Abstract:
PURPOSE: A semiconductor package and a display panel assembly including the same are provided to protect a circuit from external impacts, moisture, and chemical materials by forming a protection layer which covers a wiring circuit in an opposite direction to a semiconductor chip around a film. CONSTITUTION: A semiconductor chip(100) is received in a hole between films(300). A passivation layer(750) protects a semiconductor chip from the outside. A metal pad(800) electrically connects the semiconductor chip to the substrate. A molding member(200) covers the semiconductor chip, the metal pad, and the passivation layer. A protection layer(700) is opposite to the semiconductor chip around the film.
Abstract:
PURPOSE: A solar cell module and a manufacturing method thereof are provided to thinly manufacture the solar cell module by forming a transparency electrode wire on a transparent substrate without a separate printed circuit board. CONSTITUTION: A transparency electrode wire(200) is formed on a transparent substrate(100). A plurality of solar cells(300) is formed on the transparent electrode wire. A protrusion unit(310) is formed on one side of the plurality of solar cells. A transparent resin(400) is included as a shape surrounding the plurality of solar cells and the transparency electrode wire. The transparent resin protects the solar cell and the transparency electrode wire from an external shock. A concave unit is formed on the position corresponding to the protrusion unit. An anisotropic film is placed between the transparency electrode wire and the protrusion unit.
Abstract:
A display drive integrated circuit chip is provided which has minimized output difference and subsequently improved image quality of a display pane, and which also has reduced length difference between longer and shorter sides and subsequently improved productivity. A display drive integrated circuit chip comprises: driving cells(112) arranged in two lines inside a center portion of the display drive integrated circuit chip(110); a plurality of bonding pads(114) arranged on an active plane of the display drive integrated circuit chip, and adjacent to upper and lower sides, which are longer sides of the display drive integrated circuit chip, and to lateral sides, which are shorter sides of the display drive integrated circuit chip; and internal lines(113a,113b) arranged inside the display drive integrated circuit chip to electrically connect the driving cells to the bonding pads.
Abstract:
PURPOSE: A solar cell module and a manufacturing method thereof are provided to thinly manufacture the solar cell module by replacing the configuration of a metal terminal formed on one side of a circuit board into a single metal board. CONSTITUTION: A plurality of solar cells(120) is located on one side of a circuit board(110). A metal terminal(112) is formed on one side of the circuit board. A wire(122) electrically interlinks the solar cell and the metal terminal. The wire is composed of copper, nickel, gold, or silver. The circuit board comprises a contact terminal(114) which is exposed to outside. A transparent resin(130) is spread on one portion or entire portion of the circuit board. A transparent panel is arranged on the upper side of the transparent resin. An adhesive layer is placed between the plurality of solar cells and the circuit board.