐 아니라 영상을 원하는 색으로 정확하게 재현할 수 있는 컬러 보정 장치, 그 컬러 보정 방법 및 그것을 구비한 디스플레이 장치가 개시된다. 디스플레이 장치의 컬러 보정 장치는, 컬러 센서에 의해 측정된 디스플레이 화면의 특성 정보와 컬러 센서에 의해 수행된 컬러 보정 정보 중의 적어도 하나를 저장하는 저장부와; 특성 정보와 컬러 보정 정보 중의 적어도 하나를 사용하여 디스플레이 장치의 컬러를 보정하는 제어부를 포함하는 것을 특징으로 한다.
Abstract:
PURPOSE: A liquid crystal display device and a driving method thereof are provided to extend the lifetime of a liquid crystal by using a field sequential driving method and a sub pixel control method. CONSTITUTION: A display panel unit(110) has a plurality of pixels composed of a plurality of sub pixels. The panel driving unit drives a plurality of sub pixels. A backlight unit(130) radiates light with different colors to the display panel unit. A backlight driving unit(140) successively drives the backlight unit according to a field comprising a frame and provides light with a color corresponding to each field. A control unit controls the panel driving unit to express the color of a corresponding frame by selectively using a part of sub pixels comprising the corresponding frame.
Abstract:
PURPOSE: A liquid crystal display apparatus, a liquid crystal driving apparatus, and driving method of liquid crystal display apparatus are provided to efficiently remove an after image by reducing stress to a liquid crystal. CONSTITUTION: A panel portion comprises at least one pixel group. The pixel group is composed of a plurality of pixels. A controller(200) inserts data into a part of pixels. The controller inserts gray data into the pixels in predetermined order pattern.
Abstract:
PURPOSE: A semiconductor package and a method of fabricating the same are provided to prevent unnecessary short circuit by installing an insulating layer in lower part of a wire connecting a ball land which is separated from a connecting terminal. CONSTITUTION: A semiconductor chip(11) is mounted on a base substrate(1) and a bonding pad. A first ball land(5a) is arranged on the base substrate and is electrically connected to a first connecting terminal.
Abstract:
PURPOSE: A data communication method of a wireless device and a system using the same are provided to secure reliability of the system by preventing the hacking of the key, the encryption information, and the decoding information. CONSTITUTION: A key generator(202) generates a character key including at least one encryption key and the encryption information. A controller(203) stores a character key in a memory(205). A display unit(204) displays the generated character key. The character key displayed in the display unit is inputted through an input unit(104). A controller(102) decodes the character key. The controller encrypts the data using at least one encryption key and the encryption information. A wireless transmitter(103) transmits the encrypted data to the display unit. A wireless receiver(201) receives the encrypted data. The controller decodes the encrypted data. The display unit displays the image including the transmitted encrypted data.
Abstract:
측면패드의 위치를 적절하게 확보할 수 있는 칩, 그 제조방법 및 이를 이용한 패키지를 제공한다. 그 칩 및 방법은 측벽에 노출되고, 측벽의 상하 방향으로 서로 분리된 복수개의 도전성 패턴으로 이루어진 측면패드 및 측면패드의 상하에 위치하여 측면패드의 위치를 조절할 수 있는 딤플을 포함한다. 그 패키지는 측면패드와 회로기판을 전기적으로 연결하는 제2 접속단자를 포함한다. 상기 칩은 회로기판에 대한 수평 또는 수직방향으로 확장되어 연결될 수 있으며, 전기적인 접속단자를 게재하여 회로기판에 부착될 수 있다. 패키지, 딤플, 측면패드, 접속단자.
Abstract:
A chip having side pads is provided to adjust the height of conductive patterns by including dimples capable of adjusting the height of the conductive patterns separated from a sidewall, remove the necessity of a separate photolithography process by forming the dimples as forming an electric structure in the chip. A package using the chip is provided to reduce the thickness of a single or layered package by directly layering the chip on the package and make the package small by connecting the chips in parallel using the side pads and the dimples. A chip(100) includes side pads(120), which are exposed to a sidewall and are comprised of a plurality of conductive patterns(120a, 120b) separated from one another in a vertical direction, and dimples(170) which are respectively located a upper surface and lower surface of the side pads to adjust the locations of the side pads.
Abstract:
A chip having a side pad, a manufacturing method thereof, and a package using the same are provided to reduce the size of a package by mounting the package on a printed circuit board directly. A chip(100) includes a side pad(120) which is exposed to the sidewall and composed of a plurality of conductive patterns(120a,120b) separated in the vertical direction of the sidewall. The sidewall is composed of one or more side pads. The side pad includes a first side pad having an insulating layer arranged between the conductive patterns, and a second side pad having a conductive buried pattern buried between the conductive patterns. The number of conductive patterns is determined by the shape of the side pad.
Abstract:
A method for crystallizing a semiconductor layer is provided to suppress film penetration due to flow of a liquid semiconductor layer by blocking the flow of the liquid semiconductor layer molten by laser beam irradiation. A semiconductor layer is formed on a substrate(S10), and then a surface layer is formed on the semiconductor layer through a plasma enhanced chemical vapor deposition method using a source gas comprising at least one selected from a nitrogen gas, an oxygen gas, and a nitrous oxide gas(S20). The semiconductor layer and the surface layer are crystallized through lateral solidification having orientation(S30). The semiconductor layer is made of amorphous silicon, and the surface layer is made of any one selected from the group consisting of a silicon nitride layer, a silicon oxide layer and a silicon nitride oxide layer.